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STF2NK60Z

STMicroelectronics

STF2NK60Z by STMicroelectronics

STF2NK60Z by STMicroelectronics is an N-channel FET designed for switching applications, featuring a 600V breakdown voltage and a max drain current of 1.4A. It operates in enhancement mode with a power dissipation of up to 20W. Ideal for high-voltage circuits, it ensures reliable performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,026 parts In-Stock

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3,026

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Anansix

USA . 2,419 parts In-Stock

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Vyrian

USA . 2,248 parts In-Stock

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IDEA Electronic Components Group

UK . 2,188 parts In-Stock

1+ parts

$1.775

100+ parts

-

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$1.597

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2,188

$1.775

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$1.597

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MKK Technologies

India . 1,953 parts In-Stock

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$3.337

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$3.337

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DigiPath Technology Company

USA . 1,953 parts In-Stock

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$3.337

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1,953

$3.337

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AZTECH Wire

Italy . 84 parts In-Stock

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$16.510

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84

$16.510

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Component Stockers USA

USA . 434 parts In-Stock

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$99.990

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434

$99.990

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Corphita

USA . 4,898 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,392 parts In-Stock

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Perfect Parts

USA . 1,764 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,512 parts In-Stock

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Parana Technologies

USA . 1,465 parts In-Stock

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$2.122

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$2.122

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Kepictronics

USA . 205 parts In-Stock

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Overview

Unlock the power of efficiency with the STF2NK60Z from STMicroelectronics—your go-to N-channel Power FET for reliable switching applications. Renowned for their quality and innovation, STMicroelectronics delivers exceptional performance, ensuring longevity and stability in demanding environments. With a robust design and impressive breakdown voltage, this transistor enhances your projects while simplifying circuit layouts. Elevate your applications with proven technology that maximizes value and reliability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides excellent thermal performance, making the FET suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel characteristics generally offer better efficiency and higher electron mobility, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

A built-in diode allows for easy integration and improved performance in applications requiring reverse polarity handling.

Transistor Application: SWITCHING

Optimized for switching applications, this FET provides fast response times and high efficiency in electronic circuits.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET is suitable for high-voltage applications, ensuring reliability under extreme conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCB designs, facilitating better layout and integration.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, making this FET ideal for applications where stability is crucial.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control over the conduction states, making the FET efficient for low-power applications.

Maximum Pulsed Drain Current (IDM): 5.6 A

A high pulsed drain current rating allows this FET to handle transient loads effectively, adding to its versatility.

Avalanche Energy Rating (EAS): 90 mJ

With a significant avalanche energy rating, this FET can withstand energy spikes, enhancing the reliability of your application.

Maximum Drain Current (Abs) (ID): 1.4 A

A maximum current rating of 1.4 A makes this FET suitable for moderate power applications, enabling efficiency.

No. of Terminals: 3

A simple three-terminal configuration provides ease of use and straightforward integration into various circuit designs.

Maximum Power Dissipation (Abs): 20 W

This FET can dissipate considerable power, ensuring reliability during high-load operations.

Package Style (Meter): FLANGE MOUNT

Flange mount style offers better heat dissipation and stability, ideal for high-performance applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high-speed operation and low power consumption, making this FET suitable for high-efficiency designs.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures this FET can perform reliably in extreme thermal conditions.

Transistor Element Material: SILICON

Silicon-based construction enables good performance characteristics and stability, commonly used in many applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and ensures reliable connections, preventing corrosion over time.

Maximum Drain Current (ID): 1.4 A

The FET can provide consistent performance under loads, making it suitable for multiple applications.

Maximum Drain-Source On Resistance: 8 ohm

A low on-resistance means less energy loss during operation, increasing overall efficiency in power applications.

Terminal Position: SINGLE

The single terminal position simplifies the layout and design process, making integration into circuits straightforward.

Case Connection: ISOLATED

An isolated case connection improves safety by reducing the risk of electrical shorts, ensuring consistent performance.

Technical Specifications

Power Field Effect Transistors (FET) STF2NK60Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

90 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

1.4 A

Maximum Drain Current (ID):

1.4 A

Maximum Drain-Source On Resistance:

8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

5.6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF2NK60Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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