Loading...

STD888

STMicroelectronics

STD888 by STMicroelectronics

STD888 by STMicroelectronics is a PNP power BJT designed for switching applications. It features a max power dissipation of 15W, operates up to 150 °C, and supports collector-emitter voltages of 30V. Ideal for compact electronic designs with surface mount capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,053

-

-

-

-

Vyrian

USA . 1,429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,429

-

-

-

-

Digiode

USA . 93 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

93

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,036 parts In-Stock

1+ parts

$1.479

100+ parts

-

1k+ parts

$1.331

10k+ parts

-

2,036

$1.479

-

$1.331

-

MKK Technologies

India . 2,369 parts In-Stock

1+ parts

$2.782

100+ parts

-

1k+ parts

-

10k+ parts

-

2,369

$2.782

-

-

-

DigiPath Technology Company

USA . 2,369 parts In-Stock

1+ parts

$2.782

100+ parts

-

1k+ parts

-

10k+ parts

-

2,369

$2.782

-

-

-

Kepictronics

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

Corphita

USA . 4,509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,509

-

-

-

-

Parana Technologies

USA . 394 parts In-Stock

1+ parts

-

100+ parts

$1.769

1k+ parts

-

10k+ parts

-

394

-

$1.769

-

-

Overview

Unlock the potential of your designs with the STD888 from STMicroelectronics! This high-quality PNP transistor is expertly crafted for seamless switching applications, delivering reliable performance and superior power management. With STMicroelectronics' renowned commitment to innovation and excellence, the STD888 offers exceptional thermal stability and efficiency, making it ideal for various electronics projects. Elevate your product's reliability and efficiency with this indispensable component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight, cost-effective, and durable packaging for reliable performance in various environments.

Polarity or Channel Type: PNP

PNP configuration allows for better control in applications where a low-side switch is required, enhancing versatility in circuit design.

Configuration: SINGLE

A single configuration simplifies the circuit design, making integration easier in compact electronic devices.

Transistor Application: SWITCHING

Optimized for switching applications, this BJT can efficiently manage power and signal transitions, making it ideal for modern electronic systems.

Surface Mount: YES

Surface mount technology facilitates automated assembly and saves space on printed circuit boards, leading to more compact designs.

Package Shape: RECTANGULAR

The rectangular shape improves PCB layout and can enhance thermal performance compared to other shapes.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering and good mechanical strength, ensuring long-term durability in various applications.

No. of Terminals: 2

With only two terminals, the design is straightforward, simplifying the installation and integration process.

Maximum Power Dissipation (Abs): 15 W

A maximum power dissipation of 15 W allows this BJT to handle significant power levels, making it suitable for high-performance applications.

Package Style (Meter): SMALL OUTLINE

The small outline package enables compact designs and is ideal for space-constrained applications.

Minimum DC Current Gain (hFE): 75

With a minimum current gain of 75, this BJT provides good amplification, making it useful in various signal processing applications.

Maximum Operating Temperature: 150 °C

Operating at a maximum temperature of 150 °C ensures reliable performance in high-temperature environments, enhancing the device's longevity.

Maximum Collector-Emitter Voltage: 30 V

A collector-emitter voltage rating of 30 V enables the use of this transistor in low to medium voltage applications, making it versatile.

Transistor Element Material: SILICON

Silicon as the element material ensures high reliability and performance, as it's widely used in semiconductor applications.

Maximum Collector Current (IC): 5 A

With a maximum collector current of 5 A, this transistor is capable of driving substantial loads, perfect for various power applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: SINGLE

The single terminal position simplifies the connection process, enhancing the ease of integration into various circuits.

Technical Specifications

Power Bipolar Junction Transistors (BJT) STD888 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

5 A

Maximum Collector-Emitter Voltage:

30 V

Configuration:

Minimum DC Current Gain (hFE):

75

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD888 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 12