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STD30NE06L

STMicroelectronics

STD30NE06L by STMicroelectronics

STD30NE06L by STMicroelectronics is a N-CHANNEL Power FET with 60V DS Breakdown Voltage. It has a max ID of 30A and 0.03 ohm Drain-Source On Resistance, suitable for SWITCHING applications. This SINGLE transistor in PLASTIC/EPOXY package features an ENHANCEMENT MODE and built-in DIODE, making it ideal for high-current operations.

Median Price

$1.219

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,843 parts In-Stock

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3,843

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Digiode

USA . 3,168 parts In-Stock

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3,168

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ACDS - Activité Composants Distribution Service

France . 1,788 parts In-Stock

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1,788

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Bristol Electronics

USA . 1,788 parts In-Stock

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-

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$1.219

1k+ parts

$0.682

10k+ parts

$0.643

1,788

-

$1.219

$0.682

$0.643

Dan-Mar Components

USA . 1,788 parts In-Stock

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1,788

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Anansix

USA . 1,415 parts In-Stock

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Elcom Components

USA . 459 parts In-Stock

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459

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 359 parts In-Stock

1+ parts

$1.660

100+ parts

-

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$1.494

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359

$1.660

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$1.494

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MKK Technologies

India . 2,038 parts In-Stock

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$3.121

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$3.121

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DigiPath Technology Company

USA . 2,038 parts In-Stock

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$3.121

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$3.121

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AZTECH Wire

Italy . 891 parts In-Stock

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$13.260

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Component Stockers USA

USA . 334 parts In-Stock

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$99.990

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334

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A-Z Elektronik GmbH

Germany . 6,164 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,079 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 3,474 parts In-Stock

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Parana Technologies

USA . 383 parts In-Stock

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$1.984

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A-Plus Industry Inc.

USA . 40 parts In-Stock

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Assy Fe

Spain . 22 parts In-Stock

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Overview

Unlock the power of innovation with the STD30NE06L by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers unparalleled quality and reliability in their Power Field Effect Transistors (FET). Designed for switching applications, this N-CHANNEL transistor offers a seamless solution for your electronic needs. With a maximum drain current of 30A and a low on-resistance of 0.03 ohm, this transistor provides exceptional performance and efficiency. Trust STMicroelectronics to bring cutting-edge technology to your projects, ensuring superior results every time. Upgrade your designs with the STD30NE06L and experience the difference that quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency compared to P-channel FETs, making this product a suitable choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by eliminating the need for an external diode, saving space and reducing overall cost.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in such scenarios.

Surface Mount: YES

Suitable for automated assembly processes, making it easier to integrate into circuit boards and reducing overall manufacturing time and cost.

Minimum DS Breakdown Voltage: 60 V

Can handle higher voltages, providing a safety margin in various applications where voltage spikes may occur.

Package Shape: RECTANGULAR

Compact rectangular shape allows for space-saving installation and efficient use of board space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high performance and reliability, ensuring stable operation under various conditions.

Maximum Pulsed Drain Current (IDM): 120 A

Capable of handling high current pulses, making it suitable for applications requiring high power output.

Avalanche Energy Rating (EAS): 100 mJ

Provides protection against high-energy spikes, ensuring the transistor can withstand sudden voltage surges without damage.

Maximum Drain Current (ID): 30 A

Capable of handling high continuous current, making it suitable for applications where a consistent flow of current is required.

Maximum Drain-Source On Resistance: 0.03 ohm

Low on-resistance ensures minimal power losses and efficient switching performance, making it suitable for high-frequency switching applications.

Technical Specifications

Power Field Effect Transistors (FET) STD30NE06L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

120 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD30NE06L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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