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ST7FLIT19BY0M6

STMicroelectronics

ST7FLIT19BY0M6 by STMicroelectronics

ST7FLIT19BY0M6 microcontroller from STMicroelectronics features an 8-bit CPU with a max supply voltage of 5.5V and operates in temperatures from -40 °C to 85 °C. It includes 5 ADC channels and supports SPI connectivity, making it ideal for industrial applications. With a compact SO package, it’s perfect for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,881 parts In-Stock

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3,881

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Vyrian

USA . 2,333 parts In-Stock

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2,333

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Anansix

USA . 1,885 parts In-Stock

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1,885

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

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20

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Distributors (Availability)

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AZTECH Wire

Italy . 413 parts In-Stock

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$20.450

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413

$20.450

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IDEA Electronic Components Group

UK . 2,087 parts In-Stock

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$33.003

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$29.703

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2,087

$33.003

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$29.703

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MKK Technologies

India . 556 parts In-Stock

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$62.060

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556

$62.060

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DigiPath Technology Company

USA . 556 parts In-Stock

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$62.060

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556

$62.060

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QUARKTWIN TECHNOLOGY LTD

USA . 6,376 parts In-Stock

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Microchip USA

USA . 4,117 parts In-Stock

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Corphita

USA . 3,565 parts In-Stock

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Vigor

Singapore . 3,000 parts In-Stock

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Parana Technologies

USA . 2,241 parts In-Stock

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$39.460

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Perfect Parts

USA . 1,152 parts In-Stock

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Overview

Elevate your projects with the ST7FLIT19BY0M6 microcontroller from STMicroelectronics—where innovation meets reliability. Designed for versatility, this compact powerhouse excels in industrial applications, offering exceptional performance at low power consumption. With robust features like integrated ADC channels and multiple peripherals, it ensures seamless connectivity and efficient operation. Trust in STMicroelectronics’ quality to enhance your designs and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliability in various environments.

Surface Mount: YES

Allows for efficient PCB space utilization and automated assembly processes.

Maximum Supply Voltage: 5.5 V

Offers flexibility in power supply options for different applications.

Package Shape: RECTANGULAR

Standardized shape for easy integration into various designs.

Bit Size: 8

Ideal for simple control tasks and low-power applications.

Power Supplies (V): 3/5

Compatible with both 3V and 5V applications, enhancing versatility.

No. of Terminals: 16

Provides ample connectivity options for peripherals and I/O operations.

Package Style (Meter): SMALL OUTLINE

Compact form factor making it suitable for space-constrained designs.

Minimum Supply Voltage: 3.3 V

Supports low-voltage systems, which helps in reducing power consumption.

Maximum Operating Temperature: 85 °C

Suitable for commercial applications that require moderate heat resistance.

CPU Family: ST72

Part of a well-established family known for reliability and support.

Minimum Operating Temperature: -40 °C

Ideal for industrial applications that expose the device to extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent corrosion resistance and reliable electrical contact.

ADC Channels: YES

Onboard ADC allows for direct input of analog signals, simplifying designs.

Terminal Position: DUAL

Facilitates easier PCB layout and design, optimizing space and connectivity.

ROM Words: 2048

Provides sufficient memory for code storage in complex applications.

Maximum Seated Height: 2.65 mm

Low profile design helps in reducing the overall form factor of devices.

Width: 7.5 mm

Compact width is advantageous in tight spaces on PCBs.

Data EEPROM Size: 128

Allows for storage of small amounts of data, useful for configuration settings.

Peripherals: COMPARATOR, TIMER(5)

Multiple integrated peripherals enhance functionality without adding components.

Maximum Clock Frequency: 16 MHz

Offers a balance between speed and power efficiency for most applications.

Maximum Time At Peak Reflow Temperature (s): 30

Accommodates standard soldering processes for reliable assembly.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes, promoting environmental compliance.

Length: 10.3 mm

Small length helps in keeping the overall device dimensions compact.

Temperature Grade: INDUSTRIAL

Designed for robustness in industrial applications, ensuring longevity and reliability.

Peripheral IC Type: MICROCONTROLLER

Versatile for a wide range of embedded applications.

RAM Bytes: 256

Provides sufficient RAM for handling simple data processing tasks.

Technology: CMOS

Ensures low power consumption and high integration density.

Terminal Form: GULL WING

Facilitates easy soldering and manufacturing processes.

Analog To Digital Converters: 5-Ch 10-Bit

Multiple ADC channels allow for versatile signal processing capabilities.

Maximum Supply Current: 9 mA

Low current consumption enhances battery life in portable applications.

Nominal Supply Voltage: 5 V

Common voltage level facilitates widespread application compatibility.

PWM Channels: YES

Integrated PWM support is essential for motor control and signal generation.

Connectivity: SPI

Supports high-speed data transfer rates for communication with peripherals.

ROM Programmability: FLASH

Allows for in-system reprogramming, which simplifies updates and development.

Terminal Pitch: 1.27 mm

Standardized terminal pitch aids in compatibility with common PCB designs.

Moisture Sensitivity Level (MSL): 3

Appropriate for typical manufacturing environments, ensuring handling safety.

Speed: 8 rpm

Suitable for applications requiring controlled motion at low speeds.

On Chip Program ROM Width: 8

Supports various data formats and simplifies code development.

No. of I/O Lines: 17

Provides flexibility for various I/O requirements in embedded systems.

Technical Specifications

Microcontrollers ST7FLIT19BY0M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

17

No. of Terminals:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

SPI

Peripherals:

COMPARATOR, TIMER(5)

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

ST7FLIT19BY0M6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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