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SPC58EC80E7E0C1X

STMicroelectronics

SPC58EC80E7E0C1X by STMicroelectronics

SPC58EC80E7E0C1X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temperatures from -40 °C to 105 °C. It features integrated cache, DMA channels, and supports various connectivity options like CAN and UART. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 13,005 parts In-Stock

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Digiode

USA . 2,073 parts In-Stock

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2,073

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Anansix

USA . 125 parts In-Stock

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125

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Distributors (Availability)

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AZTECH Wire

Italy . 1,063 parts In-Stock

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$12.020

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1,063

$12.020

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IDEA Electronic Components Group

UK . 637 parts In-Stock

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$49.472

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$44.525

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637

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Microchip USA

USA . 2,884 parts In-Stock

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$52.336

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2,884

$52.336

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MKK Technologies

India . 2,193 parts In-Stock

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$93.029

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$93.029

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DigiPath Technology Company

USA . 2,193 parts In-Stock

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$93.029

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$93.029

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Component Stockers USA

USA . 522 parts In-Stock

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$238.260

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Corphita

USA . 4,788 parts In-Stock

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Parana Technologies

USA . 2,203 parts In-Stock

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$59.151

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$59.151

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Overview

Elevate your projects with the SPC58EC80E7E0C1X microcontroller by STMicroelectronics, a leader in innovative technology. This high-performance chip offers exceptional reliability and efficiency, making it ideal for automotive and industrial applications. With its robust design and advanced features, including integrated cache and low power consumption, you’ll benefit from seamless connectivity and enhanced processing capabilities. Choose STMicroelectronics for quality you can trust, and unlock new possibilities in your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and reduces the overall weight of the microcontroller, making it suitable for various applications.

Integrated Cache: YES

Having integrated cache improves data access speeds, enhancing the overall performance of the microcontroller.

Surface Mount: YES

The surface mount design allows for compact assembly and better space management on PCB, ideal for modern electronics.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage helps in reducing power consumption, making this microcontroller efficient for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit wide RAM allows for efficient data processing in a compact architecture, suitable for various embedded applications.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures reliability and durability in automotive applications under extreme conditions.

Package Shape: SQUARE

The square package shape makes it easy to integrate into a variety of PCB layouts, optimizing design space.

Bit Size: 32

A 32-bit architecture supports complex calculations and wide data types, improving performance for modern applications.

No. of Terminals: 176

With 176 terminals, the microcontroller offers extensive connectivity options, enhancing versatility in designs.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This variety in package style allows for better heat dissipation and space efficiency, making it suitable for various environments.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage further enhances power efficiency, especially for low-power applications.

Maximum Operating Temperature: 105 °C

Operating at a high temperature threshold ensures the microcontroller can withstand harsh conditions, ideal for industrial applications.

CPU Family: E200Z4

The E200Z4 family is known for its performance and efficiency, making it suitable for demanding embedded systems.

Minimum Operating Temperature: -40 °C

This wide operating temperature range ensures the microcontroller can function in extreme environments, ideal for automotive and industrial applications.

ADC Channels: YES

Built-in Analog to Digital Converter (ADC) channels enhance the microcontroller’s ability to interact with the analog world, making it useful in sensor applications.

DMA Channels: YES

Direct Memory Access (DMA) support allows for efficient data processing without CPU intervention, significantly increasing throughput.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and improves signal integrity, enhancing overall performance.

ROM Words: 4194304

A large ROM capacity allows for extensive program storage, accommodating complex applications.

Maximum Seated Height: 1.6 mm

A low profile design allows for integration in space-constrained applications while maintaining effective heat dissipation.

Width: 24 mm

Compact 24 mm width supports easy integration in various designs, making it a flexible choice for engineers.

Data EEPROM Size: 128K

Having 128K of data EEPROM provides ample space for non-volatile data storage, crucial for applications requiring memory retention.

Boundary Scan: YES

Boundary scan capability enhances testing and debugging during development, saving time and resources.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals promotes versatile application development, supporting various functionalities needed in embedded systems.

Maximum Clock Frequency: 40 MHz

The 40 MHz clock frequency ensures that the microcontroller can handle advanced processing tasks efficiently.

Length: 24 mm

With a length of 24 mm, it offers a compact solution for various applications, maintaining a balance between size and functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture optimizes performance-per-watt, making this microcontroller suitable for high-efficiency applications.

No. of Timers: 12

Multiple timers allow for complex timing operations, essential for real-time applications in various sectors.

RAM Bytes: 393216

A large RAM size facilitates handling of extensive data volumes and complex computation, vital for high-performance tasks.

Technology: CMOS

CMOS technology provides low power consumption and higher integration density, enhancing overall device efficiency.

Terminal Form: GULL WING

Gull wing terminal forms are easy to solder and provide good mechanical stability, simplifying manufacturing processes.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Having multiple ADCs with high resolution allows for accurate parameters monitoring and handling, essential for embedded systems.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA enables various power management strategies, ideal for portable devices.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V is excellent for low-power applications, enhancing energy efficiency further.

No. of DMA Channels: 64

Configurable DMA channels allow for efficient data handling and transfer, reducing CPU load, significant in performance-critical applications.

No. of Serial I/Os: 26

26 serial I/O channels offer ample options for communication and control, making this microcontroller versatile in task management.

PWM Channels: YES

Support for PWM channels makes this microcontroller suitable for motor control and other applications requiring variable outputs.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Robust connectivity options enhance flexibility for interfacing with various sensors and devices, making it suitable for diverse applications.

ROM Programmability: FLASH

Flash programmability enables easy updates to software and firmware, extending the product’s lifetime and functionality.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density PCB designs, accommodating more components without increasing overall size.

Format: FLOATING POINT

Floating-point support enhances numerical computation capabilities, making this microcontroller suitable for complex applications.

Speed: 120 rpm

The speed rating indicates the efficiency of the microcontroller in control applications, important for responsive designs.

Low Power Mode: YES

Low power mode functionality is ideal for battery-operated and energy-sensitive applications, extending device life.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient data encoding and processing, beneficial for embedded applications.

Technical Specifications

Microcontrollers SPC58EC80E7E0C1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E7E0C1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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