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STF24NM65N

STMicroelectronics

STF24NM65N by STMicroelectronics

STF24NM65N by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 650V breakdown voltage, 76A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,077 parts In-Stock

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5,077

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Anansix

USA . 2,156 parts In-Stock

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2,156

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Digiode

USA . 1,901 parts In-Stock

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1,901

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 674 parts In-Stock

1+ parts

$0.857

100+ parts

-

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$0.771

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674

$0.857

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$0.771

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MKK Technologies

India . 2,370 parts In-Stock

1+ parts

$1.611

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2,370

$1.611

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DigiPath Technology Company

USA . 2,370 parts In-Stock

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$1.611

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2,370

$1.611

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AZTECH Wire

Italy . 873 parts In-Stock

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$15.860

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873

$15.860

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A-Z Elektronik GmbH

Germany . 6,627 parts In-Stock

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6,627

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,123 parts In-Stock

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Corphita

USA . 2,030 parts In-Stock

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Parana Technologies

USA . 1,643 parts In-Stock

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$1.024

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$1.024

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Kepictronics

USA . 782 parts In-Stock

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Perfect Parts

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ChipstoGo Electronic ltd

UK . 43 parts In-Stock

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Overview

Elevate your projects with the STF24NM65N from STMicroelectronics, a power FET that promises unmatched reliability and performance. Known for its superior quality and robust design, STMicroelectronics delivers cutting-edge technology ideal for diverse switching applications. Enjoy enhanced efficiency, reduced heat generation, and impressive handling of high voltages, empowering you to create innovative solutions without compromise. Embrace excellence and unleash your creativity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable package that protects the internal components from environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher electron mobility, which provides better performance and efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the functionality of the FET by providing intrinsic protection against reverse current, making it ideal for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control and manage power in a variety of electronic circuits.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage enables this FET to handle high voltage applications without risk of damage, which is crucial for safety and reliability.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, making it easier to integrate into different designs.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust connection options, enhancing reliability in high-vibration environments.

Operating Mode: ENHANCEMENT MODE

In enhancement mode operation, the FET can achieve lower conduction losses, thus improving energy efficiency across diverse applications.

Maximum Pulsed Drain Current (IDM): 76 A

A high maximum pulsed drain current supports short-duration peak loads, making this FET suitable for demanding applications.

Avalanche Energy Rating (EAS): 500 mJ

A significant avalanche energy rating provides the ability to handle energy surges safely, protecting the device and extending its lifespan.

Maximum Drain Current (Abs) (ID): 19 A

The ability to handle a maximum drain current of 19 A makes this FET suitable for high-power applications, ensuring performance stability.

No. of Terminals: 3

Three terminals simplify circuit designs while allowing for effective signal routing and connections.

Maximum Power Dissipation (Abs): 40 W

A high maximum power dissipation rating minimizes the risk of thermal overload, ensuring the device can handle significant power without failure.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides solid mechanical support and easy installation in various electronic devices and systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for higher efficiency and lower power consumption, making this FET ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows this FET to perform well in extreme conditions, ensuring reliability in various environments.

Transistor Element Material: SILICON

Silicon as a base material provides excellent electronic properties, ensuring high performance and durability in power applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances corrosion resistance and solderability, improving overall reliability and ease of assembly.

Maximum Drain Current (ID): 19 A

Reiterating the strong current handling capability, 19 A maximum drain current ensures the transistor can handle demanding loads effectively.

Maximum Drain-Source On Resistance: 0.19 Ohm

A low on-resistance minimizes power losses during operation, leading to improved efficiency and thermal performance.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and ensures straightforward connectivity within various systems.

Case Connection: ISOLATED

Isolated case connections help to prevent interference and improve safety by reducing the risk of accidental short circuits.

Technical Specifications

Power Field Effect Transistors (FET) STF24NM65N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

76 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF24NM65N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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