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SPC58EC80E7FMC1X

STMicroelectronics

SPC58EC80E7FMC1X by STMicroelectronics

SPC58EC80E7FMC1X by STMicroelectronics is a 32-bit microcontroller ideal for automotive applications, featuring AEC-Q100 screening. It supports up to 40 MHz clock speed, has integrated cache, and offers extensive connectivity options like Ethernet and FlexRay. With a wide operating temp range (-40 °C to 105 °C), it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,028 parts In-Stock

1+ parts

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7,028

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Digiode

USA . 4,511 parts In-Stock

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4,511

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Anansix

USA . 2,366 parts In-Stock

1+ parts

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2,366

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 555 parts In-Stock

1+ parts

$17.570

100+ parts

-

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-

10k+ parts

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555

$17.570

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Microchip USA

USA . 1,397 parts In-Stock

1+ parts

$51.194

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1,397

$51.194

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IDEA Electronic Components Group

UK . 220 parts In-Stock

1+ parts

$57.752

100+ parts

-

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$51.977

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220

$57.752

-

$51.977

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MKK Technologies

India . 1,653 parts In-Stock

1+ parts

$108.599

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1,653

$108.599

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DigiPath Technology Company

USA . 1,653 parts In-Stock

1+ parts

$108.599

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1,653

$108.599

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Parana Technologies

USA . 2,083 parts In-Stock

1+ parts

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$69.051

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2,083

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$69.051

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Corphita

USA . 1,368 parts In-Stock

1+ parts

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1,368

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Overview

Unlock the potential of your next project with the SPC58EC80E7FMC1X microcontroller from STMicroelectronics—a leader in innovation and quality. Designed for high-performance applications, this advanced 32-bit solution offers exceptional reliability and efficiency, making it ideal for automotive and industrial systems. Experience seamless connectivity, enhanced processing power, and robust safety features, delivering unmatched value that empowers your designs to thrive in any environment. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides reliable performance and protection in various environments.

Integrated Cache: YES

The presence of cache enhances speed and efficiency in data access, leading to improved overall performance.

Surface Mount: YES

The surface mount design allows for compact PCB layouts, saving space and enabling higher component density.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage helps in reducing power consumption, making it ideal for battery-powered devices.

On Chip Data RAM Width: 8

An 8-bit RAM width supports efficient data processing for a variety of applications.

Screening Level: AEC-Q100

Meeting AEC-Q100 standards ensures reliability and robustness for automotive applications.

Package Shape: SQUARE

A square package shape can facilitate better thermal performance and assembly for more complex designs.

Bit Size: 32

A 32-bit architecture enables the microcontroller to handle larger data types and more complex instructions.

No. of Terminals: 176

A high number of terminals allows for a greater variety of I/O options, facilitating more complex interfacing.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This versatile package style allows for effective heat dissipation and space-saving on circuit boards.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage supports low-power operations, essential for energy-efficient designs.

Maximum Operating Temperature: 105 °C

Operating at higher temperatures makes it suitable for demanding environments, including automotive and industrial applications.

CPU Family: E200Z4

The E200Z4 CPU family is designed for high performance, optimizing processing capabilities in embedded systems.

Minimum Operating Temperature: -40 °C

Withstand extreme cold, making it especially suitable for rugged outdoor applications.

ADC Channels: YES

Integrated ADC channels allow for direct analog signal processing, which is vital for sensor applications.

DMA Channels: YES

DMA channels facilitate efficient data transfers, freeing up the CPU for other tasks and improving throughput.

Terminal Position: QUAD

Quad terminal positioning provides better performance with parallel data transfer and enhanced flexibility in layout.

ROM Words: 4194304

A substantial amount of ROM enables the storage of complex firmware and applications.

Maximum Seated Height: 1.6 mm

The low profile offers design flexibility in compact devices, contributing to space savings.

Width: 24 mm

A 24 mm width provides an optimal balance between size and functionality for various applications.

Data EEPROM Size: 128K

The significant EEPROM size allows for the storage of persistent data, which is crucial for many control applications.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes in complex PCB assemblies.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

An array of peripherals enables a wide range of functionalities, allowing it to cater to diverse applications.

Maximum Clock Frequency: 40 MHz

The high clock frequency supports fast processing speeds, ideal for time-sensitive applications.

Length: 24 mm

A compact length aids in maintaining a small form factor for devices, supporting modern design trends.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction processing, enhancing performance for embedded applications.

No. of Timers: 12

Multiple timers facilitate the ability to manage various time-based applications simultaneously.

RAM Bytes: 393216

A generous amount of RAM enables the processing of larger datasets and more complex algorithms.

Technology: CMOS

CMOS technology provides low power consumption and high performance, making it ideal for portable applications.

Terminal Form: GULL WING

The gull-wing terminal form enhances soldering reliability and performance in surface-mounted devices.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADCs allow for precise signal conversion, making it suitable for high-accuracy applications.

Maximum Supply Current: 50 mA

The low maximum supply current further enhances energy efficiency, beneficial for battery-operated devices.

Nominal Supply Voltage: 1.2 V

A low nominal voltage aligns with current trends in energy-efficient designs and low-power systems.

No. of DMA Channels: 64

A high count of DMA channels allows for extensive data handling capabilities without CPU overhead.

No. of Serial I/Os: 18

An ample number of serial I/O lines allows for versatile communication options with various peripherals.

PWM Channels: YES

Integrated PWM channels provide the means for effective motor control and analog signal generation.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Diverse connectivity options ensure compatibility with a wide range of communication protocols and devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, essential for evolving application requirements.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables compact arrangements, supporting high-density PCB design configurations.

Format: FLOATING POINT

Floating point format supports high-precision calculations, essential for complex mathematical computations.

Speed: 160 rpm

This speed is suitable for applications requiring quick and efficient processing, such as control systems.

Low Power Mode: YES

The availability of a low power mode contributes to battery conservation, extending the operational lifetime of devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates efficient data handling, suitable for embedded application designs.

Technical Specifications

Microcontrollers SPC58EC80E7FMC1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E7FMC1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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