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SPC56AP60L5CEFAR

STMicroelectronics

SPC56AP60L5CEFAR by STMicroelectronics

SPC56AP60L5CEFAR by STMicroelectronics is a 32-bit microcontroller with 32-bit external data bus width and max clock frequency of 40 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed processing and precise analog-to-digital conversion. Ideal for automotive systems, industrial control, and consumer electronics due to its advanced capabilities in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,767 parts In-Stock

1+ parts

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8,767

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Digiode

USA . 4,964 parts In-Stock

1+ parts

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-

1k+ parts

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4,964

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Anansix

USA . 1,503 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,503

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,997 parts In-Stock

1+ parts

$7.850

100+ parts

-

1k+ parts

-

10k+ parts

-

1,997

$7.850

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-

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AZTECH Wire

Italy . 227 parts In-Stock

1+ parts

$12.180

100+ parts

-

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10k+ parts

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227

$12.180

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Microchip USA

USA . 2,584 parts In-Stock

1+ parts

$25.103

100+ parts

-

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2,584

$25.103

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IDEA Electronic Components Group

UK . 1,745 parts In-Stock

1+ parts

$31.642

100+ parts

-

1k+ parts

$28.478

10k+ parts

-

1,745

$31.642

-

$28.478

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MKK Technologies

India . 2,247 parts In-Stock

1+ parts

$59.502

100+ parts

-

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10k+ parts

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2,247

$59.502

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DigiPath Technology Company

USA . 2,247 parts In-Stock

1+ parts

$59.502

100+ parts

-

1k+ parts

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2,247

$59.502

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Corphita

USA . 801 parts In-Stock

1+ parts

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801

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Parana Technologies

USA . 542 parts In-Stock

1+ parts

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100+ parts

$37.833

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542

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$37.833

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Overview

Enhance your electronic projects with the SPC56AP60L5CEFAR microcontroller from STMicroelectronics. Known for their top-quality components, STMicroelectronics brings you a reliable and efficient solution for your application needs. This microcontroller offers a wide range of features including ADC channels, DMA channels, PWM channels, and a high clock frequency of 40MHz. Whether you're working on automotive, industrial, or consumer electronics projects, this microcontroller provides the value, performance, and flexibility you need to bring your ideas to life. Trust STMicroelectronics to deliver superior products that exceed your expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this microcontroller suitable for mass production and compact designs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V provides flexibility and compatibility with various power sources, ensuring reliable performance.

Address Bus Width: 32

With a wide address bus width of 32, this microcontroller can access a large memory space, enabling complex and data-intensive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB real estate and easy integration into different board layouts.

Bit Size: 32

Having a 32-bit architecture provides high computational power and enhanced performance for demanding tasks.

No. of Terminals: 144

The abundant number of terminals (144) offers versatile connectivity options for peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style combination ensures a compact form factor, low profile design, and precise component placement, making the microcontroller suitable for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5 V enables power-efficient operation and extends the range of compatible power sources.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing and conversion, making the microcontroller suitable for sensor interfacing and data acquisition applications.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Position: QUAD

The quad terminal position provides stable and secure connectivity, enhancing the reliability of connections in various environmental conditions.

Width: 20 mm

With a width of 20 mm, this microcontroller offers a compact footprint, ideal for space-constrained designs.

External Data Bus Width: 32

A wide external data bus width of 32 enables efficient communication with external memory and peripherals, enhancing overall system throughput.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40 MHz allows for fast processing speeds, suitable for real-time applications and high-speed data processing.

Length: 20 mm

The 20 mm length complements the compact width, providing a square form factor that optimizes PCB layout and space utilization.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller enables efficient instruction execution and streamlined operation, enhancing overall system performance and responsiveness.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for various applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during PCB assembly, ensuring robust and reliable connections.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is a standard voltage level, ensuring compatibility with a wide range of power sources and simplifying design considerations.

PWM Channels: YES

The availability of PWM channels enables precise control of pulse-width modulation signals for applications such as motor control and LED dimming.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting and compact PCB design, suitable for miniaturized electronic devices.

Speed: 64 rpm

With a speed rating of 64 rpm, this microcontroller offers fast processing capabilities for time-critical applications and efficient task execution.

No. of I/O Lines: 106

The ample number of I/O lines (106) provides versatile connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's flexibility and functionality.

Technical Specifications

Microcontrollers SPC56AP60L5CEFAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

20 mm

No. of I/O Lines:

106

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC56AP60L5CEFAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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