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STD10PF06T4

STMicroelectronics

STD10PF06T4 by STMicroelectronics

STD10PF06T4 by STMicroelectronics is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 40A IDM and 125mJ EAS, operating in ENHANCEMENT MODE. With a compact RECTANGULAR package style and Matte Tin finish, it offers high performance in various power management systems.

Median Price

$0.294

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

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$0.294

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$0.294

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Chip Stock

USA . 40,497 parts In-Stock

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ComSIT Distribution GmbH

Germany . 8,845 parts In-Stock

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ComSIT USA

USA . 8,845 parts In-Stock

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Vyrian

USA . 5,535 parts In-Stock

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5,535

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Contempo Components LLC

USA . 4,437 parts In-Stock

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Digiode

USA . 4,292 parts In-Stock

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Bristol Electronics

USA . 3,333 parts In-Stock

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Atlantic Semiconductor

USA . 2,935 parts In-Stock

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Prism Electronics

USA . 2,500 parts In-Stock

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Rebound Electronics

UK . 2,310 parts In-Stock

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Lantek

USA . 1,880 parts In-Stock

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J2 Sourcing AB

Sweden . 1,652 parts In-Stock

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Zilex Electronics Inc.

Canada . 1,093 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 840 parts In-Stock

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840

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Anansix

USA . 757 parts In-Stock

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757

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Holdelec - ElecDif-Pro

France . 380 parts In-Stock

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380

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Semi Source

USA . 240 parts In-Stock

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240

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LWI Electronics Inc

India . 119 parts In-Stock

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South Electronics

USA . 83 parts In-Stock

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Connector Distribution Corp

USA . 11 parts In-Stock

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11

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Right Parts Inc.

USA . 11 parts In-Stock

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11

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Fibra_Brandt Electronic GMBH

Germany . 10 parts In-Stock

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10

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Microfarads

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,357 parts In-Stock

1+ parts

$0.294

100+ parts

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1k+ parts

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$0.288

4,357

$0.294

-

-

$0.288

Argo Parts USA

USA . 3,515 parts In-Stock

1+ parts

$0.294

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$0.285

3,515

$0.294

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$0.285

Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$0.300

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$0.300

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$0.300

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870

$0.300

$0.300

$0.300

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Corohmni

South Africa . 239 parts In-Stock

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$0.621

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239

$0.621

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Aztec Data Supply Inc.

USA . 4,370 parts In-Stock

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$1.290

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4,370

$1.290

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IDEA Electronic Components Group

UK . 1,599 parts In-Stock

1+ parts

$1.733

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$1.560

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1,599

$1.733

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$1.560

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Benley Electronics

USA . 1 parts In-Stock

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$2.000

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1

$2.000

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MKK Technologies

India . 1,436 parts In-Stock

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$3.259

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1,436

$3.259

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DigiPath Technology Company

USA . 1,436 parts In-Stock

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$3.259

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1,436

$3.259

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AZTECH Wire

Italy . 894 parts In-Stock

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$13.540

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894

$13.540

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Semicontronic

India . 1,460 parts In-Stock

1+ parts

$39.050

100+ parts

$38.074

1k+ parts

$37.878

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1,460

$39.050

$38.074

$37.878

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Ampacity Inc.

Singapore . 1,372 parts In-Stock

1+ parts

$47.050

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1,372

$47.050

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Kepictronics

USA . 82,000 parts In-Stock

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Perfect Parts

USA . 57,120 parts In-Stock

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Lixinc

USA . 17,815 parts In-Stock

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S.R.D Solutions

India . 5,100 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,043 parts In-Stock

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3,043

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Corphita

USA . 2,881 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,303 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,025 parts In-Stock

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2,025

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GreenTree Electronics

Israel . 1,880 parts In-Stock

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1,880

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Cyclops Electronics Ltd (Excess)

UK . 840 parts In-Stock

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840

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Glotronic Ltd.

UK . 672 parts In-Stock

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672

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Parana Technologies

USA . 546 parts In-Stock

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$2.072

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546

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$2.072

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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100

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Assy Fe

Spain . 27 parts In-Stock

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27

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Overview

Discover the STD10PF06T4 by STMicroelectronics, a high-quality P-CHANNEL Power Field Effect Transistor perfect for switching applications. With a built-in diode and a maximum DS Breakdown Voltage of 60V, this transistor offers reliable performance and efficiency. Its small outline package with gull wing terminals makes it easy to integrate into various designs. Trust STMicroelectronics' expertise in semiconductor technology to deliver a product that exceeds expectations. Upgrade your electronic projects with the STD10PF06T4 and experience enhanced power management like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it a reliable choice for various applications.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low power consumption and high efficiency, making them ideal for battery-operated devices.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves efficiency by reducing the need for additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast and efficient operation for power control tasks.

Surface Mount: YES

The surface mount feature makes it easy to integrate this FET into compact electronic devices while saving space.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages without damage, ensuring reliable operation in demanding conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and handling, making installation straightforward for users.

Terminal Form: GULL WING

The gull wing terminal form provides a secure connection and is suitable for automated assembly processes, enhancing efficiency.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers precise control over the FET's conductivity, resulting in improved performance and energy efficiency.

Maximum Pulsed Drain Current (IDM): 40 A

The high pulsed drain current rating allows this FET to handle sudden surges of power without being damaged, ensuring reliable operation in dynamic systems.

Avalanche Energy Rating (EAS): 125 mJ

The high avalanche energy rating indicates the FET's ability to withstand sudden voltage spikes, making it suitable for rugged applications.

Maximum Drain Current (Abs) (ID): 10 A

With a high drain current rating, this FET can handle continuous power flow without overheating, ensuring long-lasting performance.

No. of Terminals: 2

The two-terminal design simplifies circuit connections and reduces complexity, making it easier for users to integrate into their projects.

Maximum Power Dissipation (Abs): 40 W

The high power dissipation capability allows this FET to handle large amounts of power while maintaining stable performance, suitable for high-power applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs, making it suitable for applications with limited board space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low power consumption and fast switching speeds, making this FET ideal for high-performance applications.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can withstand extreme conditions without sacrificing performance or reliability.

Transistor Element Material: SILICON

Silicon transistors offer high efficiency and reliability, making this FET a durable choice for long-term use in various applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides corrosion resistance and ensures a reliable connection, extending the lifespan of the FET.

Maximum Drain-Source On Resistance: 0.2 ohm

The low drain-source on resistance minimizes power loss and improves efficiency, making this FET suitable for high-performance applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and installation, making it easier for users to integrate this FET into their projects.

Case Connection: DRAIN

The drain case connection provides a stable and secure connection for power flow, ensuring reliable performance in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

This FET can withstand peak reflow temperatures for up to 30 seconds, allowing for efficient soldering processes during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the FET can withstand the soldering process without damage, maintaining its performance and reliability.

Technical Specifications

Power Field Effect Transistors (FET) STD10PF06T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

125 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD10PF06T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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