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STF15NM60N

STMicroelectronics

STF15NM60N by STMicroelectronics

STF15NM60N by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 600V breakdown voltage, 14A max drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,431 parts In-Stock

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7,431

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Digiode

USA . 2,654 parts In-Stock

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2,654

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Anansix

USA . 1,084 parts In-Stock

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1,084

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,100 parts In-Stock

1+ parts

$1.455

100+ parts

-

1k+ parts

$1.310

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2,100

$1.455

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$1.310

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MKK Technologies

India . 312 parts In-Stock

1+ parts

$2.737

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-

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312

$2.737

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DigiPath Technology Company

USA . 312 parts In-Stock

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$2.737

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312

$2.737

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AZTECH Wire

Italy . 901 parts In-Stock

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$18.900

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901

$18.900

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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A-Z Elektronik GmbH

Germany . 4,500 parts In-Stock

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4,500

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Alle Elektronik GmbH

Germany . 3,736 parts In-Stock

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3,736

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RC Electronics

USA . 3,343 parts In-Stock

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3,343

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Corphita

USA . 2,893 parts In-Stock

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2,893

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Parana Technologies

USA . 151 parts In-Stock

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$1.740

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151

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$1.740

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Perfect Parts

USA . 10 parts In-Stock

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10

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Overview

Unlock unparalleled efficiency with the STF15NM60N from STMicroelectronics—a leader in innovative semiconductor solutions. This high-performance FET is designed for optimal switching applications, delivering exceptional reliability and energy savings across diverse sectors. With a robust 600V breakdown voltage and built-in diode, it ensures safety and durability. Experience streamlined operations and reduced costs, making it the perfect choice for your next project. Trust STMicroelectronics for quality that empowers your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for packaging ensures durability and resistance to environmental stresses, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

An N-channel configuration provides higher electron mobility, resulting in enhanced efficiency and speed, making it ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the versatility and reliability of the transistor in switching applications, simplifying circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast switching speeds, which lead to optimized power efficiency in electronic circuits.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage allows for reliable operation in high-voltage applications, making this FET suitable for power management and distribution.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier PCB layout and component placement, aiding in compact circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a strong and stable connection, ideal for applications requiring robust mechanical support.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures that the FET can be turned on progressively and provides better control in switching applications.

Maximum Pulsed Drain Current (IDM): 56 A

A high pulsed current rating allows for handling large transients, making this FET suitable for high-performance applications without risking damage.

Avalanche Energy Rating (EAS): 300 mJ

The ability to withstand avalanche events adds to the reliability and safety of the FET in various applications, protecting against voltage spikes.

Maximum Drain Current (Abs) (ID): 14 A

This maximum drain current rating ensures that the FET can handle significant loads, providing versatility in power applications.

No. of Terminals: 3

A three-terminal configuration simplifies circuit design while offering sufficient control for various applications.

Maximum Power Dissipation (Abs): 30 W

The ability to dissipate up to 30 W of power allows this FET to operate efficiently without overheating, increasing its reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures secure attachment to heatsinks or PCBs, enhancing thermal performance and stability in operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides excellent performance characteristics, facilitating high efficiency and fast switching speeds.

Maximum Operating Temperature: 150 °C

Withstand high operational temperatures, making it suitable for demanding applications without compromising performance.

Transistor Element Material: SILICON

Silicon is a widely used material known for its effectiveness in FET design, ensuring reliability and performance in various environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, enhancing connection reliability over time.

Maximum Drain Current (ID): 14 A

Consistent current handling capabilities make this FET a strong choice for versatile applications needing reliable performance.

Maximum Drain-Source On Resistance: 0.299 ohm

Low on-resistance significantly reduces power losses during operation, improving overall efficiency of the electronic circuit.

Terminal Position: SINGLE

Having a single terminal position simplifies manufacturing and integration into circuits, making it user-friendly.

Case Connection: ISOLATED

Isolated case connection ensures that the FET functions safely without risking unintended short circuits, enhancing overall safety.

Technical Specifications

Power Field Effect Transistors (FET) STF15NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.299 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

56 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF15NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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