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STB5NK50Z-1

STMicroelectronics

STB5NK50Z-1 by STMicroelectronics

STB5NK50Z-1 by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 500V breakdown voltage and 17.6A max pulsed drain current. It operates in enhancement mode with a power dissipation of up to 70W. This versatile transistor is suitable for various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,577 parts In-Stock

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6,577

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Digiode

USA . 3,627 parts In-Stock

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3,627

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Anansix

USA . 1,289 parts In-Stock

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1,289

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IDEA Electronic Components Group

UK . 967 parts In-Stock

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$0.730

100+ parts

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$0.657

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967

$0.730

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$0.657

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MKK Technologies

India . 364 parts In-Stock

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$1.374

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364

$1.374

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DigiPath Technology Company

USA . 364 parts In-Stock

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$1.374

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364

$1.374

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AZTECH Wire

Italy . 998 parts In-Stock

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$17.190

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998

$17.190

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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A-Z Elektronik GmbH

Germany . 4,799 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,807 parts In-Stock

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3,807

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RC Electronics

USA . 2,880 parts In-Stock

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Corphita

USA . 1,337 parts In-Stock

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Parana Technologies

USA . 490 parts In-Stock

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$0.873

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490

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Overview

Elevate your designs with the STB5NK50Z-1 from STMicroelectronics, a top-tier N-channel power FET that combines exceptional reliability and performance. Renowned for its high-quality manufacturing, STMicroelectronics ensures each transistor delivers superior efficiency in demanding applications like power switching. Enjoy benefits such as robust breakdown voltage and enhanced thermal management, empowering you to achieve optimal performance in your projects while reducing energy costs. Choose ST for innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and provides excellent insulation properties, making it suitable for various operating environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer lower on-resistance and higher efficiency, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides additional protection against reverse polarity, improving reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid on/off cycles effectively, ensuring efficient power management.

Minimum DS Breakdown Voltage: 500 V

The high breakdown voltage capability ensures that the transistor can operate safely under high-voltage conditions, making it suitable for industrial applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout and spacing on circuit boards, supporting compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure robust mechanical connections, ideal for applications where high reliability is essential.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for higher efficiency performance in the effective switching mechanism, enhancing overall circuit performance.

Maximum Pulsed Drain Current (IDM): 17.6 A

A high pulsed drain current rating enables the FET to handle significant surges in current, suitable for transient conditions.

Avalanche Energy Rating (EAS): 130 mJ

The considerable avalanche energy rating offers additional protection and reliability in high-stress environments, safeguarding the transistor from damage.

Maximum Drain Current (Abs) (ID): 4.4 A

With a maximum drain current of 4.4 A, this FET can efficiently handle current loads in numerous power applications.

No. of Terminals: 3

The three-terminal design simplifies integration into circuits while providing functionality for gate, drain, and source connections.

Maximum Power Dissipation (Abs): 70 W

A high power dissipation rating allows this FET to operate effectively under maximum load conditions without overheating.

Package Style (Meter): IN-LINE

In-line package style is convenient for mounting and integration into various electronic setups, facilitating easier assembly.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-speed operation, low power consumption, and excellent scalability, making this transistor efficient for a variety of applications.

Maximum Operating Temperature: 150 °C

An elevated operating temperature range ensures reliability and performance under extreme conditions, suitable for high-temperature environments.

Transistor Element Material: SILICON

Silicon as the elemental material provides good thermal conductivity and is effective for power applications, ensuring optimal performance.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish provides better solderability, reducing the risk of connection failures during manufacturing and assembly.

Maximum Drain Current (ID): 4.4 A

Reiterating the maximum drain current capability underscores the FET’s ability to manage sufficient current, ensuring suitability for various high-power applications.

Maximum Drain-Source On Resistance: 1.5 ohm

A low on-resistance of 1.5 ohms ensures reduced power loss and improved efficiency during operation, which is critical for energy-efficient applications.

Terminal Position: SINGLE

The single terminal position simplifies connections and layouts in circuit designs, optimizing space and improving ease of use.

Technical Specifications

Power Field Effect Transistors (FET) STB5NK50Z-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

130 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

4.4 A

Maximum Drain Current (ID):

4.4 A

Maximum Drain-Source On Resistance:

1.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

17.6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB5NK50Z-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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