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SPC564A80L7COBR

STMicroelectronics

SPC564A80L7COBR by STMicroelectronics

SPC564A80L7COBR by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 80 MHz. Ideal for automotive applications, it features 34 ADC channels, DMA support, and connectivity options like CAN, FLEXRAY, LIN, SCI, and SPI. With a wide temperature range from -40 °C to 125°C and low profile design of 1.6mm seated height, it offers high performance in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,419 parts In-Stock

1+ parts

-

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3,419

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Vyrian

USA . 3,114 parts In-Stock

1+ parts

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3,114

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Anansix

USA . 1,693 parts In-Stock

1+ parts

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1,693

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 878 parts In-Stock

1+ parts

$8.780

100+ parts

-

1k+ parts

-

10k+ parts

-

878

$8.780

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Vigor

Singapore . 2,619 parts In-Stock

1+ parts

$18.710

100+ parts

-

1k+ parts

-

10k+ parts

-

2,619

$18.710

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Microchip USA

USA . 2,322 parts In-Stock

1+ parts

$24.247

100+ parts

-

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2,322

$24.247

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IDEA Electronic Components Group

UK . 358 parts In-Stock

1+ parts

$54.748

100+ parts

-

1k+ parts

$49.273

10k+ parts

-

358

$54.748

-

$49.273

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MKK Technologies

India . 14 parts In-Stock

1+ parts

$102.951

100+ parts

-

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14

$102.951

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DigiPath Technology Company

USA . 14 parts In-Stock

1+ parts

$102.951

100+ parts

-

1k+ parts

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14

$102.951

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QUARKTWIN TECHNOLOGY LTD

USA . 28,854 parts In-Stock

1+ parts

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28,854

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

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8,000

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Corphita

USA . 1,736 parts In-Stock

1+ parts

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1,736

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Parana Technologies

USA . 1,720 parts In-Stock

1+ parts

-

100+ parts

$65.460

1k+ parts

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1,720

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$65.460

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RC Electronics

USA . 986 parts In-Stock

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986

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Overview

Discover the cutting-edge SPC564A80L7COBR microcontroller by STMicroelectronics, a leader in the industry known for top-quality products. Ideal for automotive applications, this powerful device offers unparalleled performance and reliability. With advanced features like DMA channels, ADC channels, and PWM channels, this microcontroller provides seamless connectivity and efficient data processing. Trust STMicroelectronics to deliver innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the SPC564A80L7COBR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage allows for flexibility in power supply options.

Address Bus Width: 32

A wide address bus width allows for efficient data transfer and processing capabilities.

Package Shape: SQUARE

The square package shape helps in easy and compact PCB layout design.

Bit Size: 32

A 32-bit architecture provides enhanced computational power and performance.

No. of Terminals: 176

The large number of terminals offer greater connectivity options for peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style enables space-saving design and high-density mounting on the PCB.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in optimizing power consumption and efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the product to perform in extreme temperature conditions.

ADC Channels: YES

The presence of Analog to Digital Convertor channels allows for precise and accurate analog signal conversion.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and efficiency in handling data.

Terminal Position: QUAD

Quad terminal position provides stability and easy soldering during PCB assembly.

ROM Words: 1048576

The large ROM capacity allows for storing extensive program data and instructions.

Maximum Seated Height: 1.6 mm

Low seated height makes the product suitable for compact and slim device designs.

Width: 24 mm

Compact width size enables space-efficient PCB layout and design.

External Data Bus Width: 32

Wide external data bus width enhances data transfer speed and processing efficiency.

Peripherals: DMA(64), POR, TIMER(34)

The variety of peripherals enables versatile connectivity and functionality options for different applications.

Maximum Clock Frequency: 80 MHz

High clock frequency allows for fast and efficient data processing and operation.

Length: 24 mm

Compact length size facilitates space-saving PCB design and layout.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliability and performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller, providing enhanced control and processing capabilities for embedded applications.

RAM Bytes: 196608

Large RAM capacity allows for storing and processing a significant amount of data and instructions.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable soldering connections on the PCB.

Analog To Digital Convertors: 34-Ch 12-Bit

Multiple high-resolution ADC channels enable accurate analog signal conversion for precise control and sensing applications.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the product.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of analog output signals for various applications.

Connectivity: CAN(3), FLEXRAY, LIN, SCI(3), SPI(3)

Diverse connectivity options including CAN, FLEXRAY, LIN, SCI, and SPI enable seamless integration with external devices and networks.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick reprogramming of the device for firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB for efficient use of space.

Speed: 120 rpm

The specified speed parameter indicates the operational speed of the product, which is suitable for various applications.

On Chip Program ROM Width: 32

The on-chip program ROM width of 32 bits allows for storing and executing program instructions efficiently.

No. of I/O Lines: 120

A large number of Input/Output lines enable versatile connectivity options for interfacing with external devices and sensors.

Technical Specifications

Microcontrollers SPC564A80L7COBR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

No. of I/O Lines:

120

No. of Terminals:

176

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

196608

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), FLEXRAY, LIN, SCI(3), SPI(3)

Peripherals:

DMA(64), POR, TIMER(34)

Analog To Digital Convertors:

34-Ch 12-Bit

Trade Compliance

SPC564A80L7COBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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