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STF11N52K3

STMicroelectronics

STF11N52K3 by STMicroelectronics

STF11N52K3 by STMicroelectronics is a N-CHANNEL FET with 525V DS Breakdown Voltage, 40A IDM, and 0.51 ohm RDS(on). Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation. The transistor features a built-in diode and can handle up to 10A drain current.

Median Price

$3.420

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 500 parts In-Stock

1+ parts

$3.420

100+ parts

$1.607

1k+ parts

$1.471

10k+ parts

-

500

$3.420

$1.607

$1.471

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Vyrian

USA . 11,656 parts In-Stock

1+ parts

-

100+ parts

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11,656

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ComSIT Distribution GmbH

Germany . 3,408 parts In-Stock

1+ parts

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3,408

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Digiode

USA . 3,306 parts In-Stock

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3,306

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Anansix

USA . 2,803 parts In-Stock

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2,803

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Dan-Mar Components

USA . 500 parts In-Stock

1+ parts

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,589 parts In-Stock

1+ parts

$1.668

100+ parts

-

1k+ parts

$1.501

10k+ parts

-

1,589

$1.668

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$1.501

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MKK Technologies

India . 2,236 parts In-Stock

1+ parts

$3.136

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2,236

$3.136

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DigiPath Technology Company

USA . 2,236 parts In-Stock

1+ parts

$3.136

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2,236

$3.136

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AZTECH Wire

Italy . 1,097 parts In-Stock

1+ parts

$11.930

100+ parts

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1,097

$11.930

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,325 parts In-Stock

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4,325

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Alle Elektronik GmbH

Germany . 4,134 parts In-Stock

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4,134

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Perfect Parts

USA . 1,092 parts In-Stock

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1,092

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Parana Technologies

USA . 136 parts In-Stock

1+ parts

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$1.994

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136

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$1.994

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Overview

Unleash the power of the STF11N52K3 by STMicroelectronics, a top-quality Power Field Effect Transistor designed for switching applications. With its N-CHANNEL configuration and built-in diode, this transistor offers unparalleled performance and reliability. Perfect for a wide range of electronic devices, this transistor provides a high breakdown voltage of 525V, ensuring safe and efficient operation. Trust in STMicroelectronics' expertise and choose the STF11N52K3 for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body enhances durability and provides resistance to environmental factors, making this product reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their high efficiency and fast switching speed, making this product suitable for applications where quick response times are crucial.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from voltage spikes, improving the overall reliability of the system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high-speed performance and low power consumption, making it ideal for power management systems.

Minimum DS Breakdown Voltage: 525 V

With a high breakdown voltage, this FET can handle high voltages safely, making it suitable for industrial and high-power applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and compact circuit board layout, saving space in applications where real estate is limited.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical connection and are easy to solder, ensuring a secure and reliable connection in various electronic circuits.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide enhanced control over the switching operation, offering better efficiency and performance compared to depletion mode transistors.

Maximum Pulsed Drain Current (IDM): 40 A

With a high pulsed drain current rating, this FET can handle short bursts of high current without damage, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 170 mJ

The high avalanche energy rating indicates the FET's ability to withstand power surges and transient events, ensuring long-term reliability in demanding environments.

No. of Terminals: 3

Having three terminals allows for easy connection to external circuits, providing versatility in design and compatibility with a wide range of applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting and thermal dissipation capabilities, ensuring reliable operation and longevity in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low leakage current, and reliable operation, making this FET suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon-based transistors provide excellent electrical properties, thermal stability, and high reliability, making them a preferred choice for various electronic applications.

Maximum Drain Current (ID): 10 A

With a high maximum drain current rating, this FET can handle continuous current flow without overheating, ensuring stable performance in power management applications.

Maximum Drain-Source On Resistance: 0.51 ohm

The low drain-source on resistance minimizes power loss and heat generation, improving efficiency and reducing operating costs in power switching applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and ensures proper connection in the circuit, allowing for easy integration and maintenance.

Technical Specifications

Power Field Effect Transistors (FET) STF11N52K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

170 mJ

Minimum DS Breakdown Voltage:

525 V

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.51 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

40 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF11N52K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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