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ST7FLITE49K2T6TR

STMicroelectronics

ST7FLITE49K2T6TR by STMicroelectronics

ST7FLITE49K2T6TR microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, supporting supply voltages from 3.3V to 5.5V. It includes 10 ADC channels and multiple timers for versatile applications in industrial settings. Its compact design and low profile make it ideal for space-constrained projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,412 parts In-Stock

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8,412

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Digiode

USA . 4,867 parts In-Stock

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4,867

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Anansix

USA . 817 parts In-Stock

1+ parts

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817

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,519 parts In-Stock

1+ parts

$2.060

100+ parts

-

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1,519

$2.060

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Microchip USA

USA . 463 parts In-Stock

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$4.492

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463

$4.492

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AZTECH Wire

Italy . 594 parts In-Stock

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$8.150

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594

$8.150

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IDEA Electronic Components Group

UK . 1,966 parts In-Stock

1+ parts

$45.719

100+ parts

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$41.147

10k+ parts

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1,966

$45.719

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$41.147

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MKK Technologies

India . 852 parts In-Stock

1+ parts

$85.972

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852

$85.972

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DigiPath Technology Company

USA . 852 parts In-Stock

1+ parts

$85.972

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852

$85.972

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Corphita

USA . 2,672 parts In-Stock

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2,672

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Parana Technologies

USA . 2,067 parts In-Stock

1+ parts

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$54.664

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2,067

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$54.664

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Perfect Parts

USA . 694 parts In-Stock

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694

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Overview

Elevate your projects with the ST7FLITE49K2T6TR microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. This compact powerhouse delivers exceptional performance across various applications, including industrial automation and consumer electronics. With robust reliability and versatility, it empowers designers to create smarter, more efficient products, ensuring you stay ahead of the competition while reaping the benefits of enhanced functionality and design flexibility.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protects the microcontroller from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating easier integration into modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V makes this microcontroller adaptable and safe for use in low-voltage applications.

Package Shape: SQUARE

The square package shape aids in efficient space utilization on PCBs, enhancing design flexibility.

Bit Size: 8

An 8-bit architecture ensures compatibility with a wide range of legacy systems and applications.

Power Supplies (V): 3/5

Supports dual voltage operation (3V and 5V), increasing versatility for different project requirements.

No. of Terminals: 32

With 32 terminals, this microcontroller offers ample connectivity options for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style minimizes space on PCBs, ideal for compact device designs.

Minimum Supply Voltage: 3.3 V

The ability to operate at a minimum supply voltage of 3.3V enables energy-efficient applications.

Maximum Operating Temperature: 85 °C

Operating at high temperatures ensures reliability in demanding industrial environments.

CPU Family: ST72

Belonging to the ST72 CPU family, it benefits from a robust ecosystem of support and resources.

Minimum Operating Temperature: -40 °C

This microcontroller's operation in extreme cold makes it suitable for outdoor and harsh environment applications.

Terminal Finish: TIN

The tin terminal finish ensures good solderability, improving manufacturing reliability.

ADC Channels: YES

Built-in analog-to-digital converters (ADCs) enable direct sensor interfacing, simplifying design.

Terminal Position: QUAD

Quad terminal positioning enhances PCB design flexibility and facilitates better electrical connection.

ROM Words: 8192

With 8192 ROM words, the microcontroller can accommodate substantial program memory for complex applications.

Maximum Seated Height: 1.6 mm

A low maximum seated height contributes to low-profile designs, essential in space-constrained applications.

Width: 7 mm

Its compact width allows for efficient placement on PCBs, facilitating high-density designs.

Data EEPROM Size: 256

A data EEPROM size of 256 allows for storing configuration data, improving flexibility in applications.

Peripherals: COMPARATOR(2), TIMER(6)

Integrated peripherals such as comparators and timers reduce the need for external components, simplifying design.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures responsive performance for various control applications.

Maximum Time At Peak Reflow Temperature (s): 30

Supports manufacturing processes that require peak reflow, enhancing production efficiency.

Peak Reflow Temperature °C: 235

Operating at a peak reflow temperature of 235 °C allows for compatibility with modern soldering techniques.

Length: 7 mm

The 7 mm length further contributes to the compactness of the microcontroller, making it suitable for miniaturized designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in challenging environments, making it ideal for critical applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing and control capabilities in a single chip, reducing system complexity.

RAM Bytes: 384

384 bytes of RAM allow for efficient temporary data storage during operation, enhancing performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, critical for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates straightforward soldering and enhances manufacturing efficiency.

Analog To Digital Convertors: 10-Ch 10-Bit

Ten-channel, 10-bit ADCs expand the microcontroller's capability to handle multiple analog inputs simultaneously.

Maximum Supply Current: 75 mA

A maximum supply current of 75 mA allows for considerable power availability for peripherals and operations.

Nominal Supply Voltage: 5 V

Operates at a nominal supply voltage of 5V, aligning with common power supply standards for ease of integration.

PWM Channels: YES

Inclusion of PWM channels enables efficient control over motors and other devices, enhancing functionality.

Connectivity: I2C, SPI

Rich connectivity options like I2C and SPI facilitate easy integration with other devices and systems.

ROM Programmability: FLASH

Flash ROM programmability supports easy updates and modifications, allowing design flexibility and adaptability.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is common in compact designs, making it easier to fit into modern layouts.

Moisture Sensitivity Level (MSL): 2

MSL level 2 ensures compatibility with standard reflow soldering processes, providing ease of handling and manufacturing.

Speed: 8 rpm

A speed rating of 8 rpm is useful for applications requiring low-speed control of devices.

On Chip Program ROM Width: 8

With an 8-bit program ROM width, this microcontroller is compatible with a range of programs and coding practices.

No. of I/O Lines: 24

24 I/O lines provide extensive interfacing options for connecting various peripherals and sensors.

Technical Specifications

Microcontrollers ST7FLITE49K2T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C, SPI

Peripherals:

COMPARATOR(2), TIMER(6)

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

ST7FLITE49K2T6TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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