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ST62T10CM6

STMicroelectronics

ST62T10CM6 by STMicroelectronics

ST62T10CM6 by STMicroelectronics is an 8-bit microcontroller with 3.3/5V power supplies, 64 bytes RAM, and 1836 ROM words. Ideal for industrial applications, it operates b/w -40 to 85 °C with a max clock frequency of 8MHz. The small outline package has a rectangular shape and measures 12.8mm x 7.5mm x 2.65mm, making it suitable for space-constrained designs requiring high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,126 parts In-Stock

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6,126

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Anansix

USA . 1,021 parts In-Stock

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1,021

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Chip Stock

USA . 955 parts In-Stock

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955

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Digiode

USA . 870 parts In-Stock

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870

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ComSIT Distribution GmbH

Germany . 133 parts In-Stock

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133

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Distributors (Availability)

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Microchip USA

USA . 280 parts In-Stock

1+ parts

$9.253

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-

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280

$9.253

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AZTECH Wire

Italy . 1,056 parts In-Stock

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$9.410

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1,056

$9.410

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IDEA Electronic Components Group

UK . 605 parts In-Stock

1+ parts

$16.488

100+ parts

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$14.839

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-

605

$16.488

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$14.839

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MKK Technologies

India . 1,321 parts In-Stock

1+ parts

$31.005

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1,321

$31.005

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DigiPath Technology Company

USA . 1,321 parts In-Stock

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$31.005

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1,321

$31.005

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Kepictronics

USA . 3,780 parts In-Stock

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3,780

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Parana Technologies

USA . 2,046 parts In-Stock

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$19.714

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2,046

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$19.714

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Vigor

Singapore . 1,536 parts In-Stock

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Corphita

USA . 1,113 parts In-Stock

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1,113

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Perfect Parts

USA . 560 parts In-Stock

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560

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A-Z Elektronik GmbH

Germany . 201 parts In-Stock

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Overview

Unlock the power of innovation with the ST62T10CM6 microcontroller from STMicroelectronics. With a commitment to quality and cutting-edge technology, STMicroelectronics delivers unmatched performance and reliability in the field of microcontrollers. Ideal for a wide range of applications, this versatile product offers customers exceptional value and benefits. Experience seamless integration, high-speed processing, and advanced functionality with the ST62T10CM6. Discover endless possibilities and elevate your projects to new heights with this innovative microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to impact, making the microcontroller suitable for various applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 6 V

Allows for higher power input which can support a wider range of components and peripherals.

Bit Size: 8

Provides sufficient processing power for basic to intermediate level applications.

No. of Terminals: 20

Offers flexibility in connecting to external devices and peripherals for expanded functionality.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

ROM Words: 1836

Sufficient memory capacity for storing program instructions and data.

RAM Bytes: 64

Provides temporary storage for data to be processed, enhancing the microcontroller's performance.

Peripheral IC Type: MICROCONTROLLER

The microcontroller is specifically designed for controlling various functions and devices in electronic systems.

Technical Specifications

Microcontrollers ST62T10CM6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST6200

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

12

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

64

ROM Words:

1836

ROM Programmability:

OTPROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

3.6 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST62T10CM6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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