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ST16C32245TBR

STMicroelectronics

ST16C32245TBR by STMicroelectronics

ST16C32245TBR from STMicroelectronics is a 14-bit bus driver with a propagation delay of just 5.8 ns, ideal for high-speed applications. It operates within a supply voltage range of 1.65-2.7 V and supports bidirectional data transfer. This compact, thin-profile device is perfect for industrial use in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,864 parts In-Stock

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6,864

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Digiode

USA . 3,532 parts In-Stock

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3,532

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Anansix

USA . 2,454 parts In-Stock

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2,454

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,989 parts In-Stock

1+ parts

$3.253

100+ parts

-

1k+ parts

$3.123

10k+ parts

$3.123

5,989

$3.253

-

$3.123

$3.123

Microchip USA

USA . 247 parts In-Stock

1+ parts

$15.995

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-

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247

$15.995

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AZTECH Wire

Italy . 582 parts In-Stock

1+ parts

$19.590

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582

$19.590

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IDEA Electronic Components Group

UK . 431 parts In-Stock

1+ parts

$22.707

100+ parts

-

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$20.437

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431

$22.707

-

$20.437

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MKK Technologies

India . 2,073 parts In-Stock

1+ parts

$42.700

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2,073

$42.700

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DigiPath Technology Company

USA . 2,073 parts In-Stock

1+ parts

$42.700

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2,073

$42.700

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Corphita

USA . 3,734 parts In-Stock

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3,734

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GreenTree Electronics

Israel . 2,900 parts In-Stock

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2,900

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A-Z Elektronik GmbH

Germany . 2,100 parts In-Stock

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2,100

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Parana Technologies

USA . 1,205 parts In-Stock

1+ parts

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$27.150

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1,205

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$27.150

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Authorized Procurement Solutions

USA . 697 parts In-Stock

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697

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Overview

Unlock unparalleled performance with the ST16C32245TBR from STMicroelectronics, a trusted leader in semiconductor innovation. This advanced bus driver and transceiver delivers exceptional speed and reliability, ideal for demanding applications in industrial environments. Experience seamless data communication with reduced power consumption, ensuring efficiency and longevity. Elevate your projects with this robust solution that embodies quality and performance, enhancing your designs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, ensuring reliable performance.

Propagation Delay At Nominal Supply: 5.8 ns

A low propagation delay facilitates faster signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount compatibility allows for easier integration into compact designs, saving space on PCBs.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout on PCBs, aiding in efficient space utilization.

No. of Bits: 14

With 14 bits, this product can handle a significant amount of data, which is beneficial for various applications requiring multi-bit transfer.

Nominal Supply Voltage / Vsup (V): 1.8

A nominal supply voltage of 1.8V ensures low power consumption, ideal for battery-powered devices.

Load Capacitance (CL): 30 pF

A load capacitance of 30 pF contributes to faster signal propagation, improving overall circuit performance.

Power Supplies (V): 1.8/2.5, 2.5/3.3

Versatile power supply options enhance compatibility with various system architectures.

No. of Terminals: 42

Having 42 terminals provides ample connection points, allowing for extensive interfacing options in complex applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The thin profile and fine pitch design allow for high-density mounting, essential in modern electronic designs.

Maximum I (ol): 6 Amp

With a maximum output current of 6 Amps, this product can drive larger loads without compromising performance.

Propagation Delay (tpd): 6.2 ns

The propagation delay of 6.2 ns ensures rapid switching, suitable for high-speed signal applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable operation in demanding industrial environments.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output with series resistors provides flexibility in circuit design, enabling multiple devices to share a bus.

Minimum Operating Temperature: -40 °C

The wide operating temperature range (-40 °C) ensures reliability in extreme environmental conditions.

Terminal Finish: TIN LEAD

Tin-lead terminal finish offers excellent solderability and compatibility with traditional assembly processes.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient heat dissipation, which is important for power handling.

No. of Ports: 2

With two ports, this device allows for bidirectional communication, enhancing its versatility in applications.

Maximum Seated Height: 1.16 mm

A low seated height is ideal for space-constrained designs, facilitating smoother integration into compact devices.

Width: 3.5 mm

A slim width helps to minimize the overall footprint in electronic designs.

Output Polarity: TRUE

True output polarity provides consistent logic levels, crucial for reliable operation in digital systems.

Minimum Supply Voltage (Vsup): 1.65 V

The minimum supply voltage of 1.65V ensures compatibility with low-voltage designs, enhancing energy efficiency.

Length: 4 mm

The compact length is advantageous for fitting into tight spaces on a circuit board.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures that this product is built to withstand harsh operating conditions.

Technology: CMOS

CMOS technology provides high noise immunity and low power consumption, making it suitable for a wide range of applications.

Terminal Form: BALL

Ball terminal form allows for efficient soldering and better thermal and electrical performance.

Packing Method: TR

Tape and reel packing allows for automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm facilitates high-density designs while maintaining reliable connections.

Count Direction: BIDIRECTIONAL

Bidirectional count direction offers flexibility in data transfer, making this product versatile for various applications.

Control Type: COMMON CONTROL

Common control type simplifies circuit design and integration, streamlining system development.

Maximum Supply Voltage (Vsup): 2.7 V

A maximum supply voltage of 2.7V allows for operation in a broader range of existing electronic systems.

Technical Specifications

Bus Driver & Transceivers ST16C32245TBR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

2.3V TO 3.6V SUPPLY FOR PORT A

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

CMOS

JESD-30 Code:

R-PBGA-B42

JESD-609 Code:

e0

Length:

4 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

14

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA42,6X7,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Power Supplies (V):

1.8/2.5,2.5/3.3

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.16 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Translation:

N/A

Width:

3.5 mm

Trade Compliance

ST16C32245TBR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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