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SPC564A80B4COBR

STMicroelectronics

SPC564A80B4COBR by STMicroelectronics

SPC564A80B4COBR by STMicroelectronics is a 32-bit microcontroller with 1048576 ROM words, 196608 RAM bytes, and 40-Ch 12-Bit ADC channels. Ideal for automotive applications, it offers connectivity options like CAN(3), FLEXRAY, LIN, SCI(3), SPI(3) and operates at a max clock frequency of 80 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,250 parts In-Stock

1+ parts

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6,250

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Digiode

USA . 3,484 parts In-Stock

1+ parts

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3,484

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Anansix

USA . 2,074 parts In-Stock

1+ parts

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2,074

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 904 parts In-Stock

1+ parts

$19.420

100+ parts

-

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904

$19.420

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Microchip USA

USA . 2,152 parts In-Stock

1+ parts

$30.527

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2,152

$30.527

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IDEA Electronic Components Group

UK . 798 parts In-Stock

1+ parts

$66.045

100+ parts

-

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$59.440

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798

$66.045

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$59.440

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MKK Technologies

India . 1,900 parts In-Stock

1+ parts

$124.193

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1,900

$124.193

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DigiPath Technology Company

USA . 1,900 parts In-Stock

1+ parts

$124.193

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1,900

$124.193

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QUARKTWIN TECHNOLOGY LTD

USA . 12,174 parts In-Stock

1+ parts

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12,174

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Corphita

USA . 4,784 parts In-Stock

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4,784

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Vigor

Singapore . 2,161 parts In-Stock

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2,161

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Parana Technologies

USA . 1,438 parts In-Stock

1+ parts

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100+ parts

$78.967

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1,438

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$78.967

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Overview

Unleash the power of innovation with the SPC564A80B4COBR microcontroller by STMicroelectronics. With a reputation for top-quality products, STMicroelectronics delivers cutting-edge solutions for a wide range of applications. From automotive to industrial, this microcontroller offers unparalleled performance and reliability. Experience seamless connectivity, advanced peripherals, and high-speed processing, all in a compact package. Elevate your projects with the SPC564A80B4COBR and stay ahead in today's fast-paced technological landscape. Choose STMicroelectronics for excellence in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and affordable for mass production.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for more flexibility in power supply options.

Bit Size: 32

32-bit architecture enables high processing capability and performance.

No. of Terminals: 324

Large number of terminals allows for versatile connectivity options and interfaces.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes the product suitable for various environments and applications.

ADC Channels: YES

Built-in analog to digital converters enable easy integration of analog sensors and signals.

DMA Channels: YES

Direct memory access channels enhance data transfer speed and efficiency.

ROM Words: 1048576

Large ROM capacity allows for storing a significant amount of program data and instructions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product combines processing, memory, and I/O capabilities in a single integrated chip.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall energy efficiency and reliability.

Analog To Digital Convertors: 40-Ch 12-Bit

Multiple analog to digital converters with high resolution provide accurate and precise conversion of analog signals.

Connectivity: CAN(3), FLEXRAY, LIN, SCI(3), SPI(3)

Wide range of connectivity options allow for seamless communication with external devices and networks.

Technical Specifications

Microcontrollers SPC564A80B4COBR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B324

Length:

23 mm

No. of I/O Lines:

120

No. of Terminals:

324

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

196608

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), FLEXRAY, LIN, SCI(3), SPI(3)

Peripherals:

DMA(64), POR, TIMER(34)

Analog To Digital Convertors:

40-Ch 12-Bit

Trade Compliance

SPC564A80B4COBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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