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ST7FLIT10BY0B6

STMicroelectronics

ST7FLIT10BY0B6 by STMicroelectronics

ST7FLIT10BY0B6 by STMicroelectronics is an 8-bit microcontroller with 256 bytes of RAM and 2048 ROM words. Operating at a max clock frequency of 16 MHz, it features PWM channels and ADC capabilities. Ideal for industrial applications requiring a reliable microcontroller with a temperature range from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,858 parts In-Stock

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2,858

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Vyrian

USA . 1,164 parts In-Stock

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1,164

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Digiode

USA . 886 parts In-Stock

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886

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Nova Conductors

Japan . 63 parts In-Stock

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Zilex Electronics Inc.

Canada . 25 parts In-Stock

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25

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EMSNET

USA . 20 parts In-Stock

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20

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AZTECH Wire

Italy . 595 parts In-Stock

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$14.268

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595

$14.268

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Ampacity Inc.

Singapore . 635 parts In-Stock

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$20.000

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635

$20.000

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IDEA Electronic Components Group

UK . 1,424 parts In-Stock

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$21.012

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$18.911

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$21.012

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$18.911

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MKK Technologies

India . 182 parts In-Stock

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$39.511

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DigiPath Technology Company

USA . 182 parts In-Stock

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$39.511

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$39.511

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QUARKTWIN TECHNOLOGY LTD

USA . 8,749 parts In-Stock

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Continental Prestige Electronics

USA . 5,493 parts In-Stock

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Microchip USA

USA . 3,750 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

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Argo Parts USA

USA . 2,478 parts In-Stock

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Corphita

USA . 2,404 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Parana Technologies

USA . 786 parts In-Stock

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$25.123

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Kepictronics

USA . 86 parts In-Stock

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Overview

Unleash the power of innovation with the ST7FLIT10BY0B6 microcontroller from STMicroelectronics. Designed with precision and quality in mind, this versatile device offers a wide range of applications in various industries. With its advanced features and cutting-edge technology, the ST7FLIT10BY0B6 provides unmatched performance and reliability. Experience seamless integration and exceptional value with this remarkable product, delivering unparalleled benefits to our customers. Upgrade your projects and elevate your designs with the ST7FLIT10BY0B6 microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power input while ensuring the safety of the microcontroller.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate the microcontroller into different electronic designs.

Bit Size: 8

With an 8-bit architecture, this microcontroller can handle a wide range of tasks efficiently.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, offering compatibility with various systems.

No. of Terminals: 16

Offers sufficient I/O options for connecting peripherals and external components.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, ideal for industrial applications.

CPU Family: ST72

Part of a reputable CPU family known for performance and reliability.

ADC Channels: YES

Includes Analog-to-Digital Converter channels for precise measurement and control.

ROM Words: 2048

With 2048 words of ROM, the microcontroller can store program instructions efficiently.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for effective operation.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of output signals.

Technical Specifications

Microcontrollers ST7FLIT10BY0B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.18 mm

No. of I/O Lines:

17

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

5.33 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

ST7FLIT10BY0B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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