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ST62T62CM3

STMicroelectronics

ST62T62CM3 by STMicroelectronics

ST62T62CM3 by STMicroelectronics is an 8-bit microcontroller with 1836 ROM words, 128 RAM bytes, and 9 I/O lines. It operates at a max clock frequency of 8 MHz and has PWM channels for automotive applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,545 parts In-Stock

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3,545

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Digiode

USA . 3,001 parts In-Stock

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3,001

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Anansix

USA . 681 parts In-Stock

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681

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Distributors (Availability)

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Microchip USA

USA . 348 parts In-Stock

1+ parts

$4.834

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348

$4.834

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AZTECH Wire

Italy . 723 parts In-Stock

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$21.190

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723

$21.190

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IDEA Electronic Components Group

UK . 2,149 parts In-Stock

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$52.477

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$47.229

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2,149

$52.477

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$47.229

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MKK Technologies

India . 1,473 parts In-Stock

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$98.679

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1,473

$98.679

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DigiPath Technology Company

USA . 1,473 parts In-Stock

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$98.679

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1,473

$98.679

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Corphita

USA . 4,201 parts In-Stock

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4,201

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Vigor

Singapore . 1,609 parts In-Stock

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1,609

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Parana Technologies

USA . 537 parts In-Stock

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$62.744

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537

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$62.744

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Overview

The ST62T62CM3 by STMicroelectronics is a high-quality microcontroller offering exceptional value and performance. With a small outline package and dual terminal position, this product is perfect for a wide range of applications in the automotive industry. Boasting a maximum clock frequency of 8 MHz and PWM channels, this microcontroller provides customers with the speed and functionality they need. Trust in STMicroelectronics' reputation for excellence and innovation to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material helps in reducing cost and making the product lightweight.

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly.

Maximum Supply Voltage: 6 V

Ability to handle a maximum supply voltage of 6V makes this microcontroller suitable for a wide range of applications.

Bit Size: 8

8-bit architecture provides enough computational power for various embedded systems applications.

Power Supplies (V): 3.3/5

Compatibility with 3.3V and 5V power supplies allows flexibility in designing circuits with different voltage requirements.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is suitable for compact electronic devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125 °C ensures reliable operation in various environmental conditions.

CPU Family: ST6200

ST6200 CPU family is known for its performance and reliability in microcontroller applications.

ADC Channels: YES

Built-in ADC channels allow analog signals to be converted to digital data for processing.

ROM Words: 1836

Significant ROM capacity of 1836 words for storing program code and data.

Maximum Clock Frequency: 8 MHz

High maximum clock frequency of 8MHz enables fast execution of instructions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals on a single chip, reducing external component count.

RAM Bytes: 128

128 bytes of RAM for data storage and manipulation during program execution.

Technology: HCMOS

HCMOS technology offers low power consumption and high noise immunity for reliable operation.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog signals for applications like motor control.

Technical Specifications

Microcontrollers ST62T62CM3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST6200

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

1836

ROM Programmability:

OTPROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST62T62CM3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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