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SPC570S50E3CEFAY

STMicroelectronics

SPC570S50E3CEFAY by STMicroelectronics

SPC570S50E3CEFAY by STMicroelectronics is a 32-bit microcontroller designed for high-performance applications. It operates at a nominal voltage of 3.3V, features 100 terminals, and supports ADC and DMA channels. Ideal for automotive and industrial control systems, it offers a max clock frequency of 40 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

10,659

-

-

-

-

Digiode

USA . 4,497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,497

-

-

-

-

Anansix

USA . 1,088 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,088

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,090 parts In-Stock

1+ parts

$7.980

100+ parts

-

1k+ parts

-

10k+ parts

-

1,090

$7.980

-

-

-

AZTECH Wire

Italy . 115 parts In-Stock

1+ parts

$22.220

100+ parts

-

1k+ parts

-

10k+ parts

-

115

$22.220

-

-

-

Microchip USA

USA . 188 parts In-Stock

1+ parts

$25.597

100+ parts

-

1k+ parts

-

10k+ parts

-

188

$25.597

-

-

-

IDEA Electronic Components Group

UK . 336 parts In-Stock

1+ parts

$33.163

100+ parts

-

1k+ parts

$29.847

10k+ parts

-

336

$33.163

-

$29.847

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$58.468

100+ parts

$53.206

1k+ parts

$47.944

10k+ parts

-

2,000

$58.468

$53.206

$47.944

-

MKK Technologies

India . 36 parts In-Stock

1+ parts

$62.361

100+ parts

-

1k+ parts

-

10k+ parts

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36

$62.361

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-

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DigiPath Technology Company

USA . 36 parts In-Stock

1+ parts

$62.361

100+ parts

-

1k+ parts

-

10k+ parts

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36

$62.361

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-

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Parana Technologies

USA . 1,973 parts In-Stock

1+ parts

-

100+ parts

$39.652

1k+ parts

-

10k+ parts

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1,973

-

$39.652

-

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Corphita

USA . 809 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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809

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Overview

Unlock your project's potential with the SPC570S50E3CEFAY from STMicroelectronics, a trusted leader in innovative microcontroller solutions. This 32-bit marvel delivers exceptional performance and reliability, ensuring seamless integration into automotive, industrial, and consumer applications. Experience enhanced efficiency, flexibility, and robust processing power that empowers your designs, transforming ideas into reality while enjoying the peace of mind that comes with ST’s commitment to quality and excellence.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for a compact circuit layout, enabling efficient space utilization in modern electronic devices.

Maximum Supply Voltage: 3.63 V

A maximum supply voltage of 3.63 V provides flexibility in power source options, accommodating various battery and power supply configurations.

Package Shape: SQUARE

The square package shape facilitates straightforward PCB layout and offers a balanced thermal performance, making it suitable for diverse applications.

Bit Size: 32

The 32-bit architecture allows for enhanced processing power and the ability to handle complex computations more efficiently than 8-bit or 16-bit systems.

No. of Terminals: 100

With 100 terminals, this microcontroller can support a variety of peripheral connections, enhancing its versatility across different projects.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This diverse package style enhances compatibility with various PCB layouts and improves heat dissipation, ensuring reliable performance.

Minimum Supply Voltage: 2.97 V

The low minimum supply voltage allows this microcontroller to operate effectively in low-power environments, extending battery life in portable applications.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface seamlessly with analog sensors, expanding its application scope in data acquisition tasks.

DMA Channels: YES

DMA channels improve data transfer efficiency by allowing peripherals to transfer data without CPU intervention, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal positions provide efficient routing on PCB and support for high-density interconnections, beneficial for compact designs.

Width: 14 mm

A width of 14 mm allows for easy integration into standard PCB designs while maintaining a compact footprint.

Maximum Clock Frequency: 40 MHz

The 40 MHz maximum clock frequency enables fast processing speeds, crucial for time-sensitive applications and complex computations.

Length: 14 mm

With a length of 14 mm, this microcontroller maintains a compact profile suitable for space-constrained applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for optimized instruction execution and lower power consumption, benefiting performance and efficiency.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections, vital for high-quality PCB assembly.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V supports compatibility with many modern sensors and devices, enhancing integration options.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports high-density layouts, enabling more connections in smaller areas, which is essential for advanced systems.

Speed: 80 rpm

With a speed of 80 rpm, it ensures efficient operational capabilities in applications that require precise control mechanisms.

Technical Specifications

Microcontrollers SPC570S50E3CEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

14 mm

No. of Terminals:

100

PWM Channels:

NO

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

80 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC570S50E3CEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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