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SPC58EC80E7FMC0X

STMicroelectronics

SPC58EC80E7FMC0X by STMicroelectronics

SPC58EC80E7FMC0X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temps from -40 °C to 105 °C. It features integrated cache, DMA channels, and supports various connectivity options like Ethernet and UART. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,518 parts In-Stock

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4,518

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Digiode

USA . 2,422 parts In-Stock

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Anansix

USA . 95 parts In-Stock

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95

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Distributors (Availability)

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AZTECH Wire

Italy . 403 parts In-Stock

1+ parts

$12.550

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403

$12.550

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Ampacity Inc.

Singapore . 566 parts In-Stock

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$27.000

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566

$27.000

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IDEA Electronic Components Group

UK . 1,781 parts In-Stock

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$57.997

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$52.197

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$57.997

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$52.197

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MKK Technologies

India . 1,313 parts In-Stock

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$109.059

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$109.059

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DigiPath Technology Company

USA . 1,313 parts In-Stock

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$109.059

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1,313

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Microchip USA

USA . 3,706 parts In-Stock

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Vigor

Singapore . 3,028 parts In-Stock

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Corphita

USA . 952 parts In-Stock

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Parana Technologies

USA . 375 parts In-Stock

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$69.344

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$69.344

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Overview

Unlock the potential of your next project with the SPC58EC80E7FMC0X microcontroller from STMicroelectronics, a trusted leader in semiconductor innovation. This versatile chip excels in automotive and industrial applications, delivering exceptional performance in extreme conditions. Enjoy seamless connectivity and low power consumption, ensuring efficient operations without compromising on quality. Experience reliability and efficiency that elevate your solutions to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability, making it suitable for various environmental conditions.

Integrated Cache: YES

Having an integrated cache allows for faster data access, enhancing the overall performance of the microcontroller.

Surface Mount: YES

Surface mount technology facilitates easier integration into compact designs, making it ideal for modern electronics.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage helps in reducing power consumption, making it favorable for battery-powered applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width provides compatibility with smaller data types, optimizing memory usage.

Screening Level: AEC-Q100

AEC-Q100 screening ensures the microcontroller meets automotive standards for reliability and performance.

Package Shape: SQUARE

The square package shape allows for efficient space utilization on PCBs.

Bit Size: 32

The 32-bit architecture enables handling of larger data types and provides better performance in complex applications.

No. of Terminals: 176

With 176 terminals, this microcontroller offers a high level of connectivity and flexibility for various peripheral devices.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The versatile package style allows for integration in space-constrained designs while promoting effective heat dissipation.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage enhances energy efficiency and extends battery life in portable applications.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C allows for reliable performance in high-temperature environments.

CPU Family: E200Z4

The E200Z4 CPU family is optimized for efficient processing, making this microcontroller suitable for embedded systems.

Minimum Operating Temperature: -40 °C

Designed for extreme conditions, this microcontroller can operate in temperatures as low as -40 °C.

ADC Channels: YES

Integrated ADC channels support precise analog signal processing, ideal for sensor applications.

DMA Channels: YES

The presence of DMA channels enhances data transfer efficiency, reducing CPU load during data-heavy operations.

Terminal Position: QUAD

Quad terminal positioning facilitates better PCB routing and compact designs.

ROM Words: 4194304

With a substantial ROM word capacity, this microcontroller offers ample memory for complex applications and firmware.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm allows for low-profile designs, suitable for compact devices.

Width: 24 mm

A width of 24 mm provides a balance between board space and functionality.

Data EEPROM Size: 128K

A sizeable data EEPROM allows for the storage of critical data even when powered off, essential for applications requiring non-volatile memory.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging, enhancing design reliability.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

The extensive set of peripherals, including timers and DMA channels, offers flexibility for diverse application needs.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency ensures efficient processing speeds, suitable for demanding tasks.

Length: 24 mm

Maintaining a uniform length of 24 mm enhances compatibility with existing designs.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it is designed for efficient instruction execution, greatly improving performance.

No. of Timers: 12

Twelve timers provide extensive options for timing operations and event management.

RAM Bytes: 393216

A sufficient RAM size of 393216 bytes enables efficient multi-tasking and data processing for complex applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance.

Terminal Form: GULL WING

The gull wing terminal form factor facilitates easy soldering and assembly, reducing production costs.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADC channels with high resolution allow for accurate digital representation of analog signals.

Maximum Supply Current: 50 mA

A limited maximum supply current keeps the overall power consumption low, enhancing efficiency.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V optimizes energy use in low-power applications.

No. of DMA Channels: 64

A large number of DMA channels enables advanced data handling capabilities, improving application performance.

No. of Serial I/Os: 18

With 18 serial I/Os, this microcontroller supports numerous communication interfaces, enhancing connectivity.

PWM Channels: YES

Support for PWM channels allows for effective motor control and signal modulation in various applications.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Diverse connectivity options enhance interoperability with various devices, making it versatile for different applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and iterations in software development.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density component placement on PCBs.

Format: FLOATING POINT

Floating point support enhances numerical processing capability, crucial for complex calculations.

Speed: 160 rpm

Capable of high-speed operations, this microcontroller is suitable for applications requiring rapid response times.

Low Power Mode: YES

The ability to enter a low power mode significantly enhances battery life in portable devices.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for efficient usage of memory resources while executing programs.

Technical Specifications

Microcontrollers SPC58EC80E7FMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E7FMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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