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ST16C32245TTR

STMicroelectronics

ST16C32245TTR by STMicroelectronics

ST16C32245TTR by STMicroelectronics is a dual 2-bit bus driver with a propagation delay of just 5.8 ns, ideal for high-speed applications. It operates at supply voltages from 1.65V to 2.7V and supports up to 6A output current. Its compact design suits industrial environments with temperatures ranging from -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,810 parts In-Stock

1+ parts

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2,810

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Vyrian

USA . 2,792 parts In-Stock

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2,792

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Anansix

USA . 2,434 parts In-Stock

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2,434

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,826 parts In-Stock

1+ parts

$2.620

100+ parts

-

1k+ parts

$2.515

10k+ parts

$2.515

2,826

$2.620

-

$2.515

$2.515

IDEA Electronic Components Group

UK . 837 parts In-Stock

1+ parts

$20.393

100+ parts

-

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$18.353

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837

$20.393

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$18.353

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MKK Technologies

India . 215 parts In-Stock

1+ parts

$38.347

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215

$38.347

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DigiPath Technology Company

USA . 215 parts In-Stock

1+ parts

$38.347

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215

$38.347

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Corphita

USA . 3,560 parts In-Stock

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3,560

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Parana Technologies

USA . 443 parts In-Stock

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$24.383

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443

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$24.383

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Overview

Unlock exceptional performance and reliability with the ST16C32245TTR from STMicroelectronics, a trusted leader in semiconductor innovation. Designed for seamless communication in diverse applications, this bus driver and transceiver ensures rapid data transfer with minimal delay. Its robust features cater to demanding environments, making it ideal for industrial automation, automotive systems, and consumer electronics. Experience enhanced efficiency and lower power consumption, driving your projects toward success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material contributes to the durability and protection of internal components against environmental factors.

Propagation Delay At Nominal Supply: 5.8 ns

A low propagation delay enhances the speed of data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and integration into modern PCB layouts.

No. of Functions: 2

Having multiple functions increases versatility, enabling diverse applications in a single package.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, facilitating efficient layout designs.

No. of Bits: 2

A 2-bit configuration supports more complex data handling and communication across systems.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal supply voltage of 1.8V makes it energy-efficient, aligning with low-power design requirements.

Load Capacitance (CL): 30 pF

A load capacitance of 30pF ensures stable signal integrity, making it effective for high-frequency applications.

Power Supplies (V): 1.8/2.5, 2.5/3.3

Multiple power supply options offer flexibility in integration with various electronic systems.

No. of Terminals: 48

A 48-terminal configuration allows for extensive connectivity options, supporting complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small outline and thin profile support high-density designs and reduce PCB real estate usage.

Maximum I (ol): 6 Amp

A maximum output current specification of 6A allows for handling substantial loads, suitable for robust applications.

Propagation Delay (tpd): 6.2 ns

Similar to the nominal delay, this ensures rapid switching, crucial for performance in fast communication environments.

Maximum Operating Temperature: 85 °C

Withstanding high temperatures indicates reliability in demanding industrial applications.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output capability allows multiple devices to share buses without interference, enhancing flexibility.

Minimum Operating Temperature: -40 °C

A wide temperature range (-40 °C to 85 °C) ensures functionality in extreme conditions, making it ideal for industrial use.

Terminal Finish: Matte Tin (Sn)

The matte tin finish improves solderability and corrosion resistance, enhancing durability.

Terminal Position: DUAL

Dual terminal positions provide versatile connectivity options, accommodating different design layouts.

No. of Ports: 2

Two ports allow for simultaneous connections, improving efficiency in data communication.

Maximum Seated Height: 1.2 mm

A low seated height supports compact designs, ensuring compatibility with space-constrained applications.

Width: 6.1 mm

A moderate width provides a balance between density and ease of handling during PCB assembly.

Output Polarity: TRUE

True output polarity helps maintain signal integrity and predictability in various applications.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage enhances energy efficiency, accommodating low-power designs.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time at peak reflow temperature of 30 seconds ensures safe soldering during assembly without damaging the component.

Peak Reflow Temperature (°C): 260

The high peak reflow temperature capability allows for compatibility with modern soldering techniques.

Length: 12.5 mm

An optimal length contributes to an efficient layout that can fit various applications.

Temperature Grade: INDUSTRIAL

Designed for industrial grade applications, this product ensures reliability and longevity in tough environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall system performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and soldering, simplifying assembly and maintenance.

Packing Method: TR

Tape and reel packing method simplifies automated assembly processes.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for higher density connections, maximizing PCB space efficiency.

Count Direction: BIDIRECTIONAL

Bidirectional counting capabilities allow for flexible data handling, enhancing operational versatility.

Control Type: COMMON CONTROL

Common control simplifies the management of multiple devices, improving system integration.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates a moderate sensitivity to moisture, guiding appropriate storage and handling practices.

Maximum Supply Voltage (Vsup): 2.7 V

The maximum supply voltage ensures compatibility with a range of circuit designs, offering flexibility for various applications.

Technical Specifications

Bus Driver & Transceivers ST16C32245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

2.3V TO 3.6V SUPPLY FOR PORT A

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

CMOS

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

2

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5,2.5/3.3

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

6.1 mm

Trade Compliance

ST16C32245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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