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SPC56EL70L5CBFY

STMicroelectronics

SPC56EL70L5CBFY by STMicroelectronics

SPC56EL70L5CBFY by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at up to 40 MHz. It features 262144 ROM words, 192 bytes of RAM, and supports ADC and DMA channels. Ideal for automotive applications due to its temperature grade and RISC technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,087 parts In-Stock

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4,087

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Anansix

USA . 2,141 parts In-Stock

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2,141

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Digiode

USA . 1,406 parts In-Stock

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1,406

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 976 parts In-Stock

1+ parts

$10.230

100+ parts

-

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976

$10.230

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IDEA Electronic Components Group

UK . 1,721 parts In-Stock

1+ parts

$31.885

100+ parts

-

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$28.697

10k+ parts

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1,721

$31.885

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$28.697

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Microchip USA

USA . 2,582 parts In-Stock

1+ parts

$36.422

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2,582

$36.422

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$55.880

100+ parts

$50.851

1k+ parts

$45.822

10k+ parts

-

1,000

$55.880

$50.851

$45.822

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MKK Technologies

India . 2,234 parts In-Stock

1+ parts

$59.958

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2,234

$59.958

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DigiPath Technology Company

USA . 2,234 parts In-Stock

1+ parts

$59.958

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2,234

$59.958

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Component Stockers USA

USA . 660 parts In-Stock

1+ parts

$99.990

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660

$99.990

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Corphita

USA . 2,243 parts In-Stock

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2,243

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Parana Technologies

USA . 2,143 parts In-Stock

1+ parts

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$38.124

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2,143

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$38.124

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Vigor

Singapore . 2,046 parts In-Stock

1+ parts

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2,046

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Overview

Discover the next level of performance and reliability with the SPC56EL70L5CBFY microcontroller by STMicroelectronics. With a focus on cutting-edge technology and innovation, STMicroelectronics sets the standard for excellence in microcontrollers. Ideal for automotive applications, this microcontroller offers unparalleled value with its advanced features and robust design. Trust in STMicroelectronics to deliver top-quality products that bring efficiency and precision to your projects. Elevate your work with the SPC56EL70L5CBFY microcontroller and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount design allows for easy installation and saves space on the PCB, making it ideal for compact designs.

Maximum Supply Voltage: 3.6 V

Operating within a maximum supply voltage of 3.6V ensures safe and reliable performance of the microcontroller.

Address Bus Width: 32

A wider address bus width of 32 bits allows for larger memory addressing capabilities, enabling more complex applications.

Package Shape: SQUARE

Square package shape provides a more uniform footprint on the PCB, making it easier to layout and design the circuit.

Bit Size: 32

A bit size of 32 allows for processing and handling of 32-bit data at a time, enhancing the microcontroller's performance.

Power Supplies (V): 3.3

Stable power supply of 3.3V ensures consistent and efficient operation of the microcontroller.

No. of Terminals: 144

Having 144 terminals provides flexibility for connecting various external components and peripherals, expanding the microcontroller's functionality.

Package Style (Meter): FLATPACK

Flatpack package style offers a low profile design, saving space and making the microcontroller suitable for thin devices.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3V, the microcontroller can operate reliably even under low power conditions.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125 °C makes the microcontroller suitable for automotive and industrial applications where high temperatures may be encountered.

CPU Family: E200Z4

The E200Z4 CPU family offers efficient processing power and performance, enhancing the overall capability of the microcontroller.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40 °C ensures the microcontroller can function in cold environments without any issues.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors and devices, increasing its application versatility.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory, reducing CPU workload and improving overall system performance.

Terminal Position: QUAD

Quad terminal position offers easier soldering and connectivity options, simplifying the assembly process of the microcontroller on the PCB.

ROM Words: 262144

With a ROM size of 262144 words, the microcontroller can store a large amount of program instructions, enabling complex applications to be implemented.

Width: 20 mm

Compact width of 20mm allows for easy integration of the microcontroller into space-constrained designs.

External Data Bus Width: 64

A wider external data bus width of 64 bits enables faster data transfer between the microcontroller and external memory, improving overall system performance.

Maximum Clock Frequency: 40 MHz

Operating at a maximum clock frequency of 40MHz allows the microcontroller to execute instructions quickly and handle real-time applications efficiently.

Length: 20 mm

With a length of 20mm, the microcontroller maintains a compact form factor suitable for small electronic devices.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means the microcontroller meets stringent requirements for reliability and performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture in the microcontroller's peripherals enhances processing speed and efficiency, making it a good choice for high-performance applications.

RAM Bytes: 192

192 bytes of RAM provide sufficient storage for data manipulation and temporary storage, supporting the execution of various tasks in the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and rework, ensuring a reliable connection between the microcontroller and the PCB.

Maximum Supply Current: 349 mA

Operating within a maximum supply current of 349mA ensures the microcontroller's power consumption is within safe limits, preventing overheating and damage.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures stable operation and compatibility with standard power sources, enhancing the microcontroller's usability.

PWM Channels: YES

Supporting PWM channels allows the microcontroller to generate accurate and variable signal outputs, making it suitable for motor control and power management applications.

ROM Programmability: FLASH

ROM programmable with flash technology enables easy reprogramming of the microcontroller's memory, allowing for firmware updates and customization.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the microcontroller offers high-density packaging, saving space on the PCB and enabling complex designs.

Speed: 120 rpm

Operating at a speed of 120rpm, the microcontroller provides fast and efficient processing capabilities for different applications and tasks.

No. of I/O Lines: 133

Having 133 I/O lines offers ample connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers SPC56EL70L5CBFY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

133

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

192

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

349 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC56EL70L5CBFY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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