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SPC58EC80C3NEC0X

STMicroelectronics

SPC58EC80C3NEC0X by STMicroelectronics

SPC58EC80C3NEC0X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temperatures from -40 °C to 125 °C. It features integrated cache, DMA channels, and supports various connectivity options like Ethernet and UART. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,142 parts In-Stock

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8,142

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Digiode

USA . 4,322 parts In-Stock

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4,322

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Anansix

USA . 726 parts In-Stock

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726

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Distributors (Availability)

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AZTECH Wire

Italy . 234 parts In-Stock

1+ parts

$14.140

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-

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234

$14.140

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Ampacity Inc.

Singapore . 1,646 parts In-Stock

1+ parts

$16.000

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-

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1,646

$16.000

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Vigor

Singapore . 2,170 parts In-Stock

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$23.240

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2,170

$23.240

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IDEA Electronic Components Group

UK . 258 parts In-Stock

1+ parts

$31.813

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$28.631

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258

$31.813

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$28.631

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Microchip USA

USA . 443 parts In-Stock

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$34.387

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443

$34.387

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MKK Technologies

India . 354 parts In-Stock

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$59.822

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354

$59.822

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DigiPath Technology Company

USA . 354 parts In-Stock

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$59.822

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354

$59.822

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Component Stockers USA

USA . 331 parts In-Stock

1+ parts

$99.990

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331

$99.990

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Corphita

USA . 2,850 parts In-Stock

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2,850

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Parana Technologies

USA . 185 parts In-Stock

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$38.037

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185

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$38.037

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Overview

Unlock unparalleled performance with the SPC58EC80C3NEC0X microcontroller from STMicroelectronics, a leader in innovation and reliability. Designed for demanding applications, this versatile microcontroller excels in automotive, industrial, and smart devices. With robust features like integrated cache, low power consumption, and advanced connectivity options, it empowers engineers to create cutting-edge solutions that enhance efficiency and reliability. Experience the excellence of STMicroelectronics and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure reliability in various environments.

Integrated Cache: YES

Having an integrated cache improves processing speed by reducing access time to frequently used data.

Surface Mount: YES

Surface mount technology allows for a compact design and improved performance due to shorter signal paths.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage enables reduced power consumption, making it ideal for battery-operated devices.

On Chip Data RAM Width: 8

A byte-oriented RAM width simplifies software design and data handling.

Screening Level: AEC-Q100

AEC-Q100 compliance ensures reliability and performance in automotive applications.

Package Shape: SQUARE

Square package design allows for easy mounting and optimal PCB layout.

Bit Size: 32

A 32-bit architecture supports advanced computational capabilities and larger data handling.

No. of Terminals: 292

A high number of terminals facilitates greater connectivity options and peripheral integration.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array enhances performance while minimizing space on the PCB.

Minimum Supply Voltage: 1.14 V

Minimizing the supply voltage range helps in reducing energy consumption.

Maximum Operating Temperature: 125 °C

High operating temperature range enables functionality in demanding environments.

CPU Family: E200Z4

The E200Z4 CPU family provides advanced processing capabilities suitable for diverse applications.

Minimum Operating Temperature: -40 °C

Extensive temperature range ensures reliability in harsh conditions.

ADC Channels: YES

Built-in ADC channels support direct analog signal processing for enhanced functionality.

DMA Channels: YES

DMA capability allows for efficient data transfers, improving overall system efficiency.

Terminal Position: BOTTOM

Bottom terminal positioning aids in efficient heat dissipation.

ROM Words: 4194304

A large program memory allows for complex applications and features.

Maximum Seated Height: 1.8 mm

Low profile design is suitable for compact devices and space-constrained applications.

Width: 17 mm

Standard width makes it easier to integrate with existing PCB designs.

Data EEPROM Size: 128K

Adequate EEPROM size offers flexibility in storing critical data and user preferences.

Boundary Scan: YES

Boundary scan capability simplifies troubleshooting and testing during design validation.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Rich peripheral set enhances functionality and integration with other systems.

Maximum Clock Frequency: 40 MHz

A high clock frequency allows for faster processing speeds and improved application performance.

Length: 17 mm

Compact length supports space-efficient designs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture contributes to efficient instruction execution and reduced power consumption.

No. of Timers: 12

Multiple timers facilitate precise time-based functions and improved process control.

RAM Bytes: 393216

Sufficient RAM size for efficient data processing and operation execution.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form offers better thermal and electrical conductivity.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADC channels allow for accurate signal processing in various applications.

Maximum Supply Current: 50 mA

Low maximum supply current contributes to energy efficiency in portable applications.

Nominal Supply Voltage: 1.2 V

Low nominal supply voltage enhances energy efficiency and battery life.

No. of DMA Channels: 64

A large number of DMA channels ensures efficient data handling across multiple peripherals.

No. of Serial I/Os: 18

Multiple serial I/O channels provide extensive communication capabilities.

PWM Channels: YES

Integrated PWM channels enable control of motors and other dynamic systems.

Connectivity: ETHERNET, I2C, SPI(8), UART(18)

Diverse connectivity options support versatile application requirements.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in software deployment.

Terminal Pitch: 0.8 mm

Narrow terminal pitch facilitates high-density packaging while maintaining reliability.

Format: FLOATING POINT

Floating point format enhances the capability for complex mathematical calculations.

Speed: 120 rpm

Adequate speed for various motion control applications.

Low Power Mode: YES

Low power mode significantly extends battery life in portable applications.

On Chip Program ROM Width: 8

8-bit ROM width simplifies interfacing with software and reduces complexity.

Technical Specifications

Microcontrollers SPC58EC80C3NEC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B292

Length:

17 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

292

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA292,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.8 mm

Speed:

120 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80C3NEC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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