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ST16C32245TBR-E

STMicroelectronics

ST16C32245TBR-E by STMicroelectronics

ST16C32245TBR-E by STMicroelectronics is a 14-bit bus driver with a 6.2 ns propagation delay, ideal for industrial applications. It operates b/w 1.65V and 2.7V, ensuring reliable performance in extreme temperatures from -40 °C to 85 °C. Its compact grid array design facilitates efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 21,000 parts In-Stock

1+ parts

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21,000

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Vyrian

USA . 5,026 parts In-Stock

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5,026

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Anansix

USA . 664 parts In-Stock

1+ parts

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664

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Digiode

USA . 72 parts In-Stock

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72

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 694 parts In-Stock

1+ parts

$2.830

100+ parts

-

1k+ parts

$2.717

10k+ parts

$2.717

694

$2.830

-

$2.717

$2.717

AZTECH Wire

Italy . 1,011 parts In-Stock

1+ parts

$9.430

100+ parts

-

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1,011

$9.430

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IDEA Electronic Components Group

UK . 2,131 parts In-Stock

1+ parts

$26.529

100+ parts

-

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$23.876

10k+ parts

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2,131

$26.529

-

$23.876

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MKK Technologies

India . 404 parts In-Stock

1+ parts

$49.886

100+ parts

-

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404

$49.886

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DigiPath Technology Company

USA . 404 parts In-Stock

1+ parts

$49.886

100+ parts

-

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404

$49.886

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Microchip USA

USA . 4,131 parts In-Stock

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4,131

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Corphita

USA . 3,538 parts In-Stock

1+ parts

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3,538

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GreenTree Electronics

Israel . 2,700 parts In-Stock

1+ parts

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2,700

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

1+ parts

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1,800

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Parana Technologies

USA . 623 parts In-Stock

1+ parts

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100+ parts

$31.720

1k+ parts

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623

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$31.720

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Authorized Procurement Solutions

USA . 400 parts In-Stock

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400

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Overview

Discover unparalleled performance with the ST16C32245TBR-E from STMicroelectronics—your ultimate solution for high-quality bus driving and transceiving. Renowned for their innovation and reliability, STMicroelectronics ensures that this 14-bit device excels in demanding industrial applications while offering low power consumption and robust functionality. Elevate your projects with a component designed for efficiency, versatility, and unmatched durability, making it an exceptional choice for engineers seeking value without compromise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection against environmental factors, making the product suitable for various applications.

Surface Mount: YES

The surface mount design allows for easier integration into compact circuit boards, enhancing design flexibility.

Package Shape: RECTANGULAR

The rectangular shape maximizes space efficiency on Printed Circuit Boards (PCBs), helping to minimize the overall footprint.

No. of Bits: 14

A 14-bit configuration allows for higher data throughput, making it suitable for applications that require fast and efficient data handling.

Nominal Supply Voltage / Vsup (V): 2.3

This nominal voltage is well-aligned with modern digital circuits, ensuring compatibility and reducing power consumption.

No. of Terminals: 42

42 terminals provide ample connectivity options, facilitating complex designs and a wide range of applications.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

The thin profile and fine pitch design optimize space utilization on the PCB while allowing for high-density connections.

Propagation Delay (tpd): 6.2 ns

A low propagation delay contributes to fast signal processing, making this product ideal for high-speed applications.

Maximum Operating Temperature: 85 °C

This temperature range ensures reliability in demanding environments, catering to industrial applications.

Output Characteristics: 3-STATE

The 3-state output functionality enhances versatility in circuit design, allowing multiple devices to share the same communication lines.

Minimum Operating Temperature: -40 °C

The extended temperature range makes this product suitable for harsh conditions, ensuring functionality in extreme environments.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies connections to the PCB, making assembly more efficient.

No. of Ports: 2

Having multiple ports enables connecting to several devices or circuits, enhancing the overall functionality.

Maximum Seated Height: 1.16 mm

The low profile design helps in achieving a sleeker overall PCB design, while still ensuring robust performance.

Width: 3.5 mm

A compact width allows for space-efficient designs, accommodating other components in tight layouts.

Output Polarity: TRUE

True output polarity ensures standard compatibility across different components, facilitating easier system integration.

Minimum Supply Voltage (Vsup): 1.65 V

A low minimum supply voltage enhances energy efficiency, which is crucial for battery-operated devices.

Length: 4 mm

A compact length aids in space management on PCBs, allowing for more features in a smaller area.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this grade ensures reliability and durability in rigorous conditions.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance, making it ideal for modern digital applications.

Terminal Form: BALL

Ball terminal form improves soldering ease and reliability, essential for mass production.

Terminal Pitch: 0.5 mm

A 0.5 mm pitch allows for densely packed connections, which is important for modern electronics requiring miniaturization.

Maximum Supply Voltage (Vsup): 2.7 V

Compatibility with a maximum supply voltage of 2.7 V ensures versatility in various power architectures.

Technical Specifications

Bus Driver & Transceivers ST16C32245TBR-E attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRED 2.3 TO 3.6 V SUPPLY

Family:

32245

JESD-30 Code:

R-PBGA-B42

Length:

4 mm

Logic IC Type:

No. of Bits:

14

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

6.2 ns

Maximum Seated Height:

1.16 mm

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.5 mm

Trade Compliance

ST16C32245TBR-E Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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