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STD65NF06

STMicroelectronics

STD65NF06 by STMicroelectronics

STD65NF06 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 60 A, a breakdown voltage of 60 V, and operates at up to 175 °C. Ideal for power management in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,810 parts In-Stock

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4,810

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Vyrian

USA . 3,860 parts In-Stock

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3,860

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Anansix

USA . 1,357 parts In-Stock

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1,357

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IDEA Electronic Components Group

UK . 1,731 parts In-Stock

1+ parts

$0.642

100+ parts

-

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$0.578

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1,731

$0.642

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$0.578

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MKK Technologies

India . 1,525 parts In-Stock

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$1.208

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1,525

$1.208

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DigiPath Technology Company

USA . 1,525 parts In-Stock

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$1.208

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1,525

$1.208

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AZTECH Wire

Italy . 410 parts In-Stock

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$8.510

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410

$8.510

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A-Z Elektronik GmbH

Germany . 6,047 parts In-Stock

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6,047

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Corphita

USA . 4,389 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,066 parts In-Stock

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3,066

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Parana Technologies

USA . 1,395 parts In-Stock

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$0.768

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1,395

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$0.768

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Overview

Unlock superior performance with the STD65NF06 from STMicroelectronics, a leader in semiconductor innovation. This robust N-channel power FET excels in efficiency and reliability, making it ideal for switching applications across various industries. With its compact design and high-current capabilities, you can trust it to optimize your systems while reducing energy loss. Choose STMicroelectronics for quality that powers your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides good protection against environmental factors and helps in minimizing costs, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally preferred for their lower resistance and higher efficiency, making this product suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds protection against reverse polarity, making it versatile for various switching applications while simplifying the circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently manage power, making it ideal for use in power management circuits.

Surface Mount: YES

Surface mount technology allows for easy integration into compact circuit designs, providing flexibility for modern electronic devices.

Minimum DS Breakdown Voltage: 60 V

A breakdown voltage of 60V ensures that the transistor can handle higher voltages without failure, enhancing reliability in various operational environments.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout and placement, optimizing space usage in electronic designs.

Terminal Form: GULL WING

The gull wing terminal form aids in easy soldering and improves mechanical stability, which is crucial for reliability in applications subjected to vibration or movement.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower off-state drain leakage currents, which is beneficial for power efficiency in active circuits.

Maximum Pulsed Drain Current (IDM): 240 A

With a high pulsed drain current capability, this FET can handle peak loads effectively, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 390 mJ

A high avalanche energy rating indicates robustness against energy spikes, protecting the device in unpredictable operating conditions.

Maximum Drain Current (Abs) (ID): 60 A

Handling a maximum drain current of 60A allows this FET to be utilized in high-power applications, demonstrating its capability in demanding settings.

No. of Terminals: 2

The simplicity of a 2-terminal design streamlines the circuit layout and reduces complexity, making it easier for engineers to work with.

Maximum Power Dissipation (Abs): 110 W

A power dissipation capability of 110W ensures the FET can manage significant heat, contributing to overall device reliability and performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances space efficiency on PCBs, allowing for more compact and lightweight electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high input impedance and low output capacitance, making this device suitable for fast-switching applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can function in harsh environments, increasing design options for high-temperature applications.

Transistor Element Material: SILICON

Silicon as the element material offers excellent electrical properties, ensuring high performance and reliability in various power applications.

Terminal Finish: MATTE TIN

A matte tin finish provides good solderability and corrosion resistance, ensuring long-lasting connections in circuit assemblies.

Maximum Drain Current (ID): 60 A

The ability to handle a maximum drain current of 60A means this transistor is capable of managing significant power loads, ideal for high-efficiency designs.

Maximum Drain-Source On Resistance: 0.014 ohm

Low on-resistance contributes to higher efficiency and minimizes power loss during operation, enhancing overall system performance.

Terminal Position: SINGLE

The single terminal positioning aids in straightforward layout and connection schemes, simplifying integration into circuit boards.

Case Connection: DRAIN

Connection directly to the drain facilitates effective power management, essential for reliable operation in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) STD65NF06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

390 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD65NF06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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