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SPC56AP60L3BEFBY

STMicroelectronics

SPC56AP60L3BEFBY by STMicroelectronics

STMicroelectronics SPC56AP60L3BEFBY is a 32-bit microcontroller with 32-bit external data bus width and max clock frequency of 40 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed processing like automotive engine control units.

Median Price

$6.650

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$6.650

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$6.650

-

-

-

Vyrian

USA . 8,741 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,741

-

-

-

-

Digiode

USA . 3,116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,116

-

-

-

-

Anansix

USA . 1,652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,652

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$6.650

100+ parts

$6.318

1k+ parts

$6.002

10k+ parts

$5.918

100

$6.650

$6.318

$6.002

$5.918

Continental Prestige Electronics

USA . 3,699 parts In-Stock

1+ parts

$6.650

100+ parts

-

1k+ parts

-

10k+ parts

$6.517

3,699

$6.650

-

-

$6.517

Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$6.810

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$6.810

-

-

-

Corohmni

South Africa . 284 parts In-Stock

1+ parts

$7.236

100+ parts

-

1k+ parts

-

10k+ parts

-

284

$7.236

-

-

-

AZTECH Wire

Italy . 672 parts In-Stock

1+ parts

$13.267

100+ parts

-

1k+ parts

-

10k+ parts

-

672

$13.267

-

-

-

Ampacity Inc.

Singapore . 1,481 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,481

$18.000

-

-

-

Semicontronic

India . 1,118 parts In-Stock

1+ parts

$19.000

100+ parts

$18.525

1k+ parts

$18.430

10k+ parts

-

1,118

$19.000

$18.525

$18.430

-

Microchip USA

USA . 1,688 parts In-Stock

1+ parts

$23.264

100+ parts

-

1k+ parts

-

10k+ parts

-

1,688

$23.264

-

-

-

Aztec Data Supply Inc.

USA . 2,257 parts In-Stock

1+ parts

$42.830

100+ parts

-

1k+ parts

-

10k+ parts

-

2,257

$42.830

-

-

-

IDEA Electronic Components Group

UK . 1,249 parts In-Stock

1+ parts

$48.509

100+ parts

-

1k+ parts

$43.658

10k+ parts

-

1,249

$48.509

-

$43.658

-

MKK Technologies

India . 953 parts In-Stock

1+ parts

$91.218

100+ parts

-

1k+ parts

-

10k+ parts

-

953

$91.218

-

-

-

DigiPath Technology Company

USA . 953 parts In-Stock

1+ parts

$91.218

100+ parts

-

1k+ parts

-

10k+ parts

-

953

$91.218

-

-

-

Corphita

USA . 3,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,218

-

-

-

-

Argo Parts USA

USA . 2,779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,779

-

-

-

-

Parana Technologies

USA . 920 parts In-Stock

1+ parts

-

100+ parts

$58.000

1k+ parts

-

10k+ parts

-

920

-

$58.000

-

-

Overview

Unleash the power of innovation with the SPC56AP60L3BEFBY microcontroller by STMicroelectronics. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. With advanced features like ADC and DMA channels, PWM capabilities, and a high clock frequency of 40 MHz, this microcontroller delivers exceptional value to customers seeking top-notch quality and efficiency. Whether you're designing automotive systems, industrial equipment, or consumer electronics, the SPC56AP60L3BEFBY is the perfect choice to bring your ideas to life. Choose STMicroelectronics for unmatched excellence in microcontroller technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and lightweight designs, making it suitable for applications where space is limited.

Maximum Supply Voltage: 3.6 V

Supporting a maximum supply voltage of 3.6 V allows for flexibility in power supply options and compatibility with various systems.

Address Bus Width: 32

With a wide address bus width of 32 bits, this microcontroller can access a large memory space efficiently.

Package Shape: SQUARE

Square package shape provides even distribution of components and facilitates easier PCB layout and assembly.

Bit Size: 32

A 32-bit architecture enables higher processing capabilities and better performance for demanding applications.

No. of Terminals: 100

Having 100 terminals provides versatility in connectivity options and allows for interfacing with a wide range of peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for greater component density, improving overall system efficiency.

Minimum Supply Voltage: 1.8 V

Supporting a minimum supply voltage of 1.8 V enables operation in low-power scenarios, increasing energy efficiency.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making the microcontroller suitable for applications requiring sensor interfacing.

DMA Channels: YES

DMA channels provide efficient data transfer capabilities, reducing CPU load and improving system performance.

Terminal Position: QUAD

Quad terminal position offers easier soldering and connection options, enhancing overall reliability and ease of maintenance.

Width: 14 mm

A compact width of 14 mm allows for space-saving designs and integration into small form factor applications.

External Data Bus Width: 32

A 32-bit external data bus width enables high-speed data transfer and efficient communication with peripherals.

Maximum Clock Frequency: 40 MHz

Supporting a maximum clock frequency of 40 MHz provides high processing speed for real-time applications and quick response times.

Length: 14 mm

A length of 14 mm complements the compact width, allowing for a square form factor design and efficient use of PCB space.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripheral IC types enhances performance, efficiency, and compatibility with modern software development tools.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, making it suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections and ensures mechanical strength, suitable for harsh environments and high vibration applications.

Nominal Supply Voltage: 3 V

Having a nominal supply voltage of 3 V ensures compatibility with standard power sources and simplifies power management requirements.

PWM Channels: YES

Integrated PWM channels allow for precise control of digital signals, making the microcontroller ideal for applications requiring motor control or analog signal modulation.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5 mm enables high-density PCB designs, suitable for compact and miniaturized electronic devices.

Speed: 64 rpm

Operating at a speed of 64 rpm provides reliable and consistent performance for applications requiring precise timing and control.

No. of I/O Lines: 65

Having 65 I/O lines offers versatile input and output options, allowing for complex interfacing with external devices and sensors.

Technical Specifications

Microcontrollers SPC56AP60L3BEFBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56AP60L3BEFBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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