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SPC584C70E3GMC0X

STMicroelectronics

SPC584C70E3GMC0X by STMicroelectronics

SPC584C70E3GMC0X microcontroller by STMicroelectronics features a 32-bit E200Z4 CPU, operates at 1.14-1.26V, and supports up to 40 MHz clock speed. With integrated DMA and ADC channels, it's ideal for automotive applications requiring high performance and reliability. Its AEC-Q100 screening ensures durability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,593 parts In-Stock

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9,593

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Digiode

USA . 4,106 parts In-Stock

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4,106

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Anansix

USA . 905 parts In-Stock

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905

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Chip Stock

USA . 378 parts In-Stock

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378

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 750 parts In-Stock

1+ parts

$21.040

100+ parts

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750

$21.040

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IDEA Electronic Components Group

UK . 1,805 parts In-Stock

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$37.027

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-

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$33.325

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1,805

$37.027

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$33.325

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MKK Technologies

India . 2,042 parts In-Stock

1+ parts

$69.627

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2,042

$69.627

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DigiPath Technology Company

USA . 2,042 parts In-Stock

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$69.627

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2,042

$69.627

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Component Stockers USA

USA . 724 parts In-Stock

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$99.990

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724

$99.990

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Microchip USA

USA . 490 parts In-Stock

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$258.450

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490

$258.450

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Corphita

USA . 2,493 parts In-Stock

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2,493

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Parana Technologies

USA . 716 parts In-Stock

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$44.272

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716

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$44.272

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Overview

Unlock the power of innovation with the SPC584C70E3GMC0X microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, STMicroelectronics delivers advanced solutions tailored for automotive and industrial applications. With a robust design that supports diverse connectivity options, this microcontroller ensures seamless integration and efficiency. Elevate your projects with unmatched performance and flexibility, empowering you to create smart, cutting-edge technologies that stand out in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and cost-effectiveness, making it suitable for various applications.

Integrated Cache: YES

An integrated cache enhances data access speed, improving overall performance of the microcontroller.

Surface Mount: YES

Surface mount technology allows for compact designs and easier manufacturing processes.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage enables energy-efficient operations, reducing overall power consumption.

On Chip Data RAM Width: 8

An 8-bit RAM width allows for efficient data handling in specific embedded applications.

Screening Level: AEC-Q100

Meets automotive standards, ensuring reliability for automotive applications.

Package Shape: SQUARE

The square shape allows for optimal space utilization on PCBs.

Bit Size: 32

A 32-bit architecture enhances processing power and supports higher-level programming.

No. of Terminals: 100

A higher number of terminals provides greater interfacing capabilities with other components.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Flexible package styles cater to various design requirements and thermal management.

Minimum Supply Voltage: 1.14 V

Supports low-voltage operations, contributing to energy savings and extended battery life.

Maximum Operating Temperature: 105 °C

High-temperature tolerance ensures functionality in harsh environments.

CPU Family: E200Z4

This family is designed for low-power applications, making it ideal for energy-sensitive tasks.

Minimum Operating Temperature: -40 °C

Wide operational temperature range increases versatility for extreme conditions.

ADC Channels: YES

Data acquisition capabilities through ADC channels facilitate analog signal measurement.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency and reduce CPU load.

Terminal Position: QUAD

Quad terminal position enhances performance by minimizing signal interference.

ROM Words: 2097152

Large ROM capacity allows for extensive program storage, supporting more complex applications.

Maximum Seated Height: 1.2 mm

Low seated height supports compact designs, beneficial for space-constrained applications.

Width: 14 mm

Compact width contributes to flexible PCB layouts without sacrificing performance.

Data EEPROM Size: 128K

Sufficient EEPROM size allows for non-volatile data storage, enhancing reliability.

Boundary Scan: YES

Boundary scan capability aids in debugging and testing, improving the development process.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals enhances functionality and application versatility.

Maximum Clock Frequency: 40 MHz

A high clock frequency improves processing speed, enabling faster task execution.

Length: 14 mm

The compact design supports various embedded applications requiring space efficiency.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction execution and lower power consumption.

No. of Timers: 12

Multiple timers enable precise time management for various applications.

RAM Bytes: 393216

Significant RAM capacity supports more complex algorithms and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering performance and ease of assembly.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple high-resolution ADCs allow for accurate signal processing.

Maximum Supply Current: 50 mA

Lower maximum supply current leads to reduced power consumption, essential for battery-powered devices.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage ensures optimal performance while maintaining energy efficiency.

No. of DMA Channels: 64

High number of DMA channels allows for efficient data handling, improving overall system performance.

No. of Serial I/Os: 18

The availability of multiple serial I/O ports supports diverse communication options.

PWM Channels: YES

Pulse Width Modulation capabilities enable control over devices like motors, enhancing functionality.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Wide connectivity options allow for integration into different networks and systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, enhancing flexibility.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for a more compact PCB design, optimizing space.

Format: FLOATING POINT

Support for floating-point operations allows for complex calculations in scientific applications.

Speed: 180 rpm

Speed specifications indicate efficient processing capabilities for real-time applications.

Low Power Mode: YES

Low power mode features extend battery life during extended operation or inactive periods.

On Chip Program ROM Width: 8

An 8-bit program ROM width offers efficient storage of small-sized programs.

Technical Specifications

Microcontrollers SPC584C70E3GMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C70E3GMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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