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SPC584B60E5EDC0X

STMicroelectronics

SPC584B60E5EDC0X by STMicroelectronics

SPC584B60E5EDC0X microcontroller from STMicroelectronics features a 32-bit E200Z4 CPU with a max clock frequency of 40 MHz, integrated cache, and AEC-Q100 screening. It operates b/w -40 °C to 105 °C, making it ideal for automotive applications. With 144 terminals and multiple connectivity options like CAN and Ethernet, it's perfect for advanced embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,995 parts In-Stock

1+ parts

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8,995

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Digiode

USA . 2,002 parts In-Stock

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2,002

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Anansix

USA . 1,835 parts In-Stock

1+ parts

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1,835

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,087 parts In-Stock

1+ parts

$14.100

100+ parts

-

1k+ parts

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1,087

$14.100

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IDEA Electronic Components Group

UK . 347 parts In-Stock

1+ parts

$17.912

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$16.121

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347

$17.912

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$16.121

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MKK Technologies

India . 1,334 parts In-Stock

1+ parts

$33.683

100+ parts

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1,334

$33.683

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DigiPath Technology Company

USA . 1,334 parts In-Stock

1+ parts

$33.683

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1,334

$33.683

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Microchip USA

USA . 2,759 parts In-Stock

1+ parts

$41.757

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2,759

$41.757

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Corphita

USA . 4,351 parts In-Stock

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4,351

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Parana Technologies

USA . 740 parts In-Stock

1+ parts

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$21.417

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740

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$21.417

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Overview

Unlock unparalleled performance with STMicroelectronics' SPC584B60E5EDC0X microcontroller, designed for robust applications demanding high reliability and efficiency. Leveraging advanced technology and AEC-Q100 screening, this versatile solution excels in automotive and industrial settings, ensuring seamless connectivity and superior processing capabilities. Experience enhanced energy savings and design flexibility, empowering your projects to thrive in even the toughest environments. Choose quality; choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability, making it suitable for various applications.

Integrated Cache: YES

The presence of an integrated cache improves performance by speeding up data access, thus enhancing overall efficiency.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration into modern electronics.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage ensures energy efficiency, making it ideal for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for efficient data processing for applications that don't require wider bandwidth.

Screening Level: AEC-Q100

Meets AEC-Q100 standards, indicating suitability for automotive applications where reliability is critical.

Package Shape: SQUARE

Square package geometry is common and allows for easy layout considerations in PCB design.

Bit Size: 32

A 32-bit architecture supports advanced processing capabilities and larger data handling for complex applications.

No. of Terminals: 144

A high number of terminals provides flexibility for extensive peripheral connections, enhancing functionality.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Versatile packaging style allows for effective heat dissipation, crucial for maintaining performance in high-load conditions.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage supports low-power operation, extending battery life in portable applications.

Maximum Operating Temperature: 105 °C

The capability to operate at high temperatures makes this microcontroller suitable for industrial applications.

CPU Family: E200Z4

The E200Z4 family signifies a reliable and optimized architecture for performance-critical applications.

Minimum Operating Temperature: -40 °C

Extreme operational temperature range ensures functionality in harsh environments, such as automotive and industrial settings.

ADC Channels: YES

Analog-to-Digital converters enable precise data acquisition from sensors, enhancing the microcontroller's capability.

DMA Channels: YES

With DMA channels, the microcontroller can transfer data without CPU intervention, improving processing efficiency.

Terminal Position: QUAD

Quad terminal position allows for efficient connections on a PCB, facilitating better routing and design flexibility.

ROM Words: 1048576

A large ROM capacity enables the storage of complex programs and algorithms, suitable for advanced applications.

Maximum Seated Height: 1.2 mm

A low height ensures compatibility with compact devices and enables efficient space utilization.

Width: 20 mm

The standardized width makes it easy to fit in various PCB designs and integrates with existing systems.

Data EEPROM Size: 64K

Sufficient EEPROM for storing critical user settings or configuration data, enhancing functionality and customization.

Boundary Scan: YES

Boundary scan capability provides enhanced testing and debugging options, improving reliability during production.

Peripherals: DMA(64), RTC, TIMER(8), WDT(2)

Rich peripheral integration enhances functionality, offering multiple timing and data handling solutions.

Maximum Clock Frequency: 40 MHz

A high clock frequency ensures fast processing speeds, making it suitable for time-sensitive applications.

Length: 20 mm

Standard length allows for compatibility with various PCB layouts without requiring significant redesign.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture contributes to efficient instruction execution, improving performance in resource-constrained applications.

RAM Bytes: 131072

Ample RAM size supports memory-intensive applications, allowing for smoother multitasking and computation.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making it ideal for portable applications.

Terminal Form: GULL WING

Gull wing terminals simplify soldering processes, ensuring good electrical connectivity and ease of assembly.

Analog To Digital Converters: 3-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADC channels with high resolution facilitate accurate sensor data acquisition for diverse applications.

Maximum Supply Current: 55 mA

Limited current draw enhances energy efficiency, making the product suitable for battery-operated devices.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage characteristic of modern electronics, promoting low power consumption and efficiency.

No. of DMA Channels: 64

A large number of DMA channels enables effective data transfer capabilities, optimizing CPU performance.

No. of Serial I/Os: 23

A significant number of serial I/Os supports versatile communication options, essential for networking applications.

PWM Channels: YES

PWM channels allow for precise control over motor speeds and other applications requiring modulation.

Connectivity: CAN(8), DSPI(7), ETHERNET, I2C, LIN(14)

Diverse connectivity options ensure compatibility with various devices and networks, ideal for complex systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and customization of applications, providing flexibility throughout the product's lifecycle.

Terminal Pitch: 0.5 mm

A fine pitch allows for high-density design, essential for compact and modern electronic device layouts.

Format: FLOATING POINT

Support for floating-point operations boosts performance in applications requiring complex mathematical calculations.

Speed: 120 rpm

Moderate speed rating can be suitable for motion control applications and various low-speed peripherals.

Low Power Mode: YES

Low power mode extends the battery life in portable devices, enhancing energy efficiency and durability.

On Chip Program ROM Width: 8

An 8-bit program ROM width enables efficient data processing without unnecessary complexity, well-suited for basic applications.

Technical Specifications

Microcontrollers SPC584B60E5EDC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of Serial I/Os:

23

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(8), DSPI(7), ETHERNET, I2C, LIN(14)

Peripherals:

DMA(64), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

3-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584B60E5EDC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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