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ST2329BQTR

STMicroelectronics

ST2329BQTR by STMicroelectronics

ST2329BQTR by STMicroelectronics is a surface mount interface IC with 8 terminals. It operates b/w -40 to 85 °C, with supply voltage range of 1.65-3.6V. Ideal for industrial applications requiring very thin profile chip carrier package style.

Median Price

$0.406

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,093 parts In-Stock

1+ parts

$0.389

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2,093

$0.389

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Chip1Stop

Japan . 2,122 parts In-Stock

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$0.671

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2,122

$0.671

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DigiKey

USA . 2,757 parts In-Stock

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$0.422

2,757

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$0.422

Verical

USA . 2,093 parts In-Stock

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$0.389

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2,093

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$0.389

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Distributors (In-Stock)

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Digiode

USA . 4,918 parts In-Stock

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$0.365

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4,918

$0.365

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Vyrian

USA . 2,370 parts In-Stock

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$0.384

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2,370

$0.384

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Bristol Electronics

USA . 2,247 parts In-Stock

1+ parts

-

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$0.418

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$0.312

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$0.290

2,247

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$0.418

$0.312

$0.290

Dan-Mar Components

USA . 2,247 parts In-Stock

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Anansix

USA . 2,096 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 664 parts In-Stock

1+ parts

$0.346

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664

$0.346

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Microchip USA

USA . 434 parts In-Stock

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$1.310

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434

$1.310

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IDEA Electronic Components Group

UK . 1,158 parts In-Stock

1+ parts

$3.535

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$3.181

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1,158

$3.535

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$3.181

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MKK Technologies

India . 257 parts In-Stock

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$6.647

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257

$6.647

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DigiPath Technology Company

USA . 257 parts In-Stock

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$6.647

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257

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Perfect Parts

USA . 9,802 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 586 parts In-Stock

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$4.226

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586

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$4.226

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Kepictronics

USA . 341 parts In-Stock

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341

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Overview

Enhance your electronic designs with the ST2329BQTR by STMicroelectronics, a top-quality interface IC that offers exceptional performance and reliability. Manufactured by industry leader STMicroelectronics, this surface mount IC is perfect for a variety of applications in the technology sector. With its compact design, low power consumption, and wide operating temperature range, the ST2329BQTR provides great value and benefits to customers looking for a high-quality solution. Upgrade your projects with this versatile interface circuit and experience the advantages it brings to your designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient placement on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile and compatible with various systems.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor, ideal for space-constrained applications.

Power Supplies (V): 1.8/3.3

Dual power supply options allow for flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components in the circuit.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Thin profile design saves space and allows for close placement to other components on the board.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage allows for operation in low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme cold environments.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections.

Maximum Seated Height: 0.6 mm

Low seated height allows for a sleek and compact design.

Width: 1.2 mm

Narrow width saves space on the circuit board.

Length: 1.4 mm

Short length enables compact placement on the board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures durability and reliability in harsh environments.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly and RoHS compliant design.

Terminal Pitch: 0.4 mm

Small terminal pitch allows for high-density mounting and integration in tight spaces.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuits, ensuring optimized performance in signal processing and communication applications.

Technical Specifications

Other Function Interface ICs ST2329BQTR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRED VCC = 1.8 TO 5.5V SUPPLY RANGE

Interface IC Type:

JESD-30 Code:

R-XQCC-N8

Length:

1.4 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC8,.05X.06,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

1.2 mm

Trade Compliance

ST2329BQTR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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