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ST7FDALIM1

STMicroelectronics

ST7FDALIM1 by STMicroelectronics

ST7FDALIM1 microcontroller from STMicroelectronics features a max supply voltage of 5.5V, operates at up to 16 MHz, and includes 7 ADC channels. Its compact design (20 terminals) makes it ideal for DALI and SPI applications in commercial environments. With 8KB ROM and 384B RAM, it's perfect for efficient control tasks.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 2,340 parts In-Stock

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2,340

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Digiode

USA . 1,742 parts In-Stock

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Anansix

USA . 656 parts In-Stock

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656

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IDEA Electronic Components Group

UK . 899 parts In-Stock

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$64.093

100+ parts

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$57.683

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899

$64.093

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$57.683

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MKK Technologies

India . 1,380 parts In-Stock

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$120.522

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$120.522

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DigiPath Technology Company

USA . 1,380 parts In-Stock

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$120.522

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1,380

$120.522

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Parana Technologies

USA . 2,055 parts In-Stock

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$76.633

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2,055

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$76.633

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Corphita

USA . 1,283 parts In-Stock

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Overview

Unlock the potential of your projects with the ST7FDALIM1 microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile chip combines reliability and efficiency, perfect for applications in industrial automation, smart lighting, and home appliances. With its robust features and compact design, the ST7FDALIM1 ensures seamless integration, empowering you to innovate while enjoying enhanced performance and reduced development time. Experience the difference that superior technology brings!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures reliable performance in various environments, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for efficient assembly and saves space on printed circuit boards, leading to more compact designs.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate safely within standard voltage levels while providing sufficient headroom for applications.

Package Shape: RECTANGULAR

The rectangular shape is optimal for layout flexibility, facilitating easier integration into various circuit configurations.

Bit Size: 8

An 8-bit architecture simplifies development and is ideal for basic control applications, making it user-friendly and accessible.

No. of Terminals: 20

With 20 terminals, this microcontroller provides a good balance of I/O capabilities for a range of applications without becoming overly complex.

Package Style (Meter): SMALL OUTLINE

The small outline package style is designed for efficient space utilization on PCBs, allowing for denser circuitry.

Minimum Supply Voltage: 3.3 V

The ability to operate at a minimum supply voltage of 3.3 V provides flexibility for powering the microcontroller from various low-voltage sources.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C makes this microcontroller suitable for commercial environments where thermal management is crucial.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows for use in various climate conditions, expanding its application range.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to accurately read analog signals, enhancing its versatility for sensor-based applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layout options, accommodating various design specifications.

ROM Words: 8192

With 8192 ROM words, there is ample memory for program storage, facilitating more complex functionality.

Maximum Seated Height: 2.65 mm

The low profile of 2.65 mm ensures compatibility with low-clearance designs while supporting efficient heat dissipation.

Width: 7.5 mm

At a width of 7.5 mm, this microcontroller maintains a compact footprint that is conducive to space-sensitive applications.

Data EEPROM Size: 256

The presence of 256 bytes of EEPROM allows for non-volatile storage of important data, perfect for applications requiring persistent settings.

Peripherals: TIMER(2)

Two onboard timers provide essential functionality for time-based operations, enhancing the microcontroller's capability in embedded systems.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16 MHz enables the microcontroller to handle a variety of tasks efficiently, improving response times.

Length: 12.8 mm

Its 12.8 mm length keeps the overall size compact, which is beneficial for designs that require miniaturization.

Temperature Grade: COMMERCIAL

Rated for commercial use, this microcontroller is designed to operate effectively in typical consumer environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it is specifically optimized for control applications, providing the necessary features for embedded system development.

RAM Bytes: 384

384 bytes of RAM allows for temporary data storage during operation, which is sufficient for basic data handling in simpler applications.

Technology: CMOS

Utilizing CMOS technology, the microcontroller offers low power consumption and high efficiency, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and robust mechanical stability, enhancing manufacturability.

Analog To Digital Converters: 7-Ch 13-Bit

With 7 channels of 13-bit ADCs, this microcontroller provides high-resolution measurements, crucial for precise analog interfacing.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is ideal for most digital circuits, ensuring compatibility with a wide range of components.

PWM Channels: YES

Integrated PWM channels facilitate control for motors and other devices, making the microcontroller versatile for control tasks.

Connectivity: DALI, SPI

DALI and SPI connectivity options allow seamless communication with other devices and systems, enhancing integration capabilities.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the firmware, which is essential for development and field upgrades.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many applications, ensuring compatibility with a variety of PCB designs.

Speed: 8 rpm

Capable of 8 rpm, this specification is adequate for slow rotational applications, making it suitable for specific control tasks.

On Chip Program ROM Width: 8

An 8-bit program ROM width is suitable for simpler applications, allowing straightforward programming and data manipulation.

No. of I/O Lines: 17

17 I/O lines provide ample connections for peripherals and components, supporting a variety of application setups.

Technical Specifications

Microcontrollers ST7FDALIM1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.4V MIN SUPPLY @8MHZ

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of I/O Lines:

17

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

DALI, SPI

Peripherals:

TIMER(2)

Analog To Digital Convertors:

7-Ch 13-Bit

Trade Compliance

ST7FDALIM1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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