Loading...

ST2349IQTR

STMicroelectronics

ST2349IQTR by STMicroelectronics

ST2349IQTR by STMicroelectronics is a 16-terminal interface IC with a supply voltage range of 1.65V to 3.6V, suitable for industrial applications. It features a rectangular package style, very thin profile, and operates in temperatures ranging from -40 °C to 85°C. Ideal for surface mount assembly with a terminal pitch of 0.4mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,343

-

-

-

-

Anansix

USA . 2,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,880

-

-

-

-

Vyrian

USA . 865 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

865

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,986 parts In-Stock

1+ parts

$8.657

100+ parts

-

1k+ parts

$7.791

10k+ parts

-

1,986

$8.657

-

$7.791

-

MKK Technologies

India . 613 parts In-Stock

1+ parts

$16.279

100+ parts

-

1k+ parts

-

10k+ parts

-

613

$16.279

-

-

-

DigiPath Technology Company

USA . 613 parts In-Stock

1+ parts

$16.279

100+ parts

-

1k+ parts

-

10k+ parts

-

613

$16.279

-

-

-

Corphita

USA . 4,046 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,046

-

-

-

-

Parana Technologies

USA . 393 parts In-Stock

1+ parts

-

100+ parts

$10.351

1k+ parts

-

10k+ parts

-

393

-

$10.351

-

-

Overview

Discover the innovative ST2349IQTR by STMicroelectronics, a cutting-edge interface circuit designed to enhance your electronic devices. With its sleek rectangular chip carrier package and industrial-grade temperature tolerance, this product ensures reliability and durability in any application. Whether you're looking to improve communication interfaces or streamline data processing, the ST2349IQTR offers unmatched performance and efficiency. Trust in STMicroelectronics' reputation for excellence and unlock the full potential of your projects with this versatile solution. Elevate your electronics with the ST2349IQTR today.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and secure mounting onto a PCB, making installation and assembly much simpler.

Maximum Supply Voltage: 3.6 V

Can handle a higher supply voltage, providing flexibility and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB, optimizing the overall design layout.

No. of Terminals: 16

Having 16 terminals provides versatility in connectivity options, allowing for diverse applications.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The chip carrier style with a very thin profile saves space and promotes a compact design for the product.

Minimum Supply Voltage: 1.65 V

With a low minimum supply voltage requirement, this IC can operate efficiently even at lower power levels.

Maximum Operating Temperature: 85 °C

Being able to operate at up to 85 °C makes this IC suitable for industrial applications with varying temperature demands.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC can withstand harsh environmental conditions.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections, ensuring reliable performance.

Maximum Seated Height: 0.6 mm

The low seated height contributes to a slim profile, enabling space-saving integration in compact devices.

Width: 1.8 mm

The narrow width of 1.8 mm facilitates easy placement and routing on the PCB, enhancing design flexibility.

Length: 2.6 mm

The compact length of 2.6 mm further contributes to space efficiency in the product design.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperature conditions, ensuring reliable operation in demanding environments.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of solder joints cracking, enhancing the durability and longevity of the product.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4 mm allows for dense packing on the PCB, enabling high functionality in a small footprint.

Interface IC Type: INTERFACE CIRCUIT

The specific type of interface circuit ensures seamless communication between different components, enhancing overall system performance.

Technical Specifications

Other Function Interface ICs ST2349IQTR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRED VCC = 1.8V TO 5.5V SUPPLY RANGE

Interface IC Type:

JESD-30 Code:

R-XQCC-N16

Length:

2.6 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

1.8 mm

Trade Compliance

ST2349IQTR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 9