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STF34NM60N

STMicroelectronics

STF34NM60N by STMicroelectronics

STF34NM60N by STMicroelectronics is an N-channel MOSFET ideal for switching applications, featuring a 600V breakdown voltage and max drain current of 29A. It offers low on-resistance of 0.105Ω and operates up to 150 °C. Perfect for high-efficiency power management solutions.

Median Price

$8.960

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 95 parts In-Stock

1+ parts

$8.960

100+ parts

$3.882

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95

$8.960

$3.882

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Digiode

USA . 4,155 parts In-Stock

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4,155

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Vyrian

USA . 4,037 parts In-Stock

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4,037

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Anansix

USA . 2,514 parts In-Stock

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2,514

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Flip Electronics

USA . 900 parts In-Stock

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900

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Dan-Mar Components

USA . 95 parts In-Stock

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95

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IDEA Electronic Components Group

UK . 598 parts In-Stock

1+ parts

$0.690

100+ parts

-

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$0.621

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-

598

$0.690

-

$0.621

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MKK Technologies

India . 741 parts In-Stock

1+ parts

$1.298

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741

$1.298

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DigiPath Technology Company

USA . 741 parts In-Stock

1+ parts

$1.298

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741

$1.298

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AZTECH Wire

Italy . 893 parts In-Stock

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$10.240

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893

$10.240

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RC Electronics

USA . 15,300 parts In-Stock

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15,300

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A-Z Elektronik GmbH

Germany . 5,099 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Corphita

USA . 4,606 parts In-Stock

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4,606

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Alle Elektronik GmbH

Germany . 4,061 parts In-Stock

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4,061

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Perfect Parts

USA . 1,915 parts In-Stock

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1,915

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Parana Technologies

USA . 1,788 parts In-Stock

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$0.825

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1,788

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$0.825

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Overview

Elevate your projects with the STF34NM60N from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance N-channel power FET is designed for efficient switching applications, ensuring reliability and longevity in demanding environments. With superior voltage handling and robust thermal performance, it empowers engineers to achieve seamless operation in industrial and consumer electronics alike. Experience unmatched quality and efficiency that drive your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction offers excellent durability and environmental resistance, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are often preferred for their higher efficiency and better performance in low-side switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by providing inherent protection against reverse polarity.

Transistor Application: SWITCHING

Optimized for switching applications, making it ideal for power management in various electronic devices.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures reliability in high-voltage applications, offering a robust solution for demanding environments.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, facilitating easier integration into designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, enhancing reliability in demanding applications.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation enhances the efficiency and performance, suitable for high-speed switching applications.

Maximum Pulsed Drain Current (IDM): 116 A

High pulsed drain current capacity makes this FET suitable for current-demanding applications and allows for burst operations.

Avalanche Energy Rating (EAS): 345 mJ

With a substantial avalanche energy rating, this FET can safely handle transient voltage spikes without failure.

Maximum Drain Current (Abs) (ID): 29 A

The maximum drain current specification allows this FET to drive substantial loads, making it versatile for various uses.

No. of Terminals: 3

Having three terminals simplifies circuit design while maintaining necessary connections for functionality.

Maximum Power Dissipation (Abs): 40 W

A high power dissipation rating ensures the device can handle significant heat, enhancing overall reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount style improves thermal conduction and mechanical stability, ideal for high-performance applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high-speed switching capabilities and better control over device parameters.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures performance in extreme environments, increasing versatility.

Transistor Element Material: SILICON

Silicon technology ensures excellent electrical properties, contributing to the overall effectiveness of the FET.

Maximum Drain Current (ID): 29 A

Reiterated maximum drain current enhances the product's reliability in applications requiring high current handling.

Maximum Drain-Source On Resistance: 0.105 ohm

Low on-resistance minimizes power loss and heat generation during operation, improving efficiency.

Terminal Position: SINGLE

Single terminal positioning aids in compact design implementations, useful for tight spaces.

Case Connection: ISOLATED

An isolated case connection ensures safety and reduces the risk of short circuiting in sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STF34NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

345 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

29 A

Maximum Drain Current (ID):

29 A

Maximum Drain-Source On Resistance:

.105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

116 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF34NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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