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STD27N3LH5

STMicroelectronics

STD27N3LH5 by STMicroelectronics

STD27N3LH5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 27 A, a breakdown voltage of 30 V, and operates at up to 175 °C. Its compact surface mount design ensures versatility in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,268 parts In-Stock

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Digiode

USA . 4,740 parts In-Stock

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Anansix

USA . 768 parts In-Stock

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768

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IDEA Electronic Components Group

UK . 225 parts In-Stock

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$1.327

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$1.194

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225

$1.327

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$1.194

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MKK Technologies

India . 2,103 parts In-Stock

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$2.495

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$2.495

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DigiPath Technology Company

USA . 2,103 parts In-Stock

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$2.495

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2,103

$2.495

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AZTECH Wire

Italy . 821 parts In-Stock

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$17.830

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821

$17.830

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Kepictronics

USA . 10,065 parts In-Stock

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RC Electronics

USA . 9,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,647 parts In-Stock

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Parana Technologies

USA . 980 parts In-Stock

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$1.586

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$1.586

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Corphita

USA . 403 parts In-Stock

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Overview

Experience unparalleled performance with the STD27N3LH5 from STMicroelectronics—a trusted leader in innovative semiconductor solutions. This N-channel power FET combines robust switching capabilities with exceptional efficiency, making it ideal for a variety of applications, including power management and automotive systems. With superior quality and reliability, it empowers your designs while enhancing energy savings, ensuring you stay ahead in a competitive market. Choose STMicroelectronics for innovation that delivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy packaging ensures durability and resistance to environmental factors, making it reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for higher efficiency in switching applications, making this product ideal for high-speed operations.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for enhanced protection and simplifies circuit design, reducing component count.

Transistor Application: SWITCHING

Designed for switching applications, this FET provides excellent performance in power management and control.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into modern PCB layouts.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle a variety of applications without risk of failure due to voltage spikes.

Package Shape: RECTANGULAR

Rectangular packaging optimizes space on PCBs and improves thermal management capabilities.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance the mechanical stability of the component.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures low power consumption and high efficiency when the device is turned on.

Maximum Pulsed Drain Current (IDM): 108 A

A pulsed drain current rating of 108A indicates strong performance for high-demand applications, allowing for robust operation.

Avalanche Energy Rating (EAS): 50 mJ

The avalanche energy rating of 50mJ ensures the FET can withstand transient events, providing additional reliability.

Maximum Drain Current (Abs) (ID): 27 A

The ability to handle up to 27A helps in powering demanding loads effectively without thermal issues.

No. of Terminals: 2

A 2-terminal design simplifies circuit layouts and contributes to a smaller footprint.

Maximum Power Dissipation (Abs): 30 W

With a maximum power dissipation capability of 30W, this FET can operate efficiently under high-load conditions.

Package Style (Meter): SMALL OUTLINE

Small outline package style reduces board space requirements, making it suitable for compact applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables low power operation and high input impedance, resulting in efficient switching performance.

Maximum Operating Temperature: 175 °C

Withstanding temperatures up to 175 °C, this FET is suitable for high-temperature environments and demanding applications.

Transistor Element Material: SILICON

Silicon as the semiconductor material provides excellent electrical characteristics and reliability.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability, ensuring reliable connections during assembly.

Maximum Drain Current (ID): 27 A

Reinforcing the capability of handling 27A ensures consistent performance in high-current applications.

Maximum Drain-Source On Resistance: 0.028 ohm

Low on-resistance contributes to reduced power losses and improved efficiency during operation.

Terminal Position: SINGLE

A single terminal position enhances layout flexibility in circuit designs.

Case Connection: DRAIN

Direct drain connection simplifies device integration and helps manage thermal issues effectively.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes, aiding in manufacturing.

Peak Reflow Temperature (°C): 260

A peak reflow temperature of 260 °C allows for reliable soldering processes in assembly without compromising component integrity.

Technical Specifications

Power Field Effect Transistors (FET) STD27N3LH5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

50 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

108 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD27N3LH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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