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ST2349AQTR

STMicroelectronics

ST2349AQTR by STMicroelectronics

ST2349AQTR from STMicroelectronics is a versatile interface IC with a max supply voltage of 5.5V and operates in temperatures from -40 °C to 85 °C. It features a compact, very thin profile package (2.6mm x 1.8mm) with 16 terminals. Ideal for industrial applications requiring reliable performance in constrained spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 6,232 parts In-Stock

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PC Components Company LLC

USA . 1,844 parts In-Stock

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Bristol Electronics

USA . 1,844 parts In-Stock

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Anansix

USA . 1,115 parts In-Stock

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Digiode

USA . 1,004 parts In-Stock

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North Shore Components

USA . 44 parts In-Stock

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IDEA Electronic Components Group

UK . 203 parts In-Stock

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$2.101

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$1.891

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Microchip USA

USA . 177 parts In-Stock

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$3.114

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MKK Technologies

India . 167 parts In-Stock

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$3.951

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DigiPath Technology Company

USA . 167 parts In-Stock

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$3.951

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AZTECH Wire

Italy . 679 parts In-Stock

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$13.110

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Perfect Parts

USA . 13,891 parts In-Stock

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Corphita

USA . 3,626 parts In-Stock

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Parana Technologies

USA . 2,012 parts In-Stock

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Overview

Unlock the potential of your designs with the ST2349AQTR from STMicroelectronics, a leader in semiconductor innovation. This ultra-thin interface IC is engineered for versatility and reliability, making it ideal for industrial applications where performance matters. With a robust operating range and superior thermal performance, you can trust its quality to enhance your projects, streamline production, and drive efficiency. Elevate your next creation with unparalleled value and seamless integration!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design makes this IC suitable for modern compact circuit layouts, enhancing space efficiency in your application.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for various power supply configurations in both commercial and industrial applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on printed circuit boards (PCBs), allowing for effective arrangement of other components.

Power Supplies (V): 2/5

Support for dual voltage supplies (2/5 V) enhances the IC's versatility, enabling it to work with different system power levels.

No. of Terminals: 16

Having 16 terminals allows for a rich set of connections for interfacing, making the IC capable of performing complex functions.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile of the chip carrier package is ideal for space-constrained designs, further enhancing building compact electronics.

Minimum Supply Voltage: 1.8 V

With a minimum supply voltage of 1.8 V, this IC is suitable for low-power applications, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

The IC's ability to operate at temperatures up to 85 °C makes it suitable for many industrial applications, ensuring reliability in higher heat conditions.

Minimum Operating Temperature: -40 °C

Suitable for extreme environments, operating as low as -40 °C ensures the IC can be used in harsh conditions without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish promotes reliability and longevity in connections, reducing oxidation and enhancing solderability.

Terminal Position: QUAD

The quad terminal position facilitates efficient workaround for PCB layouts, allowing for better design flexibility.

Maximum Seated Height: 0.6 mm

A maximum seated height of 0.6 mm is advantageous for low-profile designs, enabling slimmer electronic devices.

Width: 1.8 mm

At just 1.8 mm wide, this IC allows for denser packing of components on the PCB, maximizing space utilization.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds allows for compatibility with various soldering processes, ensuring efficient manufacturing.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this IC can withstand modern soldering techniques, ensuring a strong and reliable bond.

Length: 2.6 mm

The compact length of 2.6 mm makes this IC perfect for designs where minimizing dimensions is crucial.

Temperature Grade: INDUSTRIAL

Industrial temperature grading assures the IC can reliably function in demanding applications, suitable for extended environmental conditions.

Terminal Form: NO LEAD

The no-lead terminal form enhances the IC's thermal performance and reduces parasitic capacitance, improving overall efficiency.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm allows for dense layouts, making it easier to integrate other components close together.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit type makes this IC essential for communication between different parts of a system, improving overall system integration.

Technical Specifications

Other Function Interface ICs ST2349AQTR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-XQCC-N16

JESD-609 Code:

e4

Length:

2.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.07X.1,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.8 mm

Trade Compliance

ST2349AQTR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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