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SPC572L64F2BC6AY

STMicroelectronics

SPC572L64F2BC6AY by STMicroelectronics

SPC572L64F2BC6AY from STMicroelectronics is a 32-bit microcontroller designed for automotive applications. It operates at a nominal voltage of 5V, features ADC and DMA channels, and supports a max clock frequency of 40 MHz. Its compact flatpack design ensures efficient integration in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,870 parts In-Stock

1+ parts

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11,870

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Anansix

USA . 2,187 parts In-Stock

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2,187

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Digiode

USA . 1,258 parts In-Stock

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1,258

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,879 parts In-Stock

1+ parts

$8.980

100+ parts

-

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2,879

$8.980

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AZTECH Wire

Italy . 879 parts In-Stock

1+ parts

$13.290

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879

$13.290

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Microchip USA

USA . 3,115 parts In-Stock

1+ parts

$28.690

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3,115

$28.690

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IDEA Electronic Components Group

UK . 1,781 parts In-Stock

1+ parts

$54.573

100+ parts

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$49.115

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1,781

$54.573

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$49.115

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MKK Technologies

India . 2,130 parts In-Stock

1+ parts

$102.620

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2,130

$102.620

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DigiPath Technology Company

USA . 2,130 parts In-Stock

1+ parts

$102.620

100+ parts

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2,130

$102.620

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Corphita

USA . 1,370 parts In-Stock

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1,370

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Parana Technologies

USA . 133 parts In-Stock

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100+ parts

$65.250

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133

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$65.250

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Overview

Unlock unparalleled performance with the SPC572L64F2BC6AY microcontroller from STMicroelectronics—your partner in innovation. Renowned for precision and reliability, STMicroelectronics empowers your designs with a versatile solution ideal for automotive, industrial, and consumer applications. This compact powerhouse excels in efficiency, reducing energy consumption while boosting processing capabilities. Elevate your projects with quality you can trust and experience the seamless integration that drives your success!

Feature Benefit Bullets

Surface Mount: YES

This surface mount capability allows for compact design and easy integration into modern electronics, making it suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources, enhancing flexibility in design.

Package Shape: SQUARE

The square package shape allows for uniform thermal distribution and simplifies board layout, which can improve performance stability.

Bit Size: 32

With a 32-bit architecture, this microcontroller provides enhanced processing power for demanding applications, enabling faster and more efficient data handling.

No. of Terminals: 80

Having 80 terminals allows for greater connectivity options, which is ideal for complex applications requiring multiple interfaces.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The low-profile, fine-pitch design is advantageous for high-density mounting, catering to advanced designs while maintaining thermal performance with a possible heat sink.

Minimum Supply Voltage: 4.5 V

Operating at a minimum supply voltage of 4.5V allows for battery-efficient designs, making it suitable for portable or battery-powered applications.

ADC Channels: YES

Inclusion of ADC channels enables precise analog signal processing, which is essential for applications involving sensor data refinement and monitoring.

DMA Channels: YES

Having DMA channels enhances data transfer efficiency by allowing peripherals to communicate directly with memory, thus freeing up CPU resources for other tasks.

Terminal Position: QUAD

Quad terminal positioning facilitates easier PCB routing and soldering, ensuring reliable connections and reducing manufacturing complexities.

Width: 10 mm

A compact width of 10 mm supports dense designs and is compatible with small form factor devices for space-sensitive applications.

Maximum Clock Frequency: 40 MHz

With a maximum clock frequency of 40 MHz, this microcontroller can execute commands quickly, improving overall application responsiveness.

Length: 10 mm

A length of 10 mm contributes to a compact footprint, making it a strong candidate for applications where size is a critical consideration.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it provides high instruction throughput and efficiency, making it suitable for performance-critical tasks.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and provides good mechanical stability, which is beneficial for assembly reliability.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V makes it compatible with common power sources, simplifying design choices and reducing component count.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch is ideal for high-density applications, allowing for more compact designs and efficient use of PCB space.

Speed: 80 rpm

Operating at a speed of 80 rpm indicates the microcontroller can manage tasks effectively, making it suitable for applications involving motor control or automation.

Technical Specifications

Microcontrollers SPC572L64F2BC6AY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of Terminals:

80

PWM Channels:

NO

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

80 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

SPC572L64F2BC6AY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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