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SPC574S60E3CE0AY

STMicroelectronics

SPC574S60E3CE0AY by STMicroelectronics

SPC574S60E3CE0AY by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features ADC, DMA, and PWM channels, making it ideal for automotive applications. Its compact flatpack design ensures efficient integration in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,874 parts In-Stock

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4,874

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Digiode

USA . 4,750 parts In-Stock

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4,750

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Anansix

USA . 1,751 parts In-Stock

1+ parts

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1,751

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 299 parts In-Stock

1+ parts

$10.320

100+ parts

-

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299

$10.320

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Vigor

Singapore . 1,306 parts In-Stock

1+ parts

$11.620

100+ parts

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1,306

$11.620

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Microchip USA

USA . 1,345 parts In-Stock

1+ parts

$17.079

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1,345

$17.079

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IDEA Electronic Components Group

UK . 1,713 parts In-Stock

1+ parts

$21.684

100+ parts

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$19.516

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1,713

$21.684

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$19.516

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MKK Technologies

India . 430 parts In-Stock

1+ parts

$40.776

100+ parts

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430

$40.776

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DigiPath Technology Company

USA . 430 parts In-Stock

1+ parts

$40.776

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430

$40.776

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Corphita

USA . 3,413 parts In-Stock

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3,413

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Parana Technologies

USA . 1,964 parts In-Stock

1+ parts

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100+ parts

$25.927

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1,964

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$25.927

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Overview

Unlock the potential of your next project with the SPC574S60E3CE0AY microcontroller from STMicroelectronics—where reliability meets innovation. Renowned for their quality and cutting-edge technology, STMicroelectronics delivers a powerhouse that enhances performance in automotive and industrial applications. With its compact design and robust features, this microcontroller ensures smooth operation, empowering you to create smarter solutions that stand out in any market. Choose SPC574S60E3CE0AY and elevate your designs today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for space-efficient integration on PCBs, making it ideal for compact applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can work reliably with standard 5 V power supplies while allowing for some voltage fluctuation.

Address Bus Width: 32

A 32-bit address bus width enhances the memory addressing capability, allowing for larger memory access and improved processing performance.

Package Shape: SQUARE

The square package shape is advantageous for layout efficiency, especially in designs with limited space.

Bit Size: 32

A 32-bit architecture allows for high processing power and capability to handle more complex computations and data in a single cycle.

No. of Terminals: 100

With 100 terminals, this microcontroller can support numerous peripherals and complex interfacing options, making it versatile for various applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style enables efficient heat dissipation and allows for high-density mounting, perfect for performance-critical applications.

Minimum Supply Voltage: 4.5 V

The acceptable minimum supply voltage of 4.5 V ensures stability and flexibility in power source options, accommodating battery integrations.

ADC Channels: YES

Integrated ADC channels enhance the microcontroller's ability to interface with analog sensors, making it suitable for diverse applications in control systems.

DMA Channels: YES

Direct Memory Access (DMA) support allows for efficient data handling and processing, freeing the CPU for other tasks and improving performance.

Terminal Position: QUAD

Quad terminal positioning facilitates easier routing and connection in PCB designs, contributing to a more manageable assembly process.

Width: 14 mm

A compact width of 14 mm is suitable for space-constrained projects, helping to minimize the board area required.

External Data Bus Width: 32

A 32-bit external data bus width increases data throughput capabilities, enabling faster communication with external devices.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz ensures robust performance for demanding applications, supporting complex algorithms and real-time processing.

Length: 14 mm

Similar to its width, the 14 mm length supports compact designs, essential for modern electronic devices with limited space.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from simplified instruction sets, leading to higher performance and lower power consumption.

Terminal Form: GULL WING

Gull wing terminals provide better mechanical stability during soldering, ensuring a strong, reliable connection on the PCB.

Nominal Supply Voltage: 5 V

Designed to operate at a nominal supply voltage of 5 V, this microcontroller is compatible with most common electronic designs and power supplies.

PWM Channels: YES

PWM channels facilitate precise control of motors and actuators, making this microcontroller a strong choice for embedded control applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density interfacing, enabling more connections within a smaller footprint.

Speed: 140 rpm

While this specification may typically relate to motors, a speed relevant to driven applications signifies integration opportunities for dynamic controls.

No. of I/O Lines: 79

Having 79 I/O lines equips this microcontroller with the capacity to manage multiple inputs and outputs, making it ideal for complex systems requiring various sensors and actuators.

Technical Specifications

Microcontrollers SPC574S60E3CE0AY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

79

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

140 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC574S60E3CE0AY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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