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STD100NH03LT4

STMicroelectronics

STD100NH03LT4 by STMicroelectronics

STD100NH03LT4 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 60 A, a breakdown voltage of 30 V, and operates at up to 175 °C. Ideal for power management in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,565 parts In-Stock

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Sea View Technologies

USA . 5,752 parts In-Stock

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Bristol Electronics

USA . 3,562 parts In-Stock

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3,562

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J2 Sourcing AB

Sweden . 2,500 parts In-Stock

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2,500

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ACDS - Activité Composants Distribution Service

France . 2,447 parts In-Stock

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Anansix

USA . 1,901 parts In-Stock

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Digiode

USA . 1,141 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 2,148 parts In-Stock

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$0.540

100+ parts

$0.510

1k+ parts

$0.490

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2,148

$0.540

$0.510

$0.490

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IDEA Electronic Components Group

UK . 1,502 parts In-Stock

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$1.621

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$1.459

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$1.621

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$1.459

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MKK Technologies

India . 382 parts In-Stock

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$3.048

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382

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DigiPath Technology Company

USA . 382 parts In-Stock

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$3.048

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382

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AZTECH Wire

Italy . 124 parts In-Stock

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$21.060

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,869 parts In-Stock

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Kepictronics

USA . 10,070 parts In-Stock

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Corphita

USA . 4,346 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,912 parts In-Stock

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Perfect Parts

USA . 2,797 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,447 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,530 parts In-Stock

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Parana Technologies

USA . 674 parts In-Stock

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$1.938

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Overview

Unlock the potential of your projects with the STD100NH03LT4 by STMicroelectronics—a powerhouse in the world of Power FETs. Renowned for their commitment to quality and innovation, STMicroelectronics delivers reliable components that excel in various applications like automotive, industrial, and consumer electronics. Experience superior efficiency, robust performance, and versatile design options, ensuring your systems operate seamlessly while maximizing energy savings. Elevate your designs with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides good insulation and durability, making the FET suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency compared to P-channel types, making them an excellent choice for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances functionality, making it ideal for applications that require reverse protection.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently manage on/off control in circuits.

Surface Mount: YES

Surface mount capability allows for compact designs and easy integration into automated assembly processes.

Minimum DS Breakdown Voltage: 30 V

This minimum breakdown voltage ensures reliability under high-voltage conditions, suitable for various power applications.

Package Shape: RECTANGULAR

The rectangular package shape enables straightforward PCB layout and space optimization in electronic designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering reliability and stress distribution during thermal cycling.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for high-speed switching with lower gate drive requirements, improving efficiency.

Maximum Pulsed Drain Current (IDM): 240 A

With a high pulsed drain current rating, this FET can handle significant transients, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 700 mJ

A high avalanche energy rating indicates robust reliability in scenarios involving overvoltage and fault conditions.

Maximum Drain Current (Abs) (ID): 60 A

This high absolute maximum drain current supports heavy load applications, providing greater design flexibility.

No. of Terminals: 2

With a simple 2-terminal design, this FET ensures ease of integration and reduced circuit complexity.

Maximum Power Dissipation (Abs): 100 W

A high power dissipation rating allows for efficient heat management, essential for high-performance applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing for compact circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and low output capacitance, contributing to efficient switching performance.

Maximum Operating Temperature: 175 °C

A high max operating temperature makes this FET suitable for demanding environments, ensuring longevity and reliability.

Transistor Element Material: SILICON

Silicon materials contribute to high performance, providing better thermal stability and conductivity.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and reduces the risk of oxidation, enhancing reliability.

Maximum Drain Current (ID): 60 A

This feature reiterates the high efficiency and performance capabilities, making it an ideal choice for power management.

Maximum Drain-Source On Resistance: 0.0105 ohm

Low on-resistance translates to minimal power loss during conduction, optimizing overall circuit efficiency.

Terminal Position: SINGLE

A single terminal position simplifies the design layout and reduces the potential for connection errors.

Case Connection: DRAIN

Direct drain connection enhances signal integrity and reduces parasitic inductance, which is crucial for high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) STD100NH03LT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

700 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.0105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD100NH03LT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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