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STF13NM50N

STMicroelectronics

STF13NM50N by STMicroelectronics

STF13NM50N by STMicroelectronics is an N-channel MOSFET ideal for switching applications, featuring a 500V breakdown voltage and 12A max drain current. It offers a low on-resistance of 0.32Ω and operates at up to 150 °C. Its robust design ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,575 parts In-Stock

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4,575

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Vyrian

USA . 2,947 parts In-Stock

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Anansix

USA . 1,957 parts In-Stock

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1,957

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Zilex Electronics Inc.

Canada . 5 parts In-Stock

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IDEA Electronic Components Group

UK . 1,951 parts In-Stock

1+ parts

$1.339

100+ parts

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$1.205

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1,951

$1.339

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$1.205

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MKK Technologies

India . 1,997 parts In-Stock

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$2.517

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$2.517

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DigiPath Technology Company

USA . 1,997 parts In-Stock

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$2.517

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1,997

$2.517

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AZTECH Wire

Italy . 323 parts In-Stock

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$19.110

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323

$19.110

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Component Stockers USA

USA . 644 parts In-Stock

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$99.990

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$99.990

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Alle Elektronik GmbH

Germany . 4,905 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 3,654 parts In-Stock

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Parana Technologies

USA . 1,765 parts In-Stock

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$1.600

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Kepictronics

USA . 1,000 parts In-Stock

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Overview

Unlock the power of innovation with the STF13NM50N from STMicroelectronics, a leader in semiconductor technology. This high-performance N-channel Power FET is designed for seamless switching applications, ensuring reliability and efficiency in your projects. With robust specifications that handle intense conditions, it delivers exceptional thermal performance and energy savings. Trust in ST’s commitment to quality and elevate your designs to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protects the internal components, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer higher efficiency and faster switching speeds, which are ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves the device's performance in applications requiring reverse conduction, simplifying design and saving board space.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures efficient operation in modern electronic circuits.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage allows for greater voltage handling capabilities, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular shape enhances ease of mounting and layout in printed circuit boards (PCBs), facilitating better thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and are ideal for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low power consumption in the off-state, improving overall efficiency.

Maximum Pulsed Drain Current (IDM): 48 A

A high pulsed drain current rating enables the FET to handle transient loads, making it suitable for power supply circuits.

Avalanche Energy Rating (EAS): 200 mJ

The significant avalanche energy rating indicates that the FET can withstand high energy levels in transient conditions.

Maximum Drain Current (Abs) (ID): 12 A

This maximum drain current rating supports a variety of applications while ensuring safe operation.

No. of Terminals: 3

Three terminals simplify the integration of the FET in circuit designs, allowing for straightforward implementation.

Maximum Power Dissipation (Abs): 25 W

With a high maximum power dissipation rating, this FET is capable of handling significant amounts of power without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount design ensures secure installation and efficient heat dissipation, important for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides excellent switching performance and low on-state resistance, enhancing device efficiency.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows the FET to function effectively in demanding thermal environments.

Transistor Element Material: SILICON

Silicon components provide a good balance of performance, cost, and thermal stability, making them reliable choices.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, increasing reliability in electronic connections.

Maximum Drain Current (ID): 12 A

Reiterated maximum drain current ensures that this FET can handle typical applications where current control is crucial.

Maximum Drain-Source On Resistance: 0.32 ohm

Low on-resistance enhances efficiency by reducing power losses during operation, making it a cost-effective choice for power circuits.

Terminal Position: SINGLE

Single terminal position allows for easier layout design in a compact space while providing sufficient connectivity.

Case Connection: ISOLATED

Isolated case connection ensures safety in applications by preventing unintended electrical paths, critical for high-voltage designs.

Technical Specifications

Power Field Effect Transistors (FET) STF13NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.32 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

48 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF13NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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