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SPC58EC80E3FMC0X

STMicroelectronics

SPC58EC80E3FMC0X by STMicroelectronics

SPC58EC80E3FMC0X by STMicroelectronics is a 32-bit microcontroller featuring integrated cache and up to 40 MHz clock speed. It operates b/w -40 °C to 105 °C, supports various connectivity options like Ethernet and UART, making it ideal for automotive applications. With AEC-Q100 screening, it ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 13,337 parts In-Stock

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13,337

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Digiode

USA . 459 parts In-Stock

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459

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Anansix

USA . 444 parts In-Stock

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444

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Distributors (Availability)

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AZTECH Wire

Italy . 172 parts In-Stock

1+ parts

$9.990

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172

$9.990

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Vigor

Singapore . 1,503 parts In-Stock

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$17.290

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1,503

$17.290

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Microchip USA

USA . 256 parts In-Stock

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$25.517

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256

$25.517

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$26.084

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$23.736

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$21.389

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5,000

$26.084

$23.736

$21.389

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IDEA Electronic Components Group

UK . 1,765 parts In-Stock

1+ parts

$43.287

100+ parts

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$38.958

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1,765

$43.287

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$38.958

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MKK Technologies

India . 1,911 parts In-Stock

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$81.398

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1,911

$81.398

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DigiPath Technology Company

USA . 1,911 parts In-Stock

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$81.398

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1,911

$81.398

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Corphita

USA . 2,029 parts In-Stock

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2,029

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Parana Technologies

USA . 1,607 parts In-Stock

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$51.756

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1,607

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$51.756

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Overview

Unlock the potential of your next project with the SPC58EC80E3FMC0X microcontroller from STMicroelectronics, a leader in innovation and reliability. This robust 32-bit MCU is designed to elevate automotive and industrial applications, offering exceptional performance even in extreme temperatures. With advanced features like integrated cache, multiple communication interfaces, and energy-efficient operation, it ensures seamless connectivity and optimal functionality. Choose SPC58EC80E3FMC0X for unparalleled quality and peace of mind, driving your success forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the microcontroller suitable for a wide range of applications.

Integrated Cache: YES

Integrated cache helps improve performance by allowing faster access to frequently used data, enhancing overall processing efficiency.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, enabling more complex circuit designs.

Maximum Supply Voltage: 1.26 V

With a low maximum supply voltage, this microcontroller is energy-efficient, suitable for battery-powered devices.

On Chip Data RAM Width: 8

An 8-bit RAM width allows for efficient data handling in applications requiring moderate data throughput.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and quality, making it ideal for automotive and industrial applications.

Package Shape: SQUARE

A square package shape simplifies layout and design on PCBs, facilitating easy integration into existing systems.

Bit Size: 32

The 32-bit architecture allows for processing of larger data sets and more complex calculations, suitable for advanced applications.

No. of Terminals: 100

Having 100 terminals provides ample I/O options for connecting peripherals and sensors, enhancing versatility.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style reduces space requirements and improves heat dissipation, making it suitable for densely packed designs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage indicates flexibility in power supply options, allowing it to operate in various environments.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature ensures reliable performance in demanding thermal conditions.

CPU Family: E200Z4

Belonging to a robust CPU family, this microcontroller benefits from a well-established architecture optimized for performance.

Minimum Operating Temperature: -40 °C

Capability to function in extremely low temperatures makes it suitable for harsh environments.

ADC Channels: YES

Integrated ADC channels allow for direct sensor interfacing, simplifying design and reducing components.

DMA Channels: YES

DMA support enables efficient data transfer without CPU intervention, allowing for higher system throughput.

Terminal Position: QUAD

Quad terminal positioning enhances layout flexibility in circuit board design.

ROM Words: 4194304

A high ROM word count allows for substantial program storage, accommodating complex applications.

Maximum Seated Height: 1.2 mm

Thin profile ensures this microcontroller can be used in space-constrained applications.

Width: 14 mm

A compact width allows for easier integration into a variety of electronic designs.

Data EEPROM Size: 128K

The sizable EEPROM storage facilitates data retention across power cycles, useful for storing configuration settings.

Boundary Scan: YES

Boundary scan capability allows for easier testing and debugging of circuit boards, improving manufacturing reliability.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A wide range of peripherals supports advanced application features and real-time operations.

Maximum Clock Frequency: 40 MHz

A 40 MHz clock frequency allows for fast processing speeds, enhancing application performance.

Length: 14 mm

Short length aids in compact designs, providing flexibility for small form-factor applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances efficiency in executing instructions, leading to improved performance.

No. of Timers: 12

The presence of multiple timers allows for complex timing applications, making it ideal for real-time operations.

RAM Bytes: 393216

Ample RAM size supports sophisticated applications requiring significant data handling capabilities.

Technology: CMOS

CMOS technology leads to low power consumption and high noise immunity, suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals simplify soldering processes, enhancing manufacturability.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Versatile ADC configurations allow for high-resolution measurements from multiple analog sources.

Maximum Supply Current: 50 mA

Low maximum supply current increases power efficiency, critical for portable applications.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage indicates compatibility with low-power systems, making it energy-friendly.

No. of DMA Channels: 64

64 DMA channels enable sophisticated data handling, leading to higher processing efficiencies.

No. of Serial I/Os: 18

Multiple serial I/O options allow extensive connectivity with other devices and peripherals.

PWM Channels: YES

PWM channels enable efficient control of motors and lights, advantageous for robotics and automation.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

A rich set of connectivity options ensures compatibility with various communication protocols, enhancing versatility.

ROM Programmability: FLASH

Flash programmability allows easy updating of firmware, making it ideal for applications requiring regular software updates.

Terminal Pitch: 0.5 mm

A fine terminal pitch facilitates high-density mounting, ideal for modern compact circuit designs.

Format: FLOATING POINT

Floating-point format support allows for complex arithmetic operations, beneficial for applications needing high precision.

Speed: 160 rpm

Speed rating indicates potential use in applications like motors where speed control is essential.

Low Power Mode: YES

Low power mode feature enhances battery life in devices, making it suitable for energy-sensitive applications.

On Chip Program ROM Width: 8

The 8-bit program ROM width supports efficient execution of a variety of applications, ideal for embedded systems.

Technical Specifications

Microcontrollers SPC58EC80E3FMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E3FMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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