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SPC584C70E7QMC0X

STMicroelectronics

SPC584C70E7QMC0X by STMicroelectronics

SPC584C70E7QMC0X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temps from -40 °C to 125 °C. It features integrated cache, DMA channels, and supports various connectivity options like Ethernet and SPI. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,117 parts In-Stock

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7,117

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Digiode

USA . 4,350 parts In-Stock

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4,350

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Anansix

USA . 1,840 parts In-Stock

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1,840

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Chip Stock

USA . 625 parts In-Stock

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625

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IDEA Electronic Components Group

UK . 1,879 parts In-Stock

1+ parts

$20.932

100+ parts

-

1k+ parts

$18.839

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-

1,879

$20.932

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$18.839

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AZTECH Wire

Italy . 1,022 parts In-Stock

1+ parts

$21.840

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1,022

$21.840

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MKK Technologies

India . 936 parts In-Stock

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$39.361

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936

$39.361

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DigiPath Technology Company

USA . 936 parts In-Stock

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$39.361

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936

$39.361

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Component Stockers USA

USA . 610 parts In-Stock

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$99.990

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610

$99.990

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Microchip USA

USA . 156 parts In-Stock

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$861.609

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156

$861.609

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,754 parts In-Stock

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$25.027

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1,754

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$25.027

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Vigor

Singapore . 1,698 parts In-Stock

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1,698

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Corphita

USA . 1,495 parts In-Stock

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1,495

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Overview

Unlock superior performance with the SPC584C70E7QMC0X microcontroller from STMicroelectronics, a leader in innovative technology. Built for reliability and efficiency, this robust MCU offers exceptional versatility for automotive applications, ensuring seamless operation even in extreme conditions. With integrated features that enhance connectivity and processing speed, customers benefit from reduced design complexity and enhanced product longevity, making it an unbeatable choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material provides good durability and thermal performance, making the microcontroller reliable in various environments.

Integrated Cache: YES

Having integrated cache improves data access speed, enhancing overall performance for demanding applications.

Surface Mount: YES

Surface mount technology enables compact designs and efficient utilization of PCB space, which is ideal for modern electronics.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage contributes to lower power consumption, making this microcontroller suitable for power-sensitive applications.

On Chip Data RAM Width: 8

An 8-bit wide RAM allows efficient data handling for a variety of applications, offering flexibility in data processing requirements.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures robustness and reliability in automotive applications, catering to industries with strict quality standards.

Package Shape: SQUARE

The square package shape facilitates uniform mounting on PCBs, aiding in design efficiency.

Bit Size: 32

A 32-bit architecture enables complex computations and enhances performance in processing-intensive tasks.

No. of Terminals: 176

With 176 terminals, this microcontroller offers extensive connectivity options, accommodating diverse peripherals and interfaces.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The low-profile and fine pitch design is advantageous for compact and high-density applications, making it suitable for modern electronic devices.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage enhances power efficiency, allowing the device to operate in battery-powered applications.

Maximum Operating Temperature: 125 °C

Operating at high temperatures ensures reliability in demanding environments, especially in automotive and industrial applications.

CPU Family: E200Z4

The E200Z4 CPU family is designed for high performance, catering to applications that require efficient processing capabilities.

Minimum Operating Temperature: -40 °C

This wide temperature range makes the microcontroller suitable for harsh environments, increasing its versatility.

ADC Channels: YES

Having ADC channels allows for direct interfacing with analog sensors, making this microcontroller ideal for data acquisition systems.

DMA Channels: YES

DMA support enhances data transfer efficiency, freeing the CPU for other tasks to improve overall system performance.

Terminal Position: QUAD

The quad terminal position allows for easier routing on PCBs, enabling simpler designs and better signal integrity.

ROM Words: 2097152

With 2M ROM words, there's ample memory for complex applications, allowing developers to create sophisticated features.

Maximum Seated Height: 1.6 mm

A low seated height is beneficial for applications requiring form factor constraints, fitting easily into compact designs.

Width: 24 mm

The width of 24 mm is optimal for various PCB layouts, providing flexibility in design.

Data EEPROM Size: 128K

A large EEPROM size enables extensive data storage capabilities, perfect for applications requiring data retention.

Boundary Scan: YES

Boundary scan capabilities simplify testing and debugging, aiding in the development process and improving reliability.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

The extensive set of peripherals enhances functionality, offering diverse options for system design and application requirements.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz ensures high-speed operation, supporting complex applications requiring fast processing.

Length: 24 mm

Similar to the width, a length of 24 mm is practical for space-constrained designs, offering layout convenience.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows efficient instruction execution, making this microcontroller suitable for applications demanding high performance.

No. of Timers: 12

Multiple timers increase scheduling capabilities, enhancing precision time-based applications.

RAM Bytes: 393216

With a significant amount of RAM available, complex applications can be efficiently supported, including multitasking environments.

Technology: CMOS

CMOS technology ensures low power consumption and high integration density, aligning with modern electronic design trends.

Terminal Form: GULL WING

The gull wing terminal form is user-friendly for surface mount technology, providing robust connections.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple high-resolution ADCs are ideal for precision data acquisition, making the microcontroller suitable for sensor applications.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA allows for efficient power management in battery-operated devices.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage of 1.2 V enhances energy efficiency, which is critical in portable devices.

No. of DMA Channels: 64

A high number of DMA channels allows for efficient data handling, enhancing the overall processing capability of the system.

No. of Serial I/Os: 18

Having 18 serial I/O channels provides ample options for communication with various devices, supporting versatile designs.

PWM Channels: YES

PWM capability is essential for motor control and other applications requiring precise signal modulation.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Comprehensive connectivity options make this microcontroller versatile for a variety of applications, facilitating integration into different systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, enhancing the flexibility of the device in applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables higher density assembly and fitting into smaller designs, ideal for compact electronics.

Format: FLOATING POINT

Floating point support allows for complex mathematical calculations, making this microcontroller suitable for advanced algorithms.

Speed: 180 rpm

A speed specification is ideal for applications that involve motor control and real-time data processing.

Low Power Mode: YES

Low power mode feature supports energy savings, extending battery life in portable applications.

On Chip Program ROM Width: 8

An 8-bit wide program ROM allows efficient coding and storage of instructions, contributing to optimized performance.

Technical Specifications

Microcontrollers SPC584C70E7QMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C70E7QMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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