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ST2329AQTR

STMicroelectronics

ST2329AQTR by STMicroelectronics

ST2329AQTR from STMicroelectronics is a compact interface IC designed for industrial applications. It operates b/w 1.65V and 3.6V, with a max temp of 85 °C and features a very thin profile (0.55mm height). Ideal for space-constrained environments, it supports surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 112,500 parts In-Stock

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112,500

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Vyrian

USA . 7,366 parts In-Stock

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7,366

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Digiode

USA . 4,900 parts In-Stock

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4,900

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Anansix

USA . 1,639 parts In-Stock

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1,639

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Benley Electronics

USA . 2 parts In-Stock

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$1.750

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2

$1.750

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Microchip USA

USA . 392 parts In-Stock

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$3.179

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392

$3.179

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IDEA Electronic Components Group

UK . 1,741 parts In-Stock

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$3.741

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-

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$3.367

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1,741

$3.741

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$3.367

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MKK Technologies

India . 1,539 parts In-Stock

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$7.034

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1,539

$7.034

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DigiPath Technology Company

USA . 1,539 parts In-Stock

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$7.034

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1,539

$7.034

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AZTECH Wire

Italy . 1,052 parts In-Stock

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$11.700

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1,052

$11.700

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Perfect Parts

USA . 26,778 parts In-Stock

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26,778

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S.R.D Solutions

India . 3,200 parts In-Stock

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3,200

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A-Z Elektronik GmbH

Germany . 2,583 parts In-Stock

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Assy Fe

Spain . 1,646 parts In-Stock

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Authorized Procurement Solutions

USA . 1,170 parts In-Stock

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Parana Technologies

USA . 886 parts In-Stock

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$4.473

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886

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Corphita

USA . 549 parts In-Stock

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549

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Kepictronics

USA . 390 parts In-Stock

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390

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Overview

Experience unparalleled performance with the ST2329AQTR from STMicroelectronics, a leader in innovative solutions. This compact interface IC delivers exceptional reliability in demanding environments, making it perfect for industrial applications. With impressive temperature resilience and low power consumption, it enhances system efficiency while ensuring durability. Trust STMicroelectronics for quality that drives your projects forward—choose ST2329AQTR for a smarter, more efficient future!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making the product suitable for a range of applications.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into modern PCB designs, enhancing manufacturing efficiency.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power applications.

Package Shape: RECTANGULAR

The rectangular package shape maximizes space efficiency on the PCB, allowing for better layout options.

Power Supplies (V): 2/5

Support for both 2V and 5V power supplies offers flexibility for various electronic designs.

No. of Terminals: 10

Having 10 terminals provides sufficient connectivity options for complex interfacing needs.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The thin profile design is ideal for space-constrained applications, contributing to modern, compact device designs.

Minimum Supply Voltage: 1.65 V

A minimum supply voltage of 1.65 V allows operation in low-voltage environments, making it energy-efficient.

Maximum Operating Temperature: 85 °C

Capable of operating at temperatures up to 85 °C makes the product suitable for industrial applications where heat is a consideration.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C ensures reliability in extreme temperatures, ideal for harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish enhances solderability and ensures a reliable electrical connection over time.

Terminal Position: DUAL

Dual terminal positioning helps to streamline the device integration on multi-layer PCBs.

Maximum Seated Height: 0.55 mm

A low maximum seated height allows for minimized profile on PCBs, essential for ultra-thin electronic devices.

Width: 1.4 mm

Compact width supports high-density circuit designs, making it easier to fit into smaller applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds minimizes thermal stress to components during assembly, improving longevity.

Peak Reflow Temperature: 260 °C

The ability to withstand high reflow temperatures ensures compatibility with lead-free solder processes.

Length: 1.8 mm

Its short length contributes to a compact design, making it an excellent choice for space-limited applications.

Temperature Grade: INDUSTRIAL

Being industrial-grade means this IC is engineered to perform reliably under various industrial conditions.

Terminal Form: NO LEAD

No-lead configuration enhances thermal performance and reduces PCB footprint, allowing for greater design flexibility.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch accommodates modern, high-density designs, making it suitable for advanced electronic applications.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit type IC, it is specifically designed for effective communication between different electrical components.

Technical Specifications

Other Function Interface ICs ST2329AQTR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N10

JESD-609 Code:

e4

Length:

1.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC10,.06X.07,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.4 mm

Trade Compliance

ST2329AQTR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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