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ST62T03CM3

STMicroelectronics

ST62T03CM3 by STMicroelectronics

ST62T03CM3 by STMicroelectronics is an 8-bit microcontroller with 1024 ROM words, 64 RAM bytes, and a max clock frequency of 8 MHz. It is used in automotive applications due to its small outline package style, dual terminal position, and nickel/palladium/gold terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 3,693 parts In-Stock

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Anansix

USA . 2,084 parts In-Stock

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Digiode

USA . 1,023 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 166 parts In-Stock

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$3.002

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166

$3.002

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AZTECH Wire

Italy . 359 parts In-Stock

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$15.320

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359

$15.320

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IDEA Electronic Components Group

UK . 534 parts In-Stock

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$56.879

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$51.191

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534

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$51.191

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Component Stockers USA

USA . 471 parts In-Stock

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$99.990

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MKK Technologies

India . 1,572 parts In-Stock

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$106.957

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$106.957

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DigiPath Technology Company

USA . 1,572 parts In-Stock

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$106.957

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$106.957

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Parana Technologies

USA . 2,234 parts In-Stock

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$68.008

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$68.008

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Vigor

Singapore . 2,147 parts In-Stock

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Corphita

USA . 1,033 parts In-Stock

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Overview

Unlock the potential of your next project with the ST62T03CM3 microcontroller by STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers a reliable solution for your design needs. This versatile microcontroller offers a wide range of applications in automotive and industrial settings, providing value and efficiency to customers. With its compact package style and advanced technology, the ST62T03CM3 is the perfect choice for your next innovation. Experience the benefits of STMicroelectronics' expertise and elevate your designs with the ST62T03CM3 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where size and weight are critical.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 6 V

The high maximum supply voltage tolerance provides flexibility in power supply options and ensures reliable operation in varying voltage conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space and easy integration into existing designs.

Bit Size: 8

An 8-bit architecture provides a good balance between performance and cost, making this microcontroller suitable for a wide range of applications.

Power Supplies (V): 3.3/5

Support for multiple power supply options (3.3V and 5V) enables compatibility with different systems and components, increasing versatility.

No. of Terminals: 16

With 16 terminals, this microcontroller offers a good number of I/O options for connecting external devices and peripherals.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for high-density board layouts, suitable for compact designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures reliable performance in demanding environments and automotive applications.

CPU Family: ST6200

Belonging to the ST6200 CPU family ensures compatibility with other devices from the same series, facilitating system integration and development.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in cold environments, making it suitable for automotive and industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish ensures reliable electrical connections and corrosion resistance, contributing to the product's durability.

ADC Channels: YES

The inclusion of ADC channels allows for analog signal processing and sensor interfacing, expanding the range of applications where this microcontroller can be used.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and component placement, enabling efficient routing of traces and connections.

ROM Words: 1024

The 1024 ROM words offer sufficient memory capacity for storing program codes and data, supporting a wide range of applications and functionalities.

Maximum Seated Height: 2.65 mm

The low maximum seated height allows for slim and compact designs, suitable for applications with space constraints or height limitations.

Width: 7.5 mm

The compact width of 7.5 mm enables the microcontroller to fit into tight spaces or small enclosures, enhancing design flexibility.

Peripherals: TIMER(2)

The inclusion of 2 timers as peripherals provides timing and control functions, enabling precise synchronization and event management in the system.

Maximum Clock Frequency: 8 MHz

The high maximum clock frequency of 8 MHz allows for fast data processing and real-time operation, enhancing the performance of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microcontroller can withstand reflow soldering processes without any issues, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C is suitable for lead-free soldering processes, meeting industry standards for environmental compliance.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification ensures reliable operation in automotive applications, meeting stringent requirements for temperature and environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with built-in peripherals, this product offers a complete solution for embedded system design, simplifying development and reducing component count.

RAM Bytes: 64

The 64 bytes of RAM provide temporary storage for data and variables during program execution, supporting efficient operation and multitasking capabilities.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption, high noise immunity, and reliable performance, making it suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and PCB mounting, ensuring secure connections and mechanical stability during operation.

Maximum Supply Current: 4.8 mA

The low maximum supply current of 4.8 mA helps in reducing power consumption and heat dissipation, making the microcontroller energy efficient and suitable for battery-operated devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides compatibility with standard power sources and voltage regulators, simplifying the design and integration process.

ROM Programmability: OTPROM

The OTPROM (One-Time Programmable Read-Only Memory) technology allows for secure and permanent storage of program code, ensuring data integrity and preventing unauthorized access.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch facilitates easy PCB layout and soldering, enabling efficient production and assembly processes.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microcontroller is resistant to moisture absorption and can withstand standard storage and handling conditions without degradation.

Speed: 8 rpm

The speed of 8 rotations per minute is not quite useful for a microcontroller, perhaps a typo, or misuse of "speed" spec.

On Chip Program ROM Width: 8

The 8-bit program ROM width allows for efficient data retrieval and processing, supporting fast and reliable execution of program instructions.

No. of I/O Lines: 9

The 9 I/O lines provide connectivity for external devices and components, enabling communication and data exchange with the microcontroller, expanding its functionality.

Technical Specifications

Microcontrollers ST62T03CM3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST6200

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

9

No. of Terminals:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

64

ROM Words:

1024

ROM Programmability:

OTPROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.8 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

TIMER(2)

Trade Compliance

ST62T03CM3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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