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STDLED525

STMicroelectronics

STDLED525 by STMicroelectronics

STDLED525 by STMicroelectronics is a N-CHANNEL FET with 525V DS breakdown voltage, ideal for switching applications. It features 20A max pulsed drain current and 1.5 ohm max drain-source resistance. Operating in enhancement mode, it has a power dissipation of 70W and can withstand temperatures from -55 to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,888 parts In-Stock

1+ parts

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3,888

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Vyrian

USA . 1,063 parts In-Stock

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1,063

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Anansix

USA . 195 parts In-Stock

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195

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 493 parts In-Stock

1+ parts

$0.467

100+ parts

-

1k+ parts

$0.421

10k+ parts

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493

$0.467

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$0.421

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MKK Technologies

India . 2,373 parts In-Stock

1+ parts

$0.879

100+ parts

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2,373

$0.879

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DigiPath Technology Company

USA . 2,373 parts In-Stock

1+ parts

$0.879

100+ parts

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2,373

$0.879

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Corphita

USA . 3,663 parts In-Stock

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3,663

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Parana Technologies

USA . 349 parts In-Stock

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$0.559

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349

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$0.559

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Overview

Discover the power and reliability of the STDLED525 by STMicroelectronics. As a leader in Power Field Effect Transistors, STMicroelectronics delivers cutting-edge technology and unmatched quality. This N-CHANNEL transistor with a built-in diode is perfect for switching applications. With a minimum DS Breakdown Voltage of 525V and a maximum Pulsed Drain Current of 20A, this transistor offers exceptional performance and durability. Trust STMicroelectronics to provide you with the best solutions for your power needs. Choose the STDLED525 for superior quality and unmatched value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high performance and efficiency in switching applications, making this product an ideal choice for such uses.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in the single configuration simplifies circuit design and enhances overall efficiency in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides reliable and efficient performance in controlling electrical currents.

Surface Mount: YES

The surface mount capability makes installation and integration of this FET into circuit boards easy and convenient.

Minimum DS Breakdown Voltage: 525 V

With a high minimum breakdown voltage, this FET can handle high voltage applications without the risk of damage or malfunction.

Maximum Pulsed Drain Current (IDM): 20 A

The high maximum pulsed drain current rating allows this FET to handle sudden surges in current without affecting its performance.

Avalanche Energy Rating (EAS): 100 mJ

The high avalanche energy rating indicates the FET's ability to withstand energy spikes and transient voltage events, ensuring reliable operation in various conditions.

Maximum Power Dissipation (Abs): 70 W

With a maximum power dissipation of 70W, this FET can efficiently handle power in high-load applications without overheating or failing.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this FET to function reliably in high-temperature environments without compromising its performance.

Maximum Drain Current (ID): 5 A

The maximum drain current rating of 5A indicates the FET's capability to handle high current loads, making it suitable for various power applications.

Maximum Drain-Source On Resistance: 1.5 ohm

With a low drain-source on resistance, this FET provides efficient conduction and minimal power loss, ensuring high performance in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) STDLED525 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

525 V

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

1.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STDLED525 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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