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ST2329QTR

STMicroelectronics

ST2329QTR by STMicroelectronics

ST2329QTR by STMicroelectronics is a surface mount IC with 16 terminals. It operates b/w -40 to 85 °C and supports supply voltages from 1.65V to 5.5V. Widely used in industrial applications as an interface circuit due to its compact size and high-temperature tolerance.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Vyrian

USA . 6,398 parts In-Stock

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Digiode

USA . 4,679 parts In-Stock

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4,679

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Inventory MP

USA . 2,588 parts In-Stock

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2,588

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Bristol Electronics

USA . 2,588 parts In-Stock

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2,588

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ACDS - Activité Composants Distribution Service

France . 2,356 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Anansix

USA . 355 parts In-Stock

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355

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Elcom Components

USA . 258 parts In-Stock

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IDEA Electronic Components Group

UK . 1,838 parts In-Stock

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$5.695

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$5.125

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$5.695

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$5.125

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Ampacity Inc.

Singapore . 871 parts In-Stock

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$6.500

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871

$6.500

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MKK Technologies

India . 1,981 parts In-Stock

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$10.709

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DigiPath Technology Company

USA . 1,981 parts In-Stock

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$10.709

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AZTECH Wire

Italy . 226 parts In-Stock

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$13.673

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Perfect Parts

USA . 7,147 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,967 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 730 parts In-Stock

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Parana Technologies

USA . 475 parts In-Stock

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$6.809

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475

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$6.809

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Overview

Experience seamless and reliable connectivity with the ST2329QTR by STMicroelectronics. As a leader in innovative technology solutions, STMicroelectronics delivers top-quality interface ICs like the ST2329QTR, designed to meet the highest industry standards. Ideal for various applications, this chip carrier with a very thin profile offers exceptional performance and durability. Trust STMicroelectronics to provide you with cutting-edge products that enhance your electronic devices and systems, ensuring optimal functionality and efficiency. Elevate your projects with the ST2329QTR and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape is common and easy to handle for PCB layout and design.

Power Supplies (V): 2/5

Supports multiple power supply configurations, providing flexibility in system design.

Maximum Operating Temperature: 85 °C

Can operate reliably at high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures, making it suitable for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable performance.

Maximum Seated Height: 0.55 mm

Low profile package design saves space and is suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature and reliability requirements for robust performance.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing functions, ensuring compatibility and smooth operation in electronic systems.

Technical Specifications

Other Function Interface ICs ST2329QTR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-XQCC-N16

JESD-609 Code:

e4

Length:

1.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC10,.06X.07,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.4 mm

Trade Compliance

ST2329QTR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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