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STD3NM60T4

STMicroelectronics

STD3NM60T4 by STMicroelectronics

STD3NM60T4 by STMicroelectronics is a single N-channel MOSFET designed for efficient switching applications. It features a 600V breakdown voltage, 12A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in compact electronic devices.

Median Price

$1.078

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 4,925 parts In-Stock

1+ parts

$1.060

100+ parts

-

1k+ parts

$0.760

10k+ parts

$0.620

4,925

$1.060

-

$0.760

$0.620

Martec Srl

Italy . 96,016 parts In-Stock

1+ parts

-

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96,016

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Pegasus Components GmbH

Germany . 10,069 parts In-Stock

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10,069

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Vyrian

USA . 7,811 parts In-Stock

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7,811

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R&J Components

USA . 5,983 parts In-Stock

1+ parts

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5,983

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ComSIT Distribution GmbH

Germany . 5,000 parts In-Stock

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5,000

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Digiode

USA . 3,498 parts In-Stock

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3,498

-

-

-

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Lakeland Logistics Inc

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,500

-

-

-

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Bristol Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$1.097

1k+ parts

$0.965

10k+ parts

-

2,500

-

$1.097

$0.965

-

ACDS - Activité Composants Distribution Service

France . 2,080 parts In-Stock

1+ parts

-

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1k+ parts

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2,080

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-

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Dan-Mar Components

USA . 2,080 parts In-Stock

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2,080

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Anansix

USA . 848 parts In-Stock

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848

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EMSNET

USA . 113 parts In-Stock

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113

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1 parts In-Stock

1+ parts

$0.553

100+ parts

-

1k+ parts

$0.498

10k+ parts

-

1

$0.553

-

$0.498

-

MKK Technologies

India . 1,876 parts In-Stock

1+ parts

$1.040

100+ parts

-

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1,876

$1.040

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DigiPath Technology Company

USA . 1,876 parts In-Stock

1+ parts

$1.040

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1,876

$1.040

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AZTECH Wire

Italy . 1,179 parts In-Stock

1+ parts

$19.560

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1,179

$19.560

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 19,155 parts In-Stock

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19,155

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Alle Elektronik GmbH

Germany . 4,441 parts In-Stock

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4,441

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Corphita

USA . 3,790 parts In-Stock

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3,790

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,259 parts In-Stock

1+ parts

-

100+ parts

$0.661

1k+ parts

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1,259

-

$0.661

-

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Overview

Unlock unparalleled efficiency with the STD3NM60T4 from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers a powerful N-channel FET designed for optimal switching performance in various applications. This robust transistor ensures reliability and longevity, making it perfect for demanding environments. Elevate your designs with enhanced energy management and cost-effectiveness, all while benefiting from ST's industry-leading innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and cost-effectiveness, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors are known for their high-speed performance and are ideal for efficient switching operations.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added functionality, allowing for better protection against back EMF in switching applications.

Transistor Application: SWITCHING

Designed primarily for switching applications, this makes it an excellent choice for power management circuits.

Surface Mount: YES

Surface mount technology allows for compact designs and is easier to automate in assembly processes.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage enables effective operation in high-voltage applications, enhancing design flexibility.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient PCB layout and space utilization.

Terminal Form: GULL WING

Gull wing terminals facilitate better electrical connections and are compatible with automated soldering techniques.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for lower power consumption during operation, which increases overall system efficiency.

Maximum Pulsed Drain Current (IDM): 12 A

This rating indicates strong performance under pulsed conditions, suitable for applications requiring high transient currents.

Avalanche Energy Rating (EAS): 200 mJ

With a high avalanche energy rating, this FET can handle energy spikes, contributing to system protection and reliability.

Maximum Drain Current (Abs) (ID): 3 A

The ability to handle 3 A of drain current under absolute conditions makes it versatile for various load requirements.

No. of Terminals: 2

A simple two-terminal design enhances ease of integration into circuits.

Maximum Power Dissipation (Abs): 50 W

This high power dissipation capability ensures that the FET can operate efficiently without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline form factor allows for space-saving designs in compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology is known for high input impedance and minimal power consumption, making it suitable for battery-powered applications.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures makes this FET ideal for demanding environments and applications.

Transistor Element Material: SILICON

Silicon is the standard material for FETs, ensuring reliability and performance in various electronic applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and corrosion resistance, ensuring a reliable joint.

Maximum Drain Current (ID): 3 A

This duplicated specification reaffirms the transistor's capability of handling significant current, crucial for stability in operation.

Maximum Drain-Source On Resistance: 1.5 ohm

Low on-resistance ensures efficient power conversion and minimal heat generation, enhancing performance in switching applications.

Terminal Position: SINGLE

A single terminal position simplifies installation and integration into electronic circuits.

Technical Specifications

Power Field Effect Transistors (FET) STD3NM60T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

1.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD3NM60T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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