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ST7FLITE20F2B6

STMicroelectronics

ST7FLITE20F2B6 by STMicroelectronics

ST7FLITE20F2B6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w 3.3V and 5.5V. It includes 7 ADC channels and supports industrial applications with a temp range of -40 °C to 85 °C. Ideal for embedded systems, it offers robust performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,208 parts In-Stock

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4,208

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Digiode

USA . 1,960 parts In-Stock

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1,960

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Anansix

USA . 694 parts In-Stock

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694

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Distributors (Availability)

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Vigor

Singapore . 3,500 parts In-Stock

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$4.290

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3,500

$4.290

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Microchip USA

USA . 135 parts In-Stock

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$14.838

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135

$14.838

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AZTECH Wire

Italy . 456 parts In-Stock

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$19.750

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456

$19.750

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IDEA Electronic Components Group

UK . 1,420 parts In-Stock

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$45.511

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$40.960

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1,420

$45.511

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$40.960

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MKK Technologies

India . 374 parts In-Stock

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$85.581

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374

$85.581

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DigiPath Technology Company

USA . 374 parts In-Stock

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$85.581

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374

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Component Stockers USA

USA . 512 parts In-Stock

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$99.990

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512

$99.990

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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A-Z Elektronik GmbH

Germany . 5,997 parts In-Stock

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Kepictronics

USA . 3,200 parts In-Stock

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GreenTree Electronics

Israel . 2,900 parts In-Stock

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Perfect Parts

USA . 2,212 parts In-Stock

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Parana Technologies

USA . 1,920 parts In-Stock

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$54.416

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$54.416

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Assy Fe

Spain . 980 parts In-Stock

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980

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Corphita

USA . 935 parts In-Stock

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935

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Overview

Unlock endless possibilities with the ST7FLITE20F2B6 microcontroller from STMicroelectronics, a leader in innovation and quality. Renowned for their robust performance and reliability, this versatile microcontroller is perfect for industrial applications where precision matters. With low power consumption and a wide operating temperature range, it enhances efficiency while ensuring longevity. Elevate your projects with proven technology that delivers value and efficiency every step of the way!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it suitable for industrial applications.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V allows for flexibility in power sourcing, making it compatible with a variety of systems.

Package Shape: RECTANGULAR

The rectangular package shape is convenient for PCB layout and accommodates efficient stacking in devices.

Bit Size: 8

An 8-bit architecture is effective for simple control tasks, offering a balance between performance and complexity.

Power Supplies: 3/5

Support for both 3V and 5V power supplies adds versatility, allowing it to fit in different design requirements.

No. of Terminals: 20

With 20 terminals, it provides sufficient I/O capabilities while keeping the design compact.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy integration onto PCBs and aligns with standard mounting practices.

Minimum Supply Voltage: 3.3 V

A minimum supply voltage of 3.3 V supports low-power applications, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in high-temperature environments commonly found in industrial settings.

CPU Family: ST72

The ST72 CPU family is known for its robust performance and extensive application in consumer and industrial markets.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C makes it ideal for extreme environments, ensuring consistent functionality.

Terminal Finish: MATTE TIN

Matte tin terminal finishes provide good solderability and enhanced corrosion resistance, contributing to longevity.

ADC Channels: YES

Availability of ADC channels allows for direct sensor interfacing, making it versatile for various applications.

Terminal Position: DUAL

Dual terminal position enhances design flexibility, allowing for versatile mounting options.

ROM Words: 8192

With 8192 ROM words, there’s ample storage for most software applications, facilitating complex handling.

Maximum Seated Height: 5.33 mm

A seated height of 5.33 mm is suitable for compact designs, ensuring more efficient use of space.

Width: 7.62 mm

The width of 7.62 mm contributes to a compact design, allowing for space-efficient layouts in smaller devices.

Peripherals: TIMER(4)

The inclusion of four timers provides advanced timing functions, useful for various applications such as motor control.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz delivers adequate processing speed for many control applications, enhancing overall performance.

Length: 26.16 mm

The length of 26.16 mm supports compact designs while providing enough terminals for functional versatility.

Temperature Grade: INDUSTRIAL

Rated at an industrial temperature grade ensures reliability in harsher environmental conditions.

Peripheral IC Type: MICROCONTROLLER

This microcontroller type is well-suited for embedded systems, enabling intelligent control and integration features.

RAM Bytes: 384

With 384 bytes of RAM, the device is capable of handling moderate data processing tasks effectively.

Technology: CMOS

CMOS technology ensures low power consumption, which is critical for battery-powered and energy-sensitive applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust and reliable connections, widely favored in prototyping and more permanent installations.

Analog To Digital Converters: 7-Ch 10-Bit

7 channels with 10-bit ADC resolution ensure high accuracy in data acquisition from analog sources, making it suitable for sensor applications.

Maximum Supply Current: 12 mA

A maximum supply current of 12 mA indicates low power consumption, contributing to energy efficiency.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard for many digital systems, ensuring easy compatibility with existing components.

PWM Channels: YES

The presence of PWM channels allows for fine control in driving motors and other actuators, enhancing functionality.

Connectivity: SPI

SPI connectivity enables fast and efficient communication between devices, making it suitable for high-speed data transfer applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy software updates and modifications, extending product lifecycle.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is compatible with industry-standard components, enhancing design flexibility.

Speed: 8 rpm

The 8 rpm speed capability signals suitability for lower speed control applications, particularly in motors.

On Chip Program ROM Width: 8

An 8-bit ROM width supports simpler programming and integration, beneficial for many embedded projects.

No. of I/O Lines: 15

Fifteen I/O lines are sufficient for a majority of embedded applications, allowing for versatile interfacing options.

Technical Specifications

Microcontrollers ST7FLITE20F2B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.4V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.16 mm

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.4

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

5.33 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLITE20F2B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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