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ST7FDALIM3

STMicroelectronics

ST7FDALIM3 by STMicroelectronics

ST7FDALIM3 microcontroller from STMicroelectronics features a max supply voltage of 5.5V, operates in extreme temps (-40 °C to 125 °C), and includes 7 ADC channels. Ideal for automotive applications, it offers robust connectivity with DALI and SPI protocols. Its compact design (20 terminals) ensures efficient integration in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,875 parts In-Stock

1+ parts

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4,875

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Digiode

USA . 3,309 parts In-Stock

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3,309

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Anansix

USA . 2,628 parts In-Stock

1+ parts

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2,628

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,131 parts In-Stock

1+ parts

$75.453

100+ parts

-

1k+ parts

$67.908

10k+ parts

-

2,131

$75.453

-

$67.908

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MKK Technologies

India . 832 parts In-Stock

1+ parts

$141.884

100+ parts

-

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832

$141.884

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DigiPath Technology Company

USA . 832 parts In-Stock

1+ parts

$141.884

100+ parts

-

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832

$141.884

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Corphita

USA . 4,385 parts In-Stock

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4,385

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Parana Technologies

USA . 1,720 parts In-Stock

1+ parts

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$90.215

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1,720

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$90.215

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Overview

Unlock the potential of your next project with the ST7FDALIM3 microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers unparalleled reliability in automotive applications. This versatile 8-bit controller features advanced connectivity options like DALI and SPI, ensuring seamless integration into diverse systems. Experience exceptional performance under extreme conditions, maximizing efficiency and enhancing product longevity. Transform your ideas into reality with ST's trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and offers protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, providing greater flexibility in circuit layout.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V allows for compatibility with standard electronic components and ensures ease of integration in existing systems.

Package Shape: RECTANGULAR

A rectangular package shape is advantageous for streamlined assembly and placement on printed circuit boards (PCBs).

Bit Size: 8

An 8-bit architecture provides a balance between simplicity and performance for cost-effective applications.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for I/O lines, enabling versatile design possibilities in microcontroller applications.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for increased mounting density on PCBs, making it ideal for space-constrained designs.

Minimum Supply Voltage: 4 V

The minimum supply voltage of 4 V allows for a broad range of supply voltage options, enhancing the flexibility of power supply configurations.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and performance in extreme environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures makes this microcontroller suitable for harsh environments, including automotive and industrial applications.

ADC Channels: YES

Having ADC channels allows for the integration of analog sensors, expanding the microcontroller’s functionality for diverse applications.

Terminal Position: DUAL

Dual terminal position supports easier assembly and robustness on PCBs, contributing to reliable performance.

ROM Words: 8192

With 8192 ROM words, this microcontroller provides ample memory for firmware and application code, enhancing functionality.

Maximum Seated Height: 2.65 mm

A low seated height allows for better compatibility with low-profile PCB designs and ensures efficient heat dissipation.

Width: 7.5 mm

A compact width makes it easier to fit into tight spaces on PCBs, ideal for miniaturized electronic devices.

Data EEPROM Size: 256

The data EEPROM size of 256 bytes allows for storage of configuration settings, promoting versatility in application designs.

Peripherals: TIMER(2)

Two timers enhance functionality by enabling precise timing operations crucial for various control applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for fast processing speeds, enabling efficient execution of tasks.

Length: 12.8 mm

Compact length contributes to space-saving designs while maintaining performance and connectivity options.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets strict temperature and reliability standards necessary for automotive electronics.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing, memory, and peripherals, streamlining design and improving overall system performance.

RAM Bytes: 384

384 bytes of RAM provides sufficient memory for intermediate data processing and operational tasks in various applications.

Technology: CMOS

Utilizing CMOS technology enhances power efficiency and allows for higher integration of functionality in smaller devices.

Terminal Form: GULL WING

Gull wing terminals promote better solder joint strength, ensuring reliable connections in the assembled product.

Analog To Digital Converters: 7-Ch 13-Bit

With 7-channel 13-bit ADCs, it offers high-resolution analog input capabilities for precise measurements in sensor applications.

Nominal Supply Voltage: 5 V

A 5 V nominal supply voltage is commonly used, providing ease of compatability with numerous existing electronic circuits.

PWM Channels: YES

PWM capability enables efficient control of motors and other actuators, making it suitable for robotics and control applications.

Connectivity: DALI, SPI

Support for DALI and SPI connectivity enables easy integration with a variety of devices and networking options, enhancing versatility.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and modifications to the firmware, adding flexibility in the development cycle.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is ideal for standard PCB manufacturing processes, simplifying assembly and soldering.

Speed: 8 rpm

The speed rating is indicative of the potential operational limits for controlling devices like motors in applications requiring precise movements.

On Chip Program ROM Width: 8

An 8-bit program ROM width emphasizes ease of coding and compatibility with a wide range of programming environments.

No. of I/O Lines: 17

Having 17 I/O lines provides sufficient input/output options to connect with various peripherals or sensors, enhancing the microcontroller’s adaptability.

Technical Specifications

Microcontrollers ST7FDALIM3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.4V MIN SUPPLY @8MHZ

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of I/O Lines:

17

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

DALI, SPI

Peripherals:

TIMER(2)

Analog To Digital Convertors:

7-Ch 13-Bit

Trade Compliance

ST7FDALIM3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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