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STD30PF03L-1

STMicroelectronics

STD30PF03L-1 by STMicroelectronics

STD30PF03L-1 by STMicroelectronics is a P-channel MOSFET designed for efficient switching applications. It features a max drain current of 24 A, a breakdown voltage of 30 V, and operates at up to 175 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,980 parts In-Stock

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8,980

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Digiode

USA . 2,410 parts In-Stock

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2,410

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Anansix

USA . 1,147 parts In-Stock

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1,147

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IDEA Electronic Components Group

UK . 186 parts In-Stock

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$0.583

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$0.525

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186

$0.583

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$0.525

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MKK Technologies

India . 1,589 parts In-Stock

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$1.097

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1,589

$1.097

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DigiPath Technology Company

USA . 1,589 parts In-Stock

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$1.097

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1,589

$1.097

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AZTECH Wire

Italy . 1,177 parts In-Stock

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$14.200

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1,177

$14.200

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Authorized Procurement Solutions

USA . 32,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,678 parts In-Stock

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22,678

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Kepictronics

USA . 10,065 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,478 parts In-Stock

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Corphita

USA . 2,559 parts In-Stock

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2,559

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Parana Technologies

USA . 1,699 parts In-Stock

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$0.697

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Perfect Parts

USA . 75 parts In-Stock

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75

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GreenTree Electronics

Israel . 67 parts In-Stock

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Overview

Unlock unparalleled efficiency with the STD30PF03L-1 from STMicroelectronics. This premium P-channel power FET is designed for seamless switching applications, ensuring robust performance even in demanding conditions. With a remarkable current handling capacity and superior thermal management, it’s perfect for energy-saving solutions in various electronic devices. Trust in ST's legacy of quality and innovation to elevate your projects and drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that provides excellent protection and reduces overall product weight.

Polarity or Channel Type: P-CHANNEL

P-channel configuration allows for easy integration in high-side switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode enhances reliability and simplifies the design process by eliminating the need for additional components.

Transistor Application: SWITCHING

Optimized for switching applications, making it ideal for various electronic circuits requiring fast response times.

Minimum DS Breakdown Voltage: 30 V

Provides adequate voltage handling capability for many applications, enhancing versatility.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of PCB space, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal design ensures robust mechanical and electrical connections, suitable for high-stress environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation improves efficiency and reduces power loss during operation.

Maximum Pulsed Drain Current (IDM): 96 A

High pulsed drain current capability makes it suitable for applications with high transient loads.

Avalanche Energy Rating (EAS): 850 mJ

High avalanche energy rating allows the device to safely handle energy spikes, enhancing reliability.

Maximum Drain Current (Abs) (ID): 24 A

Strong maximum drain current ensures it can manage significant loads without overheating.

No. of Terminals: 3

Three terminals make it easy to integrate into various circuit designs without complexity.

Maximum Power Dissipation (Abs): 70 W

High power dissipation capability allows for efficient thermal management in demanding applications.

Package Style (Meter): IN-LINE

In-line package style simplifies assembly and aligns well with standard PCB layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high efficiency and fast switching speeds, crucial for modern electronic applications.

Maximum Operating Temperature: 175 °C

Ability to operate at high temperatures ensures reliability in harsh environments.

Transistor Element Material: SILICON

Silicon material offers excellent thermal stability and performance characteristics.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and reduces oxidation, ensuring reliable connections.

Maximum Drain Current (ID): 24 A

Duplicated specification emphasizing the transistor's ability to handle substantial current loads.

Maximum Drain-Source On Resistance: 0.04 ohm

Low on-resistance minimizes power loss during operation, enhancing overall efficiency.

Terminal Position: SINGLE

Single terminal position makes it easier to handle and install in circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) STD30PF03L-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

24 A

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

96 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD30PF03L-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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