Loading...

STB11NM60N-1

STMicroelectronics

STB11NM60N-1 by STMicroelectronics

STB11NM60N-1 from STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a 600V breakdown voltage, 10A max drain current, and 90W power dissipation. This versatile component operates efficiently in high-temperature environments up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,611 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,611

-

-

-

-

Digiode

USA . 779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

779

-

-

-

-

Anansix

USA . 751 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

751

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 113 parts In-Stock

1+ parts

$1.130

100+ parts

-

1k+ parts

$1.017

10k+ parts

-

113

$1.130

-

$1.017

-

MKK Technologies

India . 1,797 parts In-Stock

1+ parts

$2.124

100+ parts

-

1k+ parts

-

10k+ parts

-

1,797

$2.124

-

-

-

DigiPath Technology Company

USA . 1,797 parts In-Stock

1+ parts

$2.124

100+ parts

-

1k+ parts

-

10k+ parts

-

1,797

$2.124

-

-

-

AZTECH Wire

Italy . 937 parts In-Stock

1+ parts

$22.230

100+ parts

-

1k+ parts

-

10k+ parts

-

937

$22.230

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,582 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,582

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,993

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Alle Elektronik GmbH

Germany . 1,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,650

-

-

-

-

Corphita

USA . 720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

720

-

-

-

-

Parana Technologies

USA . 170 parts In-Stock

1+ parts

-

100+ parts

$1.351

1k+ parts

-

10k+ parts

-

170

-

$1.351

-

-

Overview

Elevate your projects with the STB11NM60N-1 from STMicroelectronics, a powerhouse in Power FET technology. Renowned for exceptional quality and reliability, STMicroelectronics delivers this N-channel transistor designed for seamless switching applications, ensuring robust performance in demanding environments. With its built-in diode and high breakdown voltage, it offers unparalleled efficiency and thermal stability, making it the ideal choice for industrial and consumer electronics. Experience unmatched value and peace of mind with a trusted leader in semiconductor innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and protection, making the FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide better performance and efficiency in switching applications, resulting in lower power losses.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against back EMF, improving reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET excels in fast on/off switching, essential for efficient power management.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage allows the FET to operate reliably in high-voltage environments, making it suitable for industrial applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs, allowing for compact designs in electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, enhancing the robustness of the circuit in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures that the FET remains off until a suitable gate voltage is applied, enhancing control and efficiency.

Maximum Pulsed Drain Current (IDM): 40 A

High pulsed drain current capability allows for handling of peak loads, making it versatile for various transient applications.

Avalanche Energy Rating (EAS): 200 mJ

A high avalanche energy rating indicates strong protection against voltage spikes, improving overall reliability.

Maximum Drain Current (Abs) (ID): 10 A

Allows for handling substantial continuous currents, ensuring effective performance in high-load applications.

No. of Terminals: 3

Three terminals simplify the circuit design, making it easy to integrate into various electronic applications.

Maximum Power Dissipation (Abs): 90 W

High power dissipation capability means that the FET can handle more power without overheating, ensuring longer life and reliability.

Package Style (Meter): IN-LINE

The in-line package style provides a streamlined form factor which is beneficial for PCB placement and thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures fast switching speeds and high efficiency, making this product ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating allows the FET to function in extreme environments, offering flexibility in application.

Transistor Element Material: SILICON

Silicon as a material enhances stability and performance, ensuring lasting reliability under varying conditions.

Terminal Finish: MATTE TIN

The matte tin finish improves solderability and resistance to corrosion, facilitating easier assembly and durability.

Maximum Drain Current (ID): 10 A

Consistent with the maximum capacity ensures effective operation under specified load conditions.

Maximum Drain-Source On Resistance: 0.45 ohm

Low on-resistance minimizes power loss during operation, increasing overall efficiency in circuit designs.

Terminal Position: SINGLE

A single terminal position simplifies circuit layout and minimizes space, allowing for easier integration into compact designs.

Case Connection: ISOLATED

Isolated case connections enhance safety and reliability, minimizing the risk of short circuits in sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STB11NM60N-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB11NM60N-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20